IP Library Granted Patent US 7,515,469
Granted Patent B1
US 7,515,469 · App. 11/862,436 · Granted Apr 7, 2009

Column redundancy RAM for dynamic bit replacement in FLASH memory

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Quick Facts
Patent No.
US 7,515,469
App. No.
11/862,436
Granted
Apr 7, 2009
Kind
B1
Abstract

A column redundancy system for a non-volatile memory includes a separate companion controller chip that includes a column redundancy RAM memory array for storing addresses of defective non-volatile memory cells. Column redundancy match logic provides a match output signal corresponding to a match of a particular user input address for the non-volatile memory with the address of a defective non-volatile memory cell, the collection of said addresses stored in the column redundancy RAM memory array. Column redundancy replacement logic, in response to a match output, dynamically substitutes correct data associated with a defective non-volatile memory cell into an I/O program or read data bit stream of the non-volatile memory chip.

Claims (37)

1. A column redundancy system for a non-volatile memory, the system comprising:

a separate companion controller chip for controlling operational modes of the non-volatile memory chip, the separate companion controller chip including a column redundancy RAM memory array for storing addresses of defective non-volatile memory cells;

column redundancy match logic configured to compare user input addresses for the non-volatile memory to addresses of defective non-volatile memory cells stored in a column redundancy RAM memory array and configured to provide a match output signal corresponding to a match of a particular user input address for the non-volatile memory with the address of a defective non-volatile memory cell stored in the column redundancy RAM memory array; and

column redundancy replacement logic, in response to a match output signal from the column redundancy match logic, configured to dynamically substitute correct data associated with a defective non-volatile memory cell into an I/O data bit stream of a non-volatile memory chip.

2. The column redundancy system of claim 1 wherein the column redundancy replacement logic includes column redundancy replacement logic configured to program the non-volatile memory with redundant data for defective non-volatile memory cells, said redundant data stored in redundant columns of the non-volatile memory; and

wherein the column redundancy replacement logic includes column redundancy replacement logic configured to read the non-volatile memory with redundant data for defective non-volatile memory cells, said redundant data stored in redundant columns of the non-volatile memory.

3. The column redundancy system of claim 1 wherein the column redundancy replacement logic, in response to a match output signal from the column redundancy match logic, substitutes correct data associated with a defective non-volatile memory cell into an I/O data bit stream of the non-volatile memory chip for a program mode of operation, a read mode of operation, and an erase mode of operation for the non-volatile memory chip.

4. The column redundancy system of claim 1 wherein the column redundancy match logic compares addresses for a portion of a memory data byte stored in the non-volatile memory.

5. The column redundancy system of claim 4 wherein the portion of a memory data byte stored in the non-volatile memory is a nibble.

6. The column redundancy system of claim 1 wherein the addresses stored in the redundancy RAM memory array of defective non-volatile memory cells are transferred from fused addresses of defective non-volatile memory cells, said addresses originally stored in the non-volatile memory chip.

7. The column redundancy system of claim 1 wherein the non-volatile memory chip is a FLASH memory chip.

8. The column redundancy system of claim 1 wherein each memory cell of the column redundancy RAM memory array includes an input transmission gate activated by a write command signal, a cross-coupled inverter latch configured to store a bit, and a gated output circuit that is activated by a read command signal.

9. A column redundancy system for a non-volatile memory, the system comprising:

a non-volatile memory chip providing an I/O data bit stream for programming data into or for reading data out of a non-volatile memory array that includes column redundancy fuses for storing addresses of defective non-volatile memory cells;

a separate companion controller chip configured to control operational modes of the non-volatile memory chip, the separate companion controller chip including a column redundancy RAM memory array for storing addresses of defective non-volatile memory cells;

column redundancy match logic configured to compare user input addresses for the non-volatile memory to the addresses of defective non-volatile memory cells stored in the column redundancy RAM memory array and configured to provide a match output signal corresponding to a match of a particular user input address for the non-volatile memory with the address of a defective non-volatile memory cell, the collection of said addresses stored in the column redundancy RAM memory array; and

column redundancy replacement logic, in response to a match output signal from the column redundancy match logic, configured to dynamically substitute correct data associated with a defective non-volatile memory cell into an I/O data bit stream of the non-volatile memory chip.

10. The column redundancy system of claim 9 wherein the column redundancy replacement logic includes column redundancy replacement logic for programming the non-volatile memory with redundant data for defective non-volatile memory cells, said redundant data stored in redundant columns of the non-volatile memory.

11. The column redundancy system of claim 9 wherein the column redundancy replacement logic includes column redundancy replacement logic for reading the non-volatile memory with redundant data for defective non-volatile memory cells, said redundant data stored in redundant columns of the non-volatile memory.

12. The column redundancy system of claim 9 wherein the column redundancy replacement logic, in response to a match output signal from the column redundancy match logic, substitutes correct data associated with a defective non-volatile memory cell into an I/O data bit stream of the non-volatile memory chip for a program mode of operation, a read mode of operation, and an erase mode of operation for the non-volatile memory chip.

13. The column redundancy system of claim 9 wherein the column redundancy match logic compares addresses for a portion of a memory data byte stored in the non-volatile memory.

14. The column redundancy system of claim 13 wherein the portion of a memory data byte stored in the non-volatile memory is a nibble.

15. The column redundancy system of claim 9 wherein the addresses stored in the redundancy RAM memory array of defective non-volatile memory cells are transferred from fused addresses of defective non-volatile memory cells originally stored in the non-volatile memory chip.

16. The column redundancy system of claim 9 wherein the non-volatile memory chip is a FLASH memory chip.

17. A method of providing column redundancy for a non-volatile memory chip, the method comprising the steps of:

controlling operational modes of the non-volatile memory chip with a separate companion controller chip;

storing addresses of defective non-volatile memory cells in a column redundancy RAM memory array of the separate companion controller chip;

comparing, with redundancy match logic, user input addresses for the non-volatile memory to the addresses of defective non-volatile memory cells, said addresses stored in the column redundancy RAM memory array;

providing from the redundancy match logic a match output signal corresponding to a match of a particular user input address for the non-volatile memory with the address of a defective non-volatile memory cell, the collection of said addresses stored in the column redundancy RAM memory array; and

dynamically substituting, with column redundancy replacement logic in response to a match output signal from the column redundancy match logic, correct data associated with the defective non-volatile memory cell into an I/O data bit stream of the non-volatile memory chip.

18. The method of claim 17 including programming the non-volatile memory, using the column redundancy replacement logic, with redundant data for defective non-volatile memory cells, said redundant data stored in redundant columns of the non-volatile memory; and

reading the non-volatile memory, using the column redundancy replacement logic, with redundant data for defective non-volatile memory cells being stored in redundant columns of the non-volatile memory.

19. The method of claim 17 including substituting correct data associated with a defective non-volatile memory cell into the I/O data bit stream of the non-volatile memory chip for a program mode of operation, a read mode of operation, and an erase mode of operation for the non-volatile memory chip, using the column redundancy replacement logic, in response to a match output signal from the column redundancy match logic.

20. The method of claim 17 including comparing, with the column redundancy match logic, addresses for a portion of a memory data byte stored in the non-volatile memory.

21. The method of claim 20 wherein the portion of a memory data byte stored in the non-volatile memory is a nibble.

22. The method of claim 17 including transferring addresses stored in the redundancy RAM memory array from fused addresses of defective non-volatile memory cells originally stored in the non-volatile memory chip.

23. The method of claim 17 wherein the non-volatile memory chip is a FLASH memory chip.

Assignments (18)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2025
From: MICROCHIP TECHNOLOGY INC.; MICROCHIP TECHNOLOGY IRELAND LIMITED; MICROSEMI CORPORATION; ATMEL CORPORATION; SILICON STORAGE TECHNOLOGY, INC.; MICROSEMI FREQUENCY AND TIME CORP.; MICROSEMI SEMICONDUCTOR ULC; MICROCHIP TECHNOLOGY GERMANY GMBH
To: CRESTONE IP MANAGEMENT, LLC
Reel/Frame 071991/0419 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 27, 2007
From: CHEN, ALAN; ICHHAPORIA, NEVILLE; ADUSUMILLI, VIJAY P.; TRINH, STEPHEN
To: ATMEL CORPORATION
Reel/Frame 019891/0686 →