Integrated circuit package system with heat sink spacer structures
View Patent ↗An integrated circuit package system comprising: providing a package substrate; attaching an integrated circuit die over the package substrate wherein the integrated circuit die has a mount height; attaching an attachment structure having a height substantially the same as the mount height and planar dimensions predetermined to fit adjacent the integrated circuit die and over the package substrate; and attaching a heat dissipation device over the integrated circuit die and the attachment structure.
1. A method for manufacturing an integrated circuit package system comprising:
providing a package substrate;
attaching an integrated circuit die over the package substrate forming an exposed surface of the package substrate wherein the integrated circuit die has a mount height;
mounting a passive device on a side the package substrate having the integrated circuit die;
attaching a plurality of attachment structures having a height substantially the same as the mount height and planar dimensions predetermined to fit on a plurality of portions of the exposed surface of the package substrate between the integrated circuit die and an outer edge of the package substrate, with the passive device between a corner of the package substrate and at least one of the plurality of attachment structures; and
attaching a heat dissipation device over the integrated circuit die and the passive device using the plurality of attachment structures.
2. The method as claimed in claim 1 wherein attaching the heat dissipation device includes attaching the heat dissipation device to the integrated circuit die.
3. The method as claimed in claim 1 wherein attaching the plurality of attachment structures includes attaching an elongated attachment structure.
4. The method as claimed in claim 1 wherein attaching the plurality of attachment structures includes attaching at least one attachment structure near another corner of the package substrate.
5. The method as claimed in claim 1 wherein attaching the heat dissipation device includes attaching a clamping fixture to the heat dissipation device over the integrated circuit die and the attachment structures.
6. A method of manufacturing an integrated circuit package system comprising:
forming a package substrate having a package substrate attach surface and an exposed substrate surface;
attaching an integrated circuit die having a die top surface, a die mounting surface, and a mount height wherein the die mounting surface is over the package substrate attach surface;
mounting a passive device on a side the package substrate having the integrated circuit die;
attaching a plurality of attachment structures having a height substantially the same as the mount height and planar dimensions predetermined to fit adjacent the integrated circuit die and over the exposed substrate surface between the integrated circuit die and an outer edge of the package substrate, with the passive device between a corner of the package substrate and at least one of the plurality of attachment structures; and
attaching a heat dissipation device over the die top surface and the passive device using the plurality of attachment structures.
7. The method as claimed in claim 6 wherein attaching the heat dissipation device includes attaching the heat dissipation device to the die top surface.
8. The method as claimed in claim 6 wherein attaching the plurality of attachment structures includes attaching an elongated attachment structure for narrow space designs, designs requiring underfill bleed or other keep-outs.
9. The method as claimed in claim 6 wherein attaching the plurality of attachment structures includes attaching at least one attachment structure near another corner of the package substrate for mechanical mounting applications.
10. The method as claimed in claim 6 wherein attaching the heat dissipation device includes applying force from a clamping fixture to the heat dissipation device and a base substrate.
11. An integrated circuit package system comprising:
a package substrate;
an integrated circuit die over the package substrate to form an exposed surface of the package substrate wherein the integrated circuit die has a mount height;
a passive device on a side the package substrate having the integrated circuit die;
a plurality of attachment structures having a height substantially the same as the mount height and planar dimension's predetermined to fit on a plurality of portions of the exposed surface of the package substrate adjacent the integrated circuit die and over the package substrate between the integrated circuit die and an outer edge of the package substrate, with the passive device between a corner of the package substrate and at least one of the plurality of attachment structures; and
a heat dissipation device over the integrated circuit die and the passive device using the plurality of attachment structures.
12. The system as claimed in claim 11 wherein the heat dissipation device is attached to the integrated circuit die.
13. The system as claimed in claim 11 wherein at least one of the attachment structures is an elongated attachment structure.
14. The system as claimed in claim 11 wherein at least one of the plurality of attachment structures is near another corner of the package substrate.
15. The system as claimed in claim 11 wherein the heat dissipation device includes a clamping fixture attached to the heat dissipation device over the integrated circuit die and the plurality of attachment structures.
16. The system as claimed in claim 11 wherein:
the package substrate has a package substrate attach surface;
the integrated circuit has a die top surface, a die mounting surface, and a mount height wherein the die mounting surface is over the package substrate attach surface;
the plurality of attachment structures has a height substantially the same as the mount height and planar dimensions predetermined to fit adjacent the integrated circuit die and over portions of the exposed surface of the package substrate; and
the heat dissipation device is over the die top surface and the plurality of attachment structures.
17. The system as claimed in claim 16 wherein the heat dissipation device is attached to the die top surface.
18. The system as claimed in claim 16 wherein at least one of the plurality of attachment structures is an elongated attachment structure for narrow space designs, designs requiring underfill bleed or other keep-outs.
19. The system as claimed in claim 16 wherein at least one of the plurality of attachment structures is near another corner of the package substrate for mechanical mounting applications.
20. The system as claimed in claim 16 wherein the heat dissipation device includes a clamping fixture applied to the heat dissipation device and a base substrate.