Method of making an interposer
View Patent ↗A method of making an interposer in which at least two dielectric layers are bonded to each other to sandwich a plurality of conductors there-between. The conductors each electrically couple a respective pair of opposed electrical contacts which are formed within and protrude from openings which are also formed within the dielectric layers as part of this method. The resulting interposer is ideally suited for use as part of a test apparatus to interconnect highly dense patterns of solder ball contacts of a semiconductor chip to lesser dense arrays of contacts on the apparatus's printed circuit board.
1. A method of making an interposer, said method comprising:
providing a first dielectric layer including a plurality of openings therein;
positioning a plurality of electrical conductors on said first dielectric layer;
bonding a second dielectric layer including a plurality of openings therein to said first dielectric layer such that said plurality of said electrical conductors are positioned between said first and second dielectric layers;
forming a first plurality of metallic contacts within said plurality of openings within said first dielectric layer, selected ones of said first plurality of metallic contacts including a protruding portion protruding from said first dielectric layer; and
forming a second plurality of metallic contacts within said plurality of openings within said second dielectric layer, selected ones of said second plurality of metallic contacts including a protruding portion protruding from said second dielectric layer in an opposing direction from said selected ones of said first plurality of metallic contacts protruding from said first dielectric layer and being formed within said plurality of openings within said second dielectric layer so as to be positioned in an offsetting relationship with respect to a corresponding one of said selected ones of said first plurality of metallic contacts to form a plurality of paired contact locations with each of said pairs of said metallic contacts at said contact locations being electrically connected by a respective one of said electrical conductors such that said first and second dielectric layers, said first and second plurality of metallic contacts and said plurality of electrical conductors are adapted for tilting at each of said paired contact locations in response to the application of forces on said first and second metallic contacts at said paired contact locations to compensate for the application of said forces in an excessive manner.
2. The method of claim 1 wherein said plurality of electrical conductors is positioned on said first dielectric layer using lamination or plating.
3. The method of claim 1 wherein said pluralities of openings within said first and second dielectric layers are formed using a laser.
4. The method of claim 1 wherein said first and second pluralities of metallic contacts are formed using an electroplating process.
5. The method of claim 1 further including plating a first conductive coating over said first plurality of metallic contacts.
6. The method of claim 5 further including plating a second conductive coating over said first conductive coating.
7. The method of claim 1 wherein said plurality of electrical conductors is formed by bonding a first conductor layer onto said first dielectric layer and thereafter using an etching process to etch said first conductor layer.
8. The method of claim 7 wherein each of said first and second plurality of metallic contacts are formed from copper material.
9. The method of claim 1 further including providing selected ones of said second plurality of metallic contacts with a sculpted configuration.
10. The interposer of claim 1 further including providing selected ones of said first plurality of metallic contacts with a domed portion.