IP Library Granted Patent US 7,747,790
Granted Patent B2
US 7,747,790 · App. 11/947,764 · Granted Jun 29, 2010

Integrated driver circuit for LIN bus wherein circuit is operable between an older LIN bus specification or a newer LIN bus specification

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Quick Facts
Patent No.
US 7,747,790
App. No.
11/947,764
Granted
Jun 29, 2010
Kind
B2
Abstract

An integrated driver circuit is provided for a LIN bus comprises a first input terminal, a second input terminal, and an output terminal, which is to be connected to a bus line of the LIN bus and at which an output data signal, dependent on an input data signal, is output, whereby the output data signal is output according to a first or according to at least one second LIN bus specification depending on whether the input data signal is applied at the first input terminal or the at least second input terminal.

Claims (13)

1. An integrated driver circuit for a Local Interconnect Network LIN bus, the circuit comprising:

a first input terminal at which an input data signal is applied;

an output terminal, which is connected to a bus line of the LIN bus and at which an output data signal dependent on the input data signal is outputted;

at least one second input terminal, whereby the input data signal is applied either at the first input terminal or the second input terminal;

a transmit circuit, which is looped between the output terminal and the first and second input terminal and which generates the output data signal from the input data signal, whereby the transmit circuit, depending on a specification selection signal, generates the output data signal according to a first LIN bus specification or according to at least one second LIN bus specification, wherein the first LIN bus specification is different than the second LIN bus specification; and

a specification selection circuit, which is coupled to the first and second input terminal and the transmit circuit and generates the specification selection signal depending on whether the input data signal is applied at the first input terminal or the at least second input terminal.

2. The integrated driver circuit according to claim 1 , wherein output data signals, generated according to the first specification, have a different edge steepness than output data signals generated according to the second specification.

3. The integrated driver circuit according to claim 1 , wherein the first specification is LIN bus specification version 1.3 and the second specification is LIN bus specification version 2.0.

4. The integrated driver circuit according to claim 1 , wherein the specification selection circuit comprises a flip-flop, whereby a first flip-flop input terminal is connected to the first input terminal, a second flip-flop input terminal is connected to the second input terminal, and the specification selection signal is applied at a flip-flop output terminal.

5. The integrated driver circuit according to claim 1 , wherein a first pull-up resistor is looped between the first input terminal and a supply voltage and a second pull-up resistor is looped between the second input terminal and the supply voltage.

6. The, integrated driver circuit according to claim 1 , wherein an AND gate is looped between the transmit circuit and the first and second input terminal, wherein a first AND gate input terminal is connected to the first input terminal, a second AND gate input terminal is connected to the second input terminal, and an AND gate output terminal is connected to the transmit circuit.

7. The integrated driver circuit according to claim 1 , wherein the first input terminal is formed as a first bond pad and the second input terminal is formed as a second bond pad, wherein during a packaging process of the integrated driver circuit, depending on a desired specification, either the first bond pad or the second bond pad is contacted by an associated input terminal pin of the integrated driver circuit.

8. The integrated driver circuit according to claim 7 , wherein the output terminal is formed as a bond pad, and wherein during the packaging process of the integrated driver circuit, the bond pad is contacted by an associated output terminal pin of the integrated driver circuit.

Assignments (19)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: ATMEL CORPORATION
Reel/Frame 059262/0105 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: ATMEL CORPORATION
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041715/0747 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT COLLATERAL Recorded Apr 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: ATMEL CORPORATION
Reel/Frame 038376/0001 →
PATENT SECURITY AGREEMENT Recorded Jan 3, 2014
From: ATMEL CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC. AS ADMINISTRATIVE AGENT
Reel/Frame 031912/0173 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2011
From: ATMEL AUTOMOTIVE GMBH
To: ATMEL CORPORATION
Reel/Frame 025899/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2009
From: ATMEL GERMANY GMBH
To: ATMEL AUTOMOTIVE GMBH
Reel/Frame 023205/0655 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 16, 2008
From: PANNWITZ, AXEL
To: ATMEL GERMANY GMBH
Reel/Frame 020992/0814 →