IP Library Granted Patent US 7,499,334
Granted Patent B2
US 7,499,334 · App. 11/583,625 · Granted Mar 3, 2009

Method and apparatus for discharging a memory cell in a memory device after an erase operation

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Quick Facts
Patent No.
US 7,499,334
App. No.
11/583,625
Granted
Mar 3, 2009
Kind
B2
Abstract

A method and apparatus for discharging a memory cell in a memory device. In one implementation, the memory cell includes a capacitor having a first plate and a second plate, and the method includes initially discharging the first plate of the capacitor through a first discharge circuit and discharging the second plate of the capacitor through a second discharge circuit. After the initial discharge, the method further includes completely discharging the first plate of the capacitor and the second plate of the capacitor by coupling both the first plate of the capacitor and the second plate of the capacitor to ground.

Claims (35)

1. A method for discharge in a memory device, the method comprising:

initiating a discharge of a memory cell after an erase operation;

coupling a first discharge circuit to a first plate of a first capacitor, and a second discharge circuit to a second plate of the first capacitor, wherein the first plate represents a common gate node of the memory cell and the second plate represents a bulk-source node of the memory cell versus ground; and

coupling the common gate node and the bulk-source node to ground to provide for a discharge.

2. The method of claim 1 , wherein a current injected into the first plate is approximately equal to a current extracted from the second plate.

3. The method of claim 1 , wherein the first capacitor is a gate-bulk capacitor.

4. The method of claim 3 , wherein the first plate of the gate-bulk capacitor is coupled to a second capacitor representing a capacitance of a gate node of the memory cell versus all other nodes except the bulk-source node.

5. The method of claim 4 , wherein the second plate of the gate-bulk capacitor is coupled to a third capacitor representing a capacitance of the bulk-source node versus all other nodes except a gate node.

6. The method of claim 1 , wherein the memory device is a flash memory device.

7. A method for discharging a memory cell in a memory device, the memory cell including a capacitor having a first plate and a second plate, the method comprising:

initially discharging the first plate of the capacitor through a first discharge circuit and discharging the second plate of the capacitor through a second discharge circuit, the first discharge circuit being separate from the second discharge circuit; and

after the initial discharge, completely discharging the first plate of the capacitor and the second plate of the capacitor by coupling both the first plate of the capacitor and the second plate of the capacitor to ground.

8. The method of claim 7 , wherein the first discharge circuit has a first node operable to be connected to the first plate and a second node connected to ground, the second discharge circuit has a first node operable to be connected to the second plate and a second node connected to ground.

9. The method of claim 8 , wherein discharging the first plate of the capacitor through a first discharge circuit and discharging the second plate of the capacitor through a second discharge circuit includes injecting a current into the first plate of the capacitor that is approximately equal to current extracted from the second plate of the capacitor.

10. The method of claim 8 , wherein the memory cell in the memory device is discharged after an erase operation in the memory cell.

11. The method of claim 10 , wherein the erase operation of the memory cell is performed using Fowler-Nordheim tunneling.

12. The method of claim 8 , wherein the capacitor is a gate-bulk capacitor and the first plate represents a common gate node of the memory cell and the second plate represents a bulk-source node of the memory cell.

13. The method of claim 8 , wherein the memory device is a flash memory device.

14. A memory device comprising:

a memory cell including a capacitor having a first plate and a second plate;

a first discharge circuit having a first node to be connected to the first plate and a second node connected to ground;

a second discharge circuit having a first node to be connected to the second plate and a second node connected to ground; and

a control circuit to discharge the capacitor after an erase operation of the memory cell by

initially discharging the first plate of the capacitor through the first discharge circuit by coupling the first node of the first discharge circuit to the first plate, and discharging the second plate of the capacitor through the second discharge circuit by coupling the first node of the second discharge circuit to the first plate; and

after the initial discharge, the control circuit to completely discharge the first plate of the capacitor and the second plate of the capacitor by coupling both the first plate of the capacitor and the second plate of the capacitor to ground.

15. The memory device of claim 14 , wherein during the initial discharge the first discharge circuit and the second discharge circuit keep current injected into the first plate approximately equal to current extracted from the second plate.

16. The memory device of claim 14 , wherein the erase operation of the memory cell is performed using Fowler-Nordheim tunneling.

17. The memory device of claim 14 , wherein the capacitor is a gate-bulk capacitor and the first plate represents a common gate node of the memory cell and the second plate represents a bulk-source node of the memory cell.

18. The memory device of claim 17 , wherein the memory device is a flash memory device.

19. A memory device discharge method, comprising:

initiating a discharge of a memory cell after an erase operation including discharging a first plate of a capacitor through a first discharge circuit and discharging a second plate of the capacitor through a second discharge circuit different than the first discharge circuit, wherein the first plate represents a common gate node of the memory cell and the second plate represents a bulk-source node of the memory cell versus ground; and

coupling the common gate node and the bulk-source node to ground to provide for a further discharge.

20. The method of claim 19 , wherein initiating a discharge of a memory cell comprises injecting a current into the first plate of the capacitor that is approximately equal to a current extracted from the second plate of the capacitor.

21. The method of claim 19 , wherein initiating a discharge of a memory cell comprises implementing the erase operation using Fowler-Nordheim tunneling.

22. The method of claim 19 , comprising providing a flash memory device that includes at least one memory cell.

Assignments (18)
SECURITY INTEREST Recorded Nov 10, 2025
From: FEMASYS, INC.
To: POINTILLIST GLOBAL MACRO SERIES OF POINTILLIST PARTNERS LLC
Reel/Frame 072842/0487 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 15, 2007
From: BEDARIDA, LORENZO; ODDONE, GIORGIO; BARTOLI, SIMONE; MANFRE', DAVIDE
To: ATMEL CORPORATION
Reel/Frame 019296/0977 →