Selective thin metal cap process
View Patent ↗A method of creating metal caps on copper lines within an inter-line dielectric (ILD) deposits a thin (e.g., 5 nm) metal blanket film (e.g., Ta/TaN) on top the copper lines and dielectric, after the wafer has been planarized. Further a thin dielectric cap is formed over the metal blanket film. A photoresist coating is deposited over the thin dielectric cap and a lithographic exposure process is performed, but without a lithographic mask. A mask is not needed in this situation, because due to the reflectivity difference between copper and the ILD lying under the two thin layers, a mask pattern is automatically formed for etching away the Ta/TaN metal cap between copper lines. Thus, this mask pattern is self-aligned above the copper lines.
1. A method of forming metal caps over metal lines, said method comprising:
patterning a dielectric layer to form wire pattern recesses in said dielectric;
depositing liners within said wire pattern recesses;
depositing copper over said liners to fill said wire pattern recesses with copper lines;
planarizing a top of said dielectric and said copper lines;
depositing a metal blanket film on said dielectric and said copper lines;
depositing a photoresist on said dielectric cap;
blanket exposing all portions of said photoresist without using a mask;
developing and rinsing said photoresist to remove portions of said photoresist and leave patterned portions of said photoresist only over said copper lines; and
removing portions of said metal blanket film not positioned below said patterned portions of said photoresist to pattern said metal blanket film into metal caps above said copper lines.
2. The method according to claim 1 , wherein depositing of said metal blanket film is performed in a manner such that said metal blanket film is between 20 A and 500 A in thickness.
3. The method according to claim 1 , wherein said metal blanket film comprises at least one of Ta with TaNx passivation, Co with CoNx passivation, Ti with TiNx passivation, Ru with RuOx or RuNx passivation, Rh with RhOx or RhNx passivation, In with InOx or InNx passivation, and Ir with IrOx or IrNx passivation.
4. A method of forming metal caps over metal lines, said method comprising:
patterning a dielectric layer to form wire pattern recesses in said dielectric;
depositing liners within said wire pattern recesses;
depositing copper over said liners to fill said wire pattern recesses with copper lines;
planarizing a top of said dielectric and said copper lines;
depositing a metal blanket film on said dielectric and said copper lines in a manner such that said metal blanket film has a thickness less than 5 nm;
depositing a dielectric layer over said metal blanket film;
depositing a photoresist on said dielectric cap;
blanket exposing all portions of said photoresist without using a mask;
developing and rinsing said photoresist to remove portions of said photoresist and leave patterned portions of said photoresist only over said copper lines; and
removing portions of said metal blanket film not positioned below said patterned portions of said photoresist to pattern said metal blanket film into metal caps above said copper lines.
5. The method according to claim 4 , wherein depositing of said metal blanket film is performed in a manner such that said metal blanket film is between 20 A and 500 A in thickness.
6. The method according to claim 4 , wherein said metal blanket film comprises at least one of Ta with TaNx passivation, Co with CoNx passivation, Ti with TiNx passivation, and Ru with RuOx or RuNx passivation, Rh with RhOx or RhNx passivation, In with InOx or InNx passivation, and Ir with IrOx or IrNx passivation.