IP Library Granted Patent US 7,482,835
Granted Patent B1
US 7,482,835 · App. 11/552,482 · Granted Jan 27, 2009

Method and apparatus of memory clearing with monitoring RAM memory cells in a field programmable gated array

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Quick Facts
Patent No.
US 7,482,835
App. No.
11/552,482
Granted
Jan 27, 2009
Kind
B1
Abstract

A field-programmable gate array (FPGA) having an array of RAM memory cells comprising at least one row of RAM memory cells, each RAM cell of the at least one row of RAM memory cells coupled to a row driver line; a row decoder coupled to a first end of the row driver line of each at least one row of RAM memory cells. A monitoring memory cell is coupled to a row driver line. Each monitoring memory cell is also coupled to a memory writing line. An FPGA also has RAM memory cells that act as the programming mechanism. The FPGA further has erase circuitry for clearing the RAM memory cells for reprogramming of the FPGA. The FPGA is erased by providing at least one monitoring memory cell coupled to the erase circuitry. A memory clear phase is initiated on at least one monitoring memory cell. The monitoring memory cell then indicts the cell has been cleared.

Claims (17)

1. An integrated circuit including a field programmable gate array (FPGA), the FPGA comprising:

a plurality of FPGA tiles, each FPGA tile including a plurality of functional groups (FGs) arranged in rows and columns, each of the FGs being configurable to receive regular input signals, perform a logic operation, and generate regular output signals;

a regular routing structure in each FPGA tile coupled to the FGs and configurable to receive the regular output signals, route signals within the FPGA tile, and provide the regular input signals to the FGs;

a plurality of interface groups (IGs) surrounding the plurality of FGs in each FPGA tile such that one IG is positioned at each end of each row and column, each of the IGs being coupled to the regular routing structure and configurable to transfer signals from the regular routing structure to outside of each of FPGA tile, at least one IG for each FPGA tile coupled to at least one IG of at least one other FPGA tile, each of the IGs having a plurality of input multiplexers configurable to select signals received from outside of the FPGA tile and provide signals to the regular routing structure inside the tile; and

a plurality of input/output pads (I/Os) coupled to at least one of said input multiplexers of at least one of said IGs.

2. The integrated circuit of claim 1 , wherein each of the IGs further comprises a plurality of output multiplexers configured to select signals received from the regular routing structure and provide the selected signals to outside of the FPGA tile.

3. The integrated circuit of claim 1 , wherein the apparatus further comprises a system-on-a-chip (SOC).

4. The integrated circuit of claim 1 , wherein each of the FGs further comprises: a multiplexer configured to select one of the regular output signals as an FG secondary routing signal.

5. The integrated circuit of claim 4 , wherein each FPGA tile further comprises a secondary routing structure that is independent of the regular routing structure and that is configured to select and route the FG secondary routing signal around the first FPGA tile.

6. The integrated circuit of claim 5 , wherein each of the IGs further comprises a multiplexer configured to select a signal received from outside of the FPGA tile as an IG secondary routing signal, wherein the secondary routing structure configured to select and route the IG secondary routing signal around the first FPGA tile.

7. The integrated circuit of claim 5 , wherein the secondary routing structure further comprises a secondary routing bus coupled to a secondary routing input of each FG.

8. The integrated circuit of claim 7 , wherein the secondary routing structure further comprises a plurality of first buses with a different first bus corresponding to each row of FGs and that is coupled to receive the FG secondary routing signal from each FG; a plurality of secondary multiplexers with at least one secondary multiplexer being coupled to each first bus to select a signal therefrom; and a plurality of buffers with a different buffer being coupled to each secondary multiplexer and having an output coupled to the secondary routing bus.

9. The integrated circuit of claim 1 wherein the integrated circuit is a system on a chip further including at least one other functional circuit component.

10. The integrated circuit of claim 9 wherein the at least one other functional circuit component comprises a microprocessor.

11. The integrated circuit of claim 9 wherein the at least one other functional circuit component comprises a read-only memory.

12. The integrated circuit of claim 9 wherein the at least one other functional circuit component comprises a random-access memory.

13. The integrated circuit of claim 9 wherein the at least one other functional circuit component comprises a microprocessor.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →