Granted Patent B2

US 7,884,457 · App. 11/768,640 · Granted Feb 8, 2011

Abstract

Claims (23)

1. A method for manufacturing an integrated circuit package system comprising:

mounting an integrated circuit die having a non-active side and an active side over a bottom connection structure with the non-active side facing the bottom connection structure;

connecting the integrated circuit die with the bottom connection structure;

placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed;

placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure and facing the active side of the integrated circuit die;

connecting a package substrate with the bottom connection structure mounted thereover;

connecting the package substrate with the top connection structure;

forming, a package encapsulation having a recess with the recess exposing a portion of the top connection structure; and

mounting a first device structure over the top connection structure in the recess.

2. The method as claimed in claim 1 further comprising:

connecting the package substrate with a second device structure mounted thereover; connecting the second device structure with the bottom connection structure mounted thereover.

3. An integrated circuit package system comprising:

a bottom connection structure;

an integrated circuit die having a non-active side and an active side over the bottom connection structure with the non-active side facing the bottom connection structure, the integrated circuit die connected with the bottom connection structure;

an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed;

a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure;

a package substrate connected with the bottom connection structure mounted thereover and connected with the top connection structure;

a package encapsulation having a recess with the recess exposing a portion of the top connection structure; and

a first device structure over the top connection structure in the recess.

4. The system as claimed in claim 3 further comprising: a backside adhesive attached with a non-active side of the integrated circuit die.

5. The system as claimed in claim 3 wherein the top connection structure over the adhesive encapsulation includes the top connection structure exposed by the adhesive encapsulation.

6. The system as claimed in claim 3 wherein the top connection structure over the adhesive encapsulation includes the top connection structure surrounded by the adhesive encapsulation with the top connection structure exposed.

7. The system as claimed in claim 3 further comprising: the package substrate connected with a second device structure mounted thereover and connected with the top connection structure; and the second device structure connected with the bottom connection structure mounted thereover.

Assignments (8)