IP Library Granted Patent US 7,538,322
Granted Patent B2
US 7,538,322 · App. 11/556,198 · Granted May 26, 2009

Method of fabricating sample membranes for transmission electron microscopy analysis

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,538,322
App. No.
11/556,198
Granted
May 26, 2009
Kind
B2
Abstract

A method of fabricating sample lamella for transmission electron microscopy (TEM) analysis is provided. A waiting-examination sample having an analysis target on the top surface of that is offered, and at least a mark around the analysis target is defined. A covering layer is covered on the top surface of waiting-examination sample. A holder is attached on the covering layer. A backside polishing process is performed to remove a portion of the waiting-examination sample until the mark is visible under the optical microscopy from the bottom surface of waiting-examination sample. An in-situ lift-out step is performed to pick up a thin membrane containing the analysis target and serve as the sample for TEM analysis.

Claims (18)

1. A method of fabricating sample lamella for transmission electron microscopy (TEM) analysis, comprising:

providing a waiting-examination sample having an analysis target on a top surface thereof and at least a mark disposed around the analysis target;

forming a covering layer on the top surface of the waiting-examination sample;

forming a holder on the covering layer;

performing a backside polishing process to remove a portion of the waiting-examination sample until the mark is visible from the bottom surface of the waiting-examination sample under an optical microscope; and

performing an in-situ lift-out step to obtain a thin membrane containing the analysis target and the mark to serve as a sample membrane for TEM analysis.

2. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the covering layer comprises an epoxy layer, an oxide layer, a nitride layer, a silicon material layer, or a metal layer.

3. The method of fabricating sample lamella for TEM analysis as claimed in claim 2 , wherein the method of forming the covering layer on the top surface of the waiting-examination sample comprises performing a chemical vapor deposition (CVD) process or a coating process.

4. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the holder comprises a glass holder.

5. The method of fabricating sample lamella for TEM analysis as claimed in claim 4 , wherein the method of forming the holder on the covering layer comprises using an adhesive.

6. The method of fabricating sample lamella for TEM analysis as claimed in claim 5 , wherein the adhesive comprises epoxy.

7. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the process of forming the mark comprises using a dual beam FIB or laser.

8. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the mark comprises a groove.

9. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the backside polishing process comprises a mechanical polishing process.

10. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , wherein the in-situ lift-out step is performed in the dual beam FIB system.

11. The method of fabricating sample lamella for TEM analysis as claimed in claim 10 , further comprising a step of forming a protection layer on the bottom surface of the waiting-examination sample before performing the in-situ lift-out step.

12. The method of fabricating sample lamella for TEM analysis as claimed in claim 11 , wherein the passivation layer comprises platinum (Pt) or tungsten (W).

13. The method of fabricating sample lamella for TEM analysis as claimed in claim 1 , further comprising a step of performing a sample membrane thinning step after performing the in-situ lift-out step.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2006
From: LUO, JIAN-SHING; HUANG, LANG-YU
To: INOTERA MEMORIES, INC.
Reel/Frame 018492/0782 →