Method of making circuitized substrate with internal optical pathway
View Patent ↗A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.
1. A method of making a circuitized substrate including at least one optical pathway therein, said method comprising:
providing a dielectric layer;
forming an electrically conductive layer on said dielectric layer;
laminating a cladding layer to said electrically conductive layer, having a predetermined refractive index, atop said electrically conductive layer, said cladding layer having an upper surface and a lower surface;
aligning a stencil comprising a tapered opening therein over said cladding layer;
depositing material within said tapered opening and pressing said material therethrough, squeezing said material to substantially fill said opening;
removing said stencil;
depositing a reflective layer having an angular configuration onto said material, covering the sides and top of said material; and
depositing an optical core layer comprising highly optically conductive material onto said reflective layer such that optical signals passing through said optical core will be reflected off said angular reflector and pass through said opening.
2. The method of claim 1 further including circuitizing said electrically conductive layer.
3. The method of claim 1 wherein said circuitizing of said electrically conductive layer results in the formation of a plurality of electrical signal conductors.
4. The method of claim 3 wherein said circuitizing of said electrically conductive layer is accomplished using photolithographic processing.
5. The method of claim 1 wherein said forming of said reflective surface on said angular reflector is accomplished by forming a metal coating on said angular reflector.
6. The method of claim 5 wherein said forming of said metal coating on said angular reflector is accomplished using at least one of the techniques: electro-less plating, electrolytic plating, thermal spray coating, vapor deposition, and chemical vapor deposition.
7. The method of claim 1 wherein said depositing said optical core on said cladding layer relative to said angular reflector is accomplished by spin coating the material which comprises said optical core.
8. The method of claim 1 further including positioning a quantity of optically-transmitting material within said opening.
9. The method of claim 1 wherein said providing a cladding layer step comprises using lamination therefor.
10. The method of claim 1 wherein said cladding layer comprises optically transparent optical waveguide polymer material.
11. The method of claim 1 wherein said stencil comprises metal.
12. The method of claim 1 wherein said material comprises at least one of: optically transparent optical waveguide polymer material, UV-curable silver epoxy, and other epoxy based materials.
13. A method of forming a circuitized substrate, the steps comprising:
a) providing a dielectric layer;
b) bonding an electrically conductive layer to said dielectric layer;
c) laminating a cladding layer to said electrically conductive layer, having a predetermined refractive index, atop said electrically conductive layer, said cladding layer having an upper surface and a lower surface;
d) aligning a stencil on the upper surface of said cladding layer, said stencil having a predetermined thickness, an upper surface and a lower surface, and a tapered aperture formed therein, said tapered aperture having angled internal walls oriented at approximately 450° relative to said upper and lower surfaces of said stencil, the lowermost, outwardly tapered surface of said tapered aperture abutting the upper surface of said cladding layer;
e) squeezing a paste-like material into and filling said tapered aperture;
f) removing said stencil;
g) hardening said paste-like material by flash curing, forming a base for an angular reflector;
h) depositing a reflective layer onto said hardened paste-like material; and
i) depositing an optical core layer having a refractive index greater than the predetermined refractive index of said cladding layer, said optical core layer providing an optical pathway for optical signals passing through said optical core.
14. The method of forming a circuitized substrate in accordance with claim 13 , wherein said electrically conductive layer comprises a plurality of signal lines and pads oriented in a pre-established pattern.
15. The method of forming a circuitized substrate in accordance with claim 13 , wherein said cladding layer comprises at least one optically transparent optical waveguide polymer material.
16. The method of forming a circuitized substrate in accordance with claim 15 , wherein the refractive index of said cladding layer is approximately 1.40 and said refractive index of said optical core layer is approximately 1.42.
17. The method of forming a circuitized substrate in accordance with claim 16 , wherein said stencil comprises metal.
18. The method of forming a circuitized substrate in accordance with claim 13 , wherein said paste-like material filling said tapered aperture comprises at least one of cladding layer material and UV-curable silver epoxy, and epoxy-based material.