IP Library Granted Patent US 7,263,761
Granted Patent B1
US 7,263,761 · App. 11/609,165 · Granted Sep 4, 2007

Method for making a high current low profile inductor

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Quick Facts
Patent No.
US 7,263,761
App. No.
11/609,165
Granted
Sep 4, 2007
Kind
B1
Abstract

A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. The inductor coil is formed from a flat plate which is cut into a sine-shaped configuration and then is folded in accordion fashion to create a helical coil.

Claims (20)

1. A method for making a high current low profile inductor comprising:

forming an inductor element comprising a coil having and open center and an outside surface, the coil also having first and second coil ends;

making a dry mixture comprising a dry resin and an insulated dry powdered magnetic powder;

compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface;

the compressing step being done at least at a pressure of 15 tons per square inch.

2. The method according to claim 1 wherein the compressing step is done at from 15 tons per square inch to 25 tons per square inch.

3. The method according to claim 1 wherein a filler and a lubricant are added to the mixture before the compressing step is started.

4. A method for making a high current low profile inductor comprising:

forming an inductor element comprising a coil having and open center and an outside surface, the coil also having first and second coil ends;

insulating a dry magnetic iron powder;

making a dry mixture comprising a dry resin and a dry insulated magnetic iron powder;

compressing the mixture in a single step while the mixture is dry around the outside surface of the coil and within the open center of the coil to create an inductor body, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface.

5. The method of claim 4 wherein the insulating step comprises using phosphoric acid.

6. The method of claim 4 and further comprising wetting the mixture of resin and iron powder and then drying the wetted mixture before the compressing step; and screening the mixture to a predetermined particle size after the drying step and before the compressing step.

7. The method of claim 6 and further comprising screening the mixture to a particle size of −50 mesh.

8. A method for making a high current low profile inductor comprising:

forming an inductor element comprising a coil having and open center and an outside surface, the coil also having first and second coil ends;

making a dry mixture comprising a dry resin and an insulated dry powdered magnetic powder;

compressing the dry mixture around the outside surface of the coil and within the open center of the coil to create an inductor body without liquefying the dry mixture, whereby the inductor body engages the coil both within the coil open center and also the coil outside surface;

baking the compressed inductor body, whereby the baked inductor body is self shielding, has a high resistivity exceeding 3 mega ohms, operates up to 1 MHz, and yields a low DC resistance to inductance ratio of two milliohms per micro Henry.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →