Stacked integrated circuit package system with intra-stack encapsulation
A stacked integrated circuit package system includes: mounting a first integrated circuit over a first carrier; mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect over the first carrier and the first integrated circuit; and forming an intra-stack encapsulation between the first carrier and the second carrier surrounding the intra-stack interconnect.
1. A method for manufacturing a stacked integrated circuit package system comprising:
mounting a first integrated circuit over a first carrier;
mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect directly on the first carrier adjacent the first integrated circuit; and
forming an intra-stack encapsulation between the first carrier and the second carrier, surrounding the intra-stack interconnect and in an entire space between the first carrier and the second carrier, and the intra-stack encapsulation is the same thickness between the first carrier and the second carrier as the intra-stack interconnect.
2. The method as claimed in claim 1 wherein forming the intra-stack encapsulation between the first carrier and the second carrier includes molding the intra-stack encapsulation.
3. The method as claimed in claim 1 further comprising forming the second integrated circuit package system including:
mounting a second integrated circuit over the second carrier; and
forming a top encapsulation over the second integrated circuit and the second carrier.
4. The method as claimed in claim 1 wherein forming the intra-stack encapsulation between the first carrier and the second carrier includes molding an underfill.
5. A method for manufacturing a stacked integrated circuit package system comprising:
mounting a first integrated circuit over a first carrier;
connecting the first integrated circuit over the first carrier;
mounting a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect directly on the first carrier adjacent the first integrated circuit;
forming an intra-stack encapsulation in an entire space between the first carrier and the second carrier surrounding the intra-stack interconnect, and the intra-stack encapsulation is the same thickness between the first carrier and the second carrier as the intra-stack interconnect; and
attaching an external interconnect below and to the first carrier.
6. The method as claimed in claim 5 further comprising forming the second integrated circuit package system having a top encapsulation not in contact with the intra-stack encapsulation.
7. The method as claimed in claim 5 wherein mounting the second integrated circuit package system over the first carrier and the first integrated circuit includes mounting the intra-stack interconnect adjacent to the first integrated circuit.
8. The method as claimed in claim 5 wherein forming the intra-stack encapsulation includes filling a space between the first carrier and the second carrier.
9. The method as claimed in claim 5 wherein attaching the external interconnect includes attaching solder ball.
10. A stacked integrated circuit package system comprising:
a first carrier;
a first integrated circuit over the first carrier;
a second integrated circuit package system having a second carrier with an intra-stack interconnect attached thereto and with the intra-stack interconnect directly on the first carrier adjacent the first integrated circuit; and
an intra-stack encapsulation having characteristics of being formed between the first carrier and the second carrier and the intra-stack encapsulation surrounds the intra-stack interconnect and fills the entire space between the first carrier and the second carrier, and the intra-stack encapsulation is the same thickness between the first carrier and the second carrier as the intra-stack interconnect.
11. The system as claimed in claim 10 wherein the second integrated circuit package system having the second carrier with the intra-stack interconnect attached thereto includes the intra-stack interconnect below the second carrier.
12. The system as claimed in claim 10 wherein the intra-stack interconnect is between the first carrier and the second carrier.
13. The system as claimed in claim 10 wherein the second integrated circuit package system includes:
a second integrated circuit over the second carrier; and
a top encapsulation over the second integrated circuit and the second carrier.
14. The system as claimed in claim 10 wherein the intra-stack encapsulation includes an underfill.
15. The system as claimed in claim 10 wherein:
the first integrated circuit is connected with the first carrier; and
further comprising:
an external interconnect connected below and to the first carrier.
16. The system as claimed in claim 15 wherein the second integrated circuit package system includes a top encapsulation not in contact with the intra-stack encapsulation.
17. The system as claimed in claim 15 wherein the second integrated circuit package system over the first carrier and the first integrated circuit includes the intra-stack interconnect adjacent to the first integrated circuit.
18. The system as claimed in claim 15 wherein the intra-stack encapsulation fills a space between the first carrier and the second carrier.
19. The system as claimed in claim 15 wherein the external interconnect includes attaching solder ball.