IP Library Granted Patent US 7,385,421
Granted Patent B2
US 7,385,421 · App. 11/748,865 · Granted Jun 10, 2008

Block symmetrization in a field programmable gate array

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Quick Facts
Patent No.
US 7,385,421
App. No.
11/748,865
Granted
Jun 10, 2008
Kind
B2
Abstract

An FPGA architecture has top, middle and low levels. The top level is an array of B16×16 tiles enclosed by I/O blocks. The routing resources in the middle level are expressway routing channels including interconnect conductors. At the lowest level, there are block connect routing channels, local mesh routing channels, and direct connect interconnect conductors to connect the logic elements to further routing resources. Each B 1 block includes four clusters of devices. Each of the clusters includes first and second LUT 3 s, a LUT 2 , and a DFF. Each of the LUT 3 s have three inputs and one output. Each of the LUT 2 s have two inputs and one output. Each DFF has a data input and a data output. In each of the clusters the outputs of the LUT 3 s are multiplexed to the input of DFF, and symmetrized with the output of the DFF to form two outputs of each of the clusters.

Claims (17)

1. A hierarchical interconnect architecture for a field programmable gate array integrated circuit including a plurality of logic function blocks, the architecture including:

a first level including a plurality of first groups of functional logic blocks at a first level, each first group spanning a first length and a first width, the first level including a set of first routing resources;

a second level including a plurality of second groups of functional logic blocks at a second level, the number of functional logic blocks in the second groups greater than the number of functional logic blocks in the first groups, each second group spanning a second length and a second width, the second level including a set of second routing resources;

a third level including a plurality of third groups of functional logic blocks at a third level, the number of functional logic blocks in the third groups greater than the number of functional logic blocks in the second groups, each third group spanning a third length and a third width, the third level including a set of third routing resources;

wherein the set of first routing resources includes:

a block connect routing channel including a plurality of interconnect conductors configured to make programmable connections between different ones of the functional logic blocks in the second group and to interconnect conductors in the set of second routing resources;

a local mesh routing channel including a plurality of interconnect conductors configured to make programmable connections between adjacent ones of the functional logic blocks in a single one of the first groups of the functional logic blocks;

a direct connect routing channel including a plurality of interconnect conductors configured to make programmable connections between selected elements of adjacent ones of the functional logic blocks in a single one of the first groups of the functional logic blocks;

wherein the set of second routing resources includes a plurality of expressway routing channels including a plurality of interconnect conductors configured to make programmable connections between different ones of the functional logic blocks in the second group and to interconnect conductors in the set of third routing resources;

wherein the set of third routing resources includes a plurality of freeway routing channels associated with each third group of functional logic blocks, each freeway routing channel associated with one of the third groups including a plurality of interconnect conductors configured to make programmable connections to functional logic blocks in other ones of the third groups; and

wherein programmable connections are made using reprogrammable elements.

2. The hierarchical interconnect architecture of claim 1 wherein the reprogrammable elements are SRAM switches.

3. The hierarchical interconnect architecture of claim 1 wherein the programmable connections between ones of the third group of functional logic blocks are made in a plurality of first programmable matrices of reprogrammable switches.

4. The hierarchical interconnect architecture of claim 1 wherein the interconnect conductors in the plurality of freeway routing channels have a length substantially equal to one of the third length and the third width.

5. The hierarchical interconnect architecture of claim 1 wherein programmable connections between different ones of the functional logic blocks in the second group and to interconnect conductors in the set of third routing resources are made in a plurality of second programmable matrices of reprogrammable switches.

6. The hierarchical interconnect architecture of claim 1 wherein programmable connections between different ones of the functional logic blocks in the second group and to interconnect conductors in the set of second routing resources are made in a plurality of third programmable matrices of reprogrammable switches.

7. The hierarchical interconnect architecture of claim 1 wherein the plurality of interconnect conductors configured to make programmable connections between selected elements of adjacent ones of the functional logic blocks in a single one of the first groups of the functional logic blocks to implement data path functions including counters, comparators, adders, and multipliers.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →