Thin wafer insert
View Patent ↗A plastic insert is configured to provide support of thin wafers in wafer carriers configured to provide peripheral wafer support. The invention includes the insert, the insert in combination with a wafer carrier, and the methods of supporting the thin wafers as provided by the insert and the wafer carrier. The inserts, in preferred embodiments, utilize tabs that fit into the side wall recesses and have an interference fit in said recesses to secure the insert in place. In preferred embodiments the inserts have a top surface with a plurality of ribs positioned inwardly from the wafer periphery for supporting the wafers with minimal contact. In preferred embodiments the insert has a lower surface having strengthening structure providing rigidity to the insert. The top surface ribs may preferably be oriented parallel to the insertion and withdrawal direction of the wafers and extend upwardly to position the supported wafer in the slot immediately above the slot defined by the recesses in which the tabs are positioned. Thus, the inserts may be inserted into alternate slots in the carrier. The insert, in preferred embodiments may have an h-shape offering an optimal combination of support of each wafer and precise positioning of the wafer while minimizing the amount of plastic and correspondingly the weight of the insert.
1. In combination, a wafer carrier and insert received in the wafer carrier for supporting at least one thin wafer therein, the wafer carrier comprising an enclosure portion having at least a top, a bottom, a pair of opposing sides, and an open front, the opposing sides having a plurality of recess pairs defining a plurality of slots, the insert comprising a generally planar body presenting a periphery and an upper surface, a pair of recess engaging portions being defined in the periphery, each recess engaging portion including a plurality of outwardly extending spring tabs, the spring tabs engaged in one of the recess pairs of the wafer carrier so that the generally planar body of the insert is oriented parallel to the top and the bottom of the wafer carrier, wherein each of the plurality of spring tabs is biased against a surface within the recess pair, the direction of the bias of each spring tabs being generally perpendicular to the plane of the insert body and opposite the direction of bias of the immediately adjacent spring tab, the insert having a plurality of wafer supports adapted to receive and support the wafer thereon extending upwardly from the upper surface.
2. The carrier and insert of claim 1 , wherein the body of the insert has a bottom surface, and wherein the bottom surface includes at least one stiffening structure.