Integrated circuit package-on-package system with anti-mold flash feature
View Patent ↗An integrated circuit package-on-package system includes: mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure; forming a package encapsulation having a recess over the package substrate and the integrated circuit package system. The present invention also includes: forming an anti-mold flash feature with an extension portion of the package encapsulation and constrained by the mold structure at the bottom of the recess, and partially exposing the mountable substrate in the recess with the anti-mold flash feature formed with the mold structure; and mounting an integrated circuit device over the mountable substrate in the recess.
1. A method for manufacturing an integrated circuit package-on-package system comprising:
mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure;
forming a package encapsulation having a recess over the package substrate and the integrated circuit package system including:
forming an anti-mold flash feature with an extension portion of the package encapsulation abutted to a non-horizontal side of the mountable substrate at the bottom of the recess, and
partially exposing the mountable substrate in the recess with the anti-mold flash feature formed with the mold structure; and
mounting an integrated circuit device over the mountable substrate in the recess.
2. The method as claimed in claim 1 wherein:
mounting the integrated circuit package system includes:
providing the mountable substrate with a contact pad;
forming the package encapsulation having the recess includes:
exposing the contact pad in the recess;
preventing contamination from the package encapsulation over the contact pad with the anti-mold flash feature; and
mounting the integrated circuit device over the mountable substrate in the recess includes:
connecting the integrated circuit device and the contact pad.
3. The method as claimed in claim 1 wherein:
mounting the integrated circuit package system having the mountable substrate with the mold structure includes:
providing the mountable substrate having a groove; and
forming the anti-mold flash feature having the extension portion of the package encapsulation and constrained by the mold structure includes:
filling the groove with the extension portion.
4. The method as claimed in claim 1 wherein:
mounting the integrated circuit package system having the mountable substrate with the mold structure includes:
providing the mountable substrate having a dam structure; and
forming the anti-mold flash feature having the extension portion of the package encapsulation and constrained by the mold structure includes:
forming the extension portion adjacent to the dam structure.
5. The method as claimed in claim 1 wherein:
mounting the integrated circuit package system having the mountable substrate with the mold structure includes:
providing the mountable substrate having both a dam structure extended therefrom and a groove; and
forming the anti-mold flash feature having the extension portion of the package encapsulation and constrained by the mold structure includes:
forming the extension portion adjacent to the dam structure and in the groove.
6. A method for manufacturing an integrated circuit package-on-package system comprising:
mounting an integrated circuit package system having a mountable substrate over a package substrate with the mountable substrate having a mold structure and a contact pad;
forming a package encapsulation having a recess over the package substrate and the integrated circuit package system including:
forming an anti-mold flash feature with an extension portion of the package encapsulation abutted to a non-horizontal side of the mountable substrate at the bottom of the recess,
partially exposing the contact pad of the mountable substrate in the recess with the anti-mold flash feature formed with the mold structure, and
preventing contamination from the package encapsulation over the contact pad with the anti-mold flash feature; and
mounting an integrated circuit device over the mountable substrate in the recess.
7. The method as claimed in claim 6 wherein mounting the integrated circuit package system having the mountable substrate over the package substrate includes mounting the integrated circuit package system over an integrated circuit with the integrated circuit over the package substrate.
8. The method as claimed in claim 6 wherein:
mounting the integrated circuit package system having the mountable substrate with the mold structure includes:
providing the mountable substrate with a dam structure extended therefrom with the dam structure comprised of a solder mask material of the mountable substrate; and
forming the anti-mold flash feature having the extension portion of the package encapsulation and constrained by the mold structure includes:
forming the extension portion to the dam structure.
9. The method as claimed in claim 6 wherein:
mounting the integrated circuit package system having the mountable substrate with the mold structure includes:
providing the mountable substrate with a dam structure extended therefrom with the dam structure comprised of an encapsulation material of the mountable substrate; and
forming the anti-mold flash feature having the extension portion of the package encapsulation and constrained by the mold structure includes:
forming the extension portion adjacent to the dam structure.
10. The method as claimed in claim 6 further comprising attaching an external interconnect with the package substrate at an opposing side to the integrated circuit package-on-package system.
11. An integrated circuit package-on-package system comprising:
a package substrate;
an integrated circuit package system having a mountable substrate over the package substrate with the mountable substrate having a mold structure;
a package encapsulation having a recess over the package substrate and the integrated circuit package-on-package system including:
an anti-mold flash feature having an extension portion of the package encapsulation abutted to a non-horizontal side of the mountable substrate at the bottom of the recess, and
the mountable substrate partially exposed in the recess with the anti-mold flash feature formed with the mold structure; and
an integrated circuit device mounted over the mountable substrate in the recess.
12. The system as claimed in claim 11 wherein:
the mountable substrate includes a contact pad exposed in the recess and the anti-mold flash feature for preventing contamination from the package encapsulation over the contact pad; and
the integrated circuit device is connected to the contact pad.
13. The system as claimed in claim 11 wherein:
the mold structure includes a groove; and
the anti-mold flash feature having the extension portion constrained by the mold structure includes the extension portion in the groove.
14. The system as claimed in of claim 11 wherein:
the mold structure includes a dam structure; and
the anti-mold flash feature having the extension portion constrained by the mold structure includes the extension portion adjacent to the dam structure.
15. The system as claimed in claim 11 wherein:
the mold structure includes a dam structure extended therefrom and a groove; and
the anti-mold flash feature having the extension portion constrained by the mold structure includes the extension portion adjacent to the dam structure and in the groove.
16. The system as claimed in claim 11 wherein:
the mountable substrate includes a contact pad exposed in the recess and the anti-mold flash feature for preventing contamination from the package encapsulation over the contact pad;
the package encapsulation includes a sloped portion in the recess to the anti-mold flash feature; and
the integrated circuit device includes an electrical connector connected with the contact pad.
17. The system as claimed in claim 16 wherein the integrated circuit package system having the mountable substrate over the package substrate includes the integrated circuit package system over an integrated circuit with the integrated circuit over the package substrate.
18. The system as claimed in of claim 16 wherein:
the mold structure includes a dam structure comprised of a solder mask material of the mountable substrate; and
the anti-mold flash feature having the extension portion constrained by the mold structure includes the extension portion adjacent to the dam structure.
19. The system as claimed in claim 16 wherein:
the mold structure includes a dam structure comprised of an encapsulation material of the mountable substrate; and
the anti-mold flash feature having the extension portion constrained by the mold structure includes the extension portion adjacent to the dam structure.
20. The system as claimed in claim 16 further comprising an external interconnect attached with the package substrate at an opposing side to the integrated circuit package system.