IP Library Granted Patent US 7,598,809
Granted Patent B2
US 7,598,809 · App. 11/948,910 · Granted Oct 6, 2009

RF power amplifier

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Quick Facts
Patent No.
US 7,598,809
App. No.
11/948,910
Granted
Oct 6, 2009
Kind
B2
Abstract

An RF power amplifier includes a plurality of amplifier cells. Each amplifier cell includes a bipolar transistor and a base circuit that comprises an RF coupling capacitor, a bias resistor, a base capacitor, and a base resistor. The base circuit transmits DC bias current and an RF signal to the base of the bipolar transistor to provide a selectable frequency response. The base circuit may be implemented using a structure of stacked capacitors.

Claims (43)

1. An RF power amplifier comprising:

a plurality of amplifier cells, each amplifier cell comprising a bipolar transistor and a base circuit,

each bipolar transistor including a collector coupled to an output node, including a base, and including an emitter coupled to a ground node,

each base circuit including an RF input node for receiving an RF signal, including a bias voltage node for receiving a bias voltage, and including a base node coupled to the base of the bipolar transistor, each base circuit comprising a parallel resistor-capacitor circuit including a first node coupled to said bias voltage node and said RF input node, and including a second node coupled to said base node, and wherein the base circuit includes a first circuit to control sub-harmonics of the bipolar transistor and a second circuit to provide ballast to control current collapse of the bipolar transistor.

2. An RF power amplifier comprising:

a plurality of amplifier cells, each amplifier cell comprising a bipolar transistor and a base circuit;

each bipolar transistor including a collector coupled to an output node, including a base, and including an emitter coupled to a ground node;

each base circuit including an RF input node for receiving an RF signal, including a bias voltage node for receiving a bias voltage, and including a base node coupled to the base of the bipolar transistor;

wherein each base circuit comprises:

a first capacitor including a first node coupled to the RF input node and including a second node;

a first resistor including a first node coupled to the bias voltage node and including a second node coupled to the second node of the first capacitor;

a second capacitor including a first node coupled to the second node of the first capacitor and including a second node coupled to the base of the bipolar transistor; and

a second resistor including first and second nodes coupled to the respective first and second nodes of the second capacitor.

3. The RF power amplifier of claim 2 wherein the collectors of the bipolar transistors are coupled to a collector node.

4. The RF power amplifier of claim 2 wherein the first and second capacitors of the base circuits include a structure of stacked capacitors.

5. The RF power amplifier of claim 4 wherein one plate of the first or second capacitor is formed by a metal layer that is the same layer that forms a collector terminal of the bipolar transistor.

6. The RF power amplifier of claim 1 wherein at least two amplifier cells are arranged as a pair, the emitters of the transistors of the pair being configured as emitter fingers.

7. An RF power amplifier comprising:

a bipolar transistor including a collector coupled to an output node, including a base, and including an emitter coupled to a ground node, and

a base circuit including an RF input node for receiving an RF signal, including a bias voltage node for receiving a bias voltage, and including a base node coupled to the base of the bipolar transistor, the base circuit comprising a parallel resistor-capacitor circuit including a first node coupled to said bias voltage node and said RF input node, and including a second node coupled to said base node, and wherein the base circuit includes a first circuit coupled to the base of the bipolar transistor to control sub-harmonics of the bipolar transistor and includes a second circuit coupled to the base of the bipolar transistor to provide ballast to control current collapse of the bipolar transistor.

8. An RF power amplifier comprising:

a bipolar transistor including a collector coupled to an output node, including a base, and including an emitter coupled to a ground node; and

a base circuit including an RF input node for receiving an RF signal, including a bias voltage node for receiving a bias voltage, and including a base node coupled to the base of the bipolar transistor,

wherein the base circuit comprises:

a first capacitor including a first node coupled to the RF input node and including a second node;

a first resistor including a first node coupled to the bias voltage node and including a second node coupled to the second node of the first capacitor;

a second capacitor including a first node coupled to the second node of the first capacitor and including a second node coupled to the base of the bipolar transistor; and

a second resistor including first and second nodes coupled to the respective first and second nodes of the second capacitor.

9. The RF power amplifier of claim 2 , wherein at least two amplifier cells are arranged as a pair, the emitters of the transistors of the pair being configured as emitter fingers.

10. The RF power amplifier of claim 1 ,

wherein each base circuit comprises:

a first capacitor including a first node coupled to the RF input node and including a second node coupled to the first node of the parallel resistor-capacitor circuit; and

a first resistor including a first node coupled to the bias voltage node and including a second node coupled to the first node of the parallel resistor-capacitor circuit;

wherein the parallel resistor-capacitor circuit comprises:

a second capacitor including first and second nodes coupled to the respective first and second nodes of the parallel resistor-capacitor circuit; and

a second resistor including first and second nodes coupled to the respective first and second nodes of the second capacitor.

11. The RF power amplifier of claim 7 ,

wherein the base circuit comprises:

a first capacitor including a first node coupled to the RF input node and including a second node coupled to the first node of the parallel resistor-capacitor circuit; and

a first resistor including a first node coupled to the bias voltage node and including a second node coupled to the first node of the parallel resistor-capacitor circuit;

wherein the parallel resistor-capacitor circuit comprises:

a second capacitor including first and second nodes coupled to the respective first and second nodes of the parallel resistor-capacitor circuit; and

a second resistor including first and second nodes coupled to the respective first and second nodes of the second capacitor.

Assignments (16)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2011
From: SILICON STORAGE TECHNOLOGY, INC.
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 026213/0515 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2007
From: KOBAYASHI, BUN
To: SILICON STORAGE TECHNOLOGY, INC.
Reel/Frame 020183/0573 →