Electrically programmable resistor

1. A semiconductor device comprising:

a resistor including: a single doped body within a substrate, the single doped body and the substrate having opposite doping types,

wherein the substrate includes a p-type doped substrate region, and wherein the single doped body is doped n-type;

a trapped charge region adjacent to and in direct contact with the single doped body, such that the single doped body of the resistor is substantially parallel with the trapped charge region, wherein the single doped body substantially separates the trapped charge region from the substrate;

a source region and a drain region within the substrate, wherein the single doped body directly contacts the source region and the drain region within the substrate;

wherein the trapped charge region is structured to control a resistance of the single doped body by varying an amount of trapped charge in the trapped charge region, and wherein the single doped body is permanently doped independent of the amount of trapped charge in the trapped charge region.

2. The semiconductor device of claim 1 , wherein the trapped charge region includes a pair of silicon oxide layers having a silicon nitride layer therebetween, wherein the trapped charge is located within the silicon nitride layer.

3. The semiconductor device of claim 2 , further comprising a gate layer over an upper one of the silicon oxide layers.

4. The semiconductor device of claim 1 , wherein the trapped charge region includes a silicon oxide layer having a silicon nitride layer thereover, wherein the trapped charge is located within the silicon nitride layer.

5. The semiconductor device of claim 1 , wherein the trapped charge region includes at least one of silicon nitride and silicon oxide.

6. The semiconductor device of claim 1 , wherein the resistance of the single doped body is initially set at a value lower than a target resistance to be achieved by the trapped charge.

7. The semiconductor device of claim 1 , wherein the trapped charge region is without direct contact with the substrate.

8. The semiconductor device of claim 1 , wherein the substrate further includes:

at least one n-well isolation adjacent to the p-type doped substrate region; and

an n-type isolation region below the p-type doped substrate region.

9. The semiconductor device of claim 8 , wherein the n-type isolation region is a separate region from the at least one n-well isolation.

10. The semiconductor device of claim 9 , wherein the n-type isolation region directly contacts the p-type doped substrate region at a first portion of the p-type doped substrate region, and wherein the at least one n-well isolation directly contacts the p-type doped substrate region at a second portion of the p-type doped substrate region distinct from the first portion.