Ball grid array package stacking system
A ball grid array package stacking system includes: providing a base substrate; coupling an integrated circuit to the base substrate; coupling a stacking substrate over the base substrate; mounting a heat spreader, having an access port, around the base substrate and the stacking substrate; and coupling a stacked integrated circuit to the stacking substrate through the access port.
1. A ball grid array package stacking system comprising:
a base substrate;
an integrated circuit coupled to the base substrate;
a stacking substrate over the base substrate;
a heat spreader, having an access port, around the base substrate and the stacking substrate; and
a stacked integrated circuit coupled to the stacking substrate through the access port.
2. The system as claimed in claim 1 further comprising a discrete component coupled to the stacking substrate, through the access port.
3. The system as claimed in claim 1 further comprising a stacked package body between the base substrate and the stacking substrate.
4. The system as claimed in claim 1 further comprising an electrical interconnect, a substrate interconnect, or a combination thereof between the base substrate and the stacking substrate.
5. The system as claimed in claim 1 further comprising a component side of the stacking substrate for coupling the integrated circuit mounted thereon.
6. The system as claimed in claim 1 further comprising:
a chip side and a system side on the base substrate;
a system interconnect coupled to the integrated circuit through the base substrate;
a chip adhesive between the stacking substrate and the base substrate;
a thermal adhesive between the stacking substrate and the heat spreader; and
a second stacked integrated circuit, a third stacked integrated circuit, or a combination thereof coupled through the access port.
7. The system as claimed in claim 6 further comprising a discrete component, to the stacking substrate, through the access port includes a resistor, a capacitor, an inductor, a voltage regulator, a diode, a transistor, or a combination thereof.
8. The system as claimed in claim 6 further comprising a stacked package body between the base substrate and the stacking substrate includes a molded cover on the base substrate, the stacking substrate, or a combination thereof encased.
9. The system as claimed in claim 6 further comprising an electrical interconnect, a substrate interconnect, or a combination thereof between the base substrate and the stacking substrate includes an embedded integrated circuit coupled to the stacked integrated circuit, the integrated circuit, the system interconnect, or a combination thereof.
10. The system as claimed in claim 6 further comprising a component side of the stacking substrate for coupling the integrated circuit mounted thereon includes a molded cover formed on the integrated circuit, an electrical interconnect, and the component side of the stacking substrate.