High speed interposer
View Patent ↗A high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.
1. An interposer comprising:
a substrate including first and second opposing surfaces, said substrate including a plurality of dielectric layers, one of said dielectric layers being disposed at the uppermost position of said substrate and a plurality of conductive layers oriented within said substrate in an alternating manner with respect to said plurality of said dielectric layers;
a plurality of openings extending substantially through said substrate from said first opposing surface to said second opposing surface;
a plurality of plated thru holes having lands associated therewith and disposed above and below said first and second opposing surfaces, respectively, each of said plated thru holes positioned within a respective one of said openings and extending substantially from said first opposing surface of said substrate to said second opposing surface of said substrate, wherein each of said plated thru holes and associated lands includes a metal cover disposed on the first opposing surface which substantially covers a first end of said plated thru hole, said cover adapted for engaging a conductor to make electrical contact therewith; and
a plurality of shielding members positioned within said substrate and substantially extending from said first opposing surface of said substrate to said second opposing surface of said substrate, each of said shielding members being positioned substantially around a respective one of said plated thru holes forming a space therebetween filled with said dielectric material of said dielectric uppermost layer and connected to at least one conductive layer at a spaced distance from said plated thru hole and adapted for providing shielding for said respective plated thru hole in a stripline transmission line structure during the passage of high frequency signals through said plated thru hole to achieve acceptable levels of electrical noise and crosstalk.
2. The interposer of claim 1 wherein said conductor which said cover is adapted for engaging is a solder ball.
3. The interposer of claim 1 wherein each of said plated thru holes includes first and second covers, each of said covers substantially covering an end of said plated thru hole.
4. The interposer of claim 3 wherein each of said plated thru holes includes a quantity of conductive material therein.
5. The interposer of claim 3 wherein each of said plated thru holes includes a quantity of non-conductive material therein.