Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
View Patent ↗A semiconductor device has a substrate having a top and bottom surface and a plurality of metal layers. A first die is electrically coupled to the top surface of the substrate. A lid member is attached to a top surface of the die and to the top surface of the substrate. A layering is formed on portions of a top surface of the lid member. The layering will have a different coefficient of thermal expansion (CTE) than the lid member.
1. A semiconductor device comprising:
a substrate having a top and bottom surface, and a plurality of metal layers;
a first die electrically coupled to the top surface of the substrate;
a lid member attached to a top surface of the die and to the top surface of the substrate; and
a layering formed on portions of a top surface of the lid member, on a bottom surface of the lid member, and side surface of the lid member, the layering comprising:
a first layer formed on portions of the top surface of the lid member, void areas in the first layer forming exposed areas on remaining portions on the top surface of the lid member; and
a second layer formed on the first layer and exposed portions on the top surface of the lid member, the bottom surface of the lid member, and side surfaces of the lid member.
2. A semiconductor device in accordance with claim 1 wherein the first die is electrically coupled to the top surface of the substrate by flip chip bonding.
3. A semiconductor device in accordance with claim 1 wherein the layering is formed so the top surface of the lid member will have a thicker profile than the bottom surface of the lid member.
4. A semiconductor device in accordance with claim 1 wherein the first layer is applied in a predetermined pattern on the top surface of the lid member, the void areas in the first layer forming the exposed portions on the top surface.
5. A semiconductor device in accordance with claim 1 wherein the layering will have a lower CTE than the lid member.
6. A semiconductor device in accordance with claim 1 further comprising a second die electrically coupled to the top surface of the substrate, wherein the second die is a flip chip, the lid member attached to top surfaces of the first and second die and to the top surface of the substrate.
7. A semiconductor device in accordance with claim 1 further comprising:
a thermal interface material (TIM) applied to the top surface of the first semiconductor die to attach the lid member to the first semiconductor die; and
an adhesive material applied to the top surface of the substrate to attach the lid member to the substrate.
8. A semiconductor device in accordance with claim 1 wherein the second layer has a thickness less than 1% of a thickness of the lid member.
9. A semiconductor device in accordance with claim 2 further comprising a non-conductive filler material applied to open spaces formed between a bottom surface of the first semiconductor die and the top surface of the substrate.
10. A semiconductor device in accordance with claim 6 further comprising a non-conductive filler material applied to open spaces formed between a bottom surface of the first semiconductor die and the top surface of the substrate and a bottom surface of the second semiconductor die and the top surface of the substrate.
11. A semiconductor device comprising:
a substrate having a top and bottom surface, and a plurality of metal layers;
a first die electrically coupled to the top surface of the substrate;
a lid member attached to a top surface of the die and to the top surface of the substrate; and
a layering formed on portions of a top surface of the lid member, a bottom surface of the lid member and side surfaces of the lid member, wherein the layering will have a different coefficient of thermal expansion (CTE) than the lid member, wherein the layering is formed so the top surface of the lid member will have a thicker profile than the bottom surface of the lid, wherein the layering comprises:
a first layer formed on portions of the top surface of the lid member, void areas in the first layer forming exposed areas on remaining portions on the top surface of the lid member; and
a second layer formed on the first layer and exposed areas on the top surface of the lid member, the bottom surface of the lid member, and side surfaces of the lid member.
12. A semiconductor device in accordance with claim 11 wherein the first layer is applied in a predetermined pattern on the top surface of the lid member forming the exposed areas on the top surface of the lid member.
13. A semiconductor device in accordance with claim 11 wherein the layering will have a lower CTE than the lid member.
14. A semiconductor device in accordance with claim 11 further comprising a second die electrically coupled to the top surface of the substrate, wherein the second die is a flip chip, the lid member attached to top surfaces of the first and second die and to the top surface of the substrate.
15. A semiconductor device in accordance with claim 11 further comprising:
a thermal interface material (TIM) applied to the top surface of the first semiconductor die to attach the lid member to the first semiconductor die; and
an adhesive material applied to the top surface of the substrate to attach the lid member to the substrate.
16. A semiconductor device in accordance with claim 11 further comprising a non-conductive filler material applied to open spaces formed between a bottom surface of the first semiconductor die and the top surface of the substrate.
17. A semiconductor device in accordance with claim 14 further comprising a non-conductive filler material applied to open spaces formed between a bottom surface of the first semiconductor die and the top surface of the substrate and a bottom surface of the second semiconductor die and the top surface of the substrate.
18. A semiconductor device comprising:
a substrate having a top and bottom surface, and a plurality of metal layers;
a first die electrically coupled to the top surface of the substrate;
a lid member attached to a top surface of the die and to the top surface of the substrate; and
a layering formed on portions of a top surface of the lid member, a bottom surface of the lid member, and side surfaces of the lid member, wherein the layering will have a lower coefficient of thermal expansion (CTE) than the lid member, wherein the layering is formed so the top surface of the lid member will have a thicker profile than the bottom surface, wherein the layering comprises:
a first layer formed on portions of the top surface of the lid member, void areas in the first layer forming exposed areas on remaining portions on the top surface of the lid member; and
a second layer formed on the first layer and exposed areas on the top surface on the lid member, bottom surface of the lid member, and side surfaces of the lid member.
19. A semiconductor device in accordance with claim 18 wherein the first layer is applied in a predetermined pattern on the top surface of the lid member forming the exposed areas on the top surface of the lid member.
20. A semiconductor device in accordance with claim 18 further comprising:
a thermal interface material (TIM) applied to the top surface of the first semiconductor die to attach the lid member to the first semiconductor die; and
an adhesive material applied to the top surface of the substrate to attach the lid member to the substrate.