IP Library Granted Patent US 7,672,153
Granted Patent B2
US 7,672,153 · App. 12/172,860 · Granted Mar 2, 2010

Deglitching circuits for a radiation-hardened static random access memory based programmable architecture

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Quick Facts
Patent No.
US 7,672,153
App. No.
12/172,860
Filed
Jul 14, 2008
Granted
Mar 2, 2010
Kind
B2
Art Unit
2827
USPC
365/154
Abstract

A method for providing a deglitching circuit for a radiation tolerant static random access memory (SRAM) comprising: providing a configuration memory having a plurality of configuration bits; coupling read and write circuitry to the configuration memory for configuring the plurality of configuration bits; coupling a radiation hard latch to a programmable element, the radiation hard latch controlling the programmable element; and providing an interface that couples at least one of the plurality of configuration bits to the radiation hard latch when the write circuitry writes to the at least one of the plurality of configuration bits.

Claims (31)

1. A method for providing a deglitching circuit for a radiation tolerant static random access memory (SRAM) comprising:

providing a configuration memory having a plurality of configuration bits;

coupling read and write circuitry to said configuration memory for configuring said plurality of configuration bits, wherein said configuration memory comprises a plurality of inverters, the output of a first inverter of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters, and the input of said first inverter is coupled to the output of said second inverter of said plurality of inverters;

coupling a radiation hard latch to a programmable element, said radiation hard latch controlling said programmable element; and

providing an interface that couples at least one of said plurality of configuration bits to said radiation hard latch when said write circuitry writes to said at least one of said plurality of configuration bits.

2. The method of claim 1 , wherein:

said radiation hard latch comprises a plurality of inverters, the output of a first of said plurality of inverters is coupled to the input of a second inverter of said plurality of inverters and the input of said first inverter is coupled to the output of said second inverter of said plurality of inverters.

3. The method of claim 2 , wherein:

said plurality of inverters of said radiation hard latch each comprises a pair of MOS transistors.

4. The method of claim 3 , wherein:

the P-channel drive strength of said pair of MOS transistors is approximately double the N-channel drive strength of said pair of MOS transistors.

5. The method of claim 3 , wherein:

the P-channel width-to-length (W/L) ratio of said pair of MOS transistors is about approximately 30/0.24 micrometers.

6. The method of claim 3 , wherein:

the N-channel width-to-length (W/L) ratio of said pair of MOS transistors is about approximately 15/0.24 micrometers.

7. The method of claim 1 , wherein:

said interface comprises a plurality of sets of gates.

8. The method of claim 7 , wherein:

said sets of gates comprise pass transistors.

9. The method of claim 1 , wherein:

each of said plurality of configuration bits comprises a non-inverted output connected to said radiation hard latch through a control gate.

10. The method of claim 1 , wherein:

each of said plurality of configuration bits comprises an inverted output connected to said radiation hard latch through a control gate.

11. The method of claim 1 , wherein:

said radiation hard latch further comprises an inverted output and a non-inverted output.

12. The method of claim 1 , further comprising:

providing a second radiation hard latch coupled to said radiation hard latch.

13. The method of claim 12 , wherein:

said second radiation hard latch is coupled to said radiation hard latch through a plurality of NAND stacks.

14. The method of claim 12 , wherein:

said second radiation hard latch comprises two cross-coupled inverters.

Assignments (6)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037393/0562 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →