Electronic package with a thermal interposer and method of manufacturing the same
View Patent ↗An electronic package includes a die including a thermal interface material through which a primary heat flux path is enabled for conducting heat from the die, an organic substrate, and a thermal interposer provided between the organic substrate and the die, the thermal interposer having an area extending beyond a footprint of the die, the area including the thermal interface material, the thermal interposer conducting heat generated by the die through the thermal interface material such that an auxiliary heat flux path for conducting heat generated in the die is enabled.
1. An electronic package, comprising:
a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
an organic substrate;
a thermal interposer provided between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die, said thermal interposer conducting heat generated by said die through said thermal interface material of said die and said area; and
a device layer formed between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer.
2. The electronic package according to claim 1 , further comprising:
a temperature-sensitive circuit placed at a periphery of said die,
wherein said auxiliary heat flux path reduces a temperature at said periphery of said die.
3. The electronic package according to claim 1 , wherein said primary heat flux path and said auxiliary heat flux path release heat to a heat sink.
4. The electronic package according to claim 1 , wherein said thermal interface material of said die and said area of said thermal interposer interfaces with a heat sink.
5. The electronic package according to claim 1 , wherein said thermal interposer comprises an interposer material having a coefficient of thermal expansion similar to that of silicon, a high thermal conductivity, and a suitability for one of chemical etching and drilling, and
wherein said coefficient of thermal expansion of said interposer material is substantially similar to a coefficient of thermal expansion of said die.
6. The electronic package according to claim 5 , wherein said interposer material comprises silicon.
7. The electronic package according to claim 5 , wherein said die and said organic substrate have a difference in coefficients of thermal expansion, and
wherein said thermal interposer mitigates stress inherently caused by said difference between said die and said organic substrate.
8. The electronic package according to claim 2 , wherein a thickness of said thermal interposer is selected to adjust said temperature at said periphery of said die.
9. The electronic package according to claim 1 , wherein a thermal conductivity of the auxiliary heat flux path is dependent upon a width of said thermal interposer.
10. An electronic package, comprising:
a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
an organic substrate;
a thermal interposer provided between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die;
a device layer formed between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer; and
an augmenting element formed on said thermal interface material of said area,
wherein said thermal interposer conducts heat generated by said die through said thermal interface material of said die and said area and said augmenting element.
11. The electronic package according to claim 10 , wherein said augmenting element comprises a micro-channel cooler.
12. The electronic package according to claim 10 , further comprising:
a temperature-sensitive circuit placed at a periphery of said die,
wherein said auxiliary heat flux path reduces a temperature at said periphery of said die.
13. The electronic package according to claim 10 , wherein said primary heat flux path and said auxiliary heat flux path conduct heat to a heat sink.
14. The electronic package according to claim 10 , wherein said thermal interface material of said die interfaces with a heat sink, and
wherein said augmenting element interfaces with said heat sink.
15. An electronic package, comprising:
a plurality of dies stacked three-dimensionally through which a primary heat flux path is enabled for conducting heat from said plurality of dies;
an organic substrate; and
a thermal interposer provided between said organic substrate and said plurality of dies, said thermal interposer having an area extending beyond a footprint of said plurality of dies, said thermal interposer comprising:
a thermal piston formed on a thermal interface material provided on a first portion of said area, said piston comprising highly conductive material; and
a plurality of molded portions provided on a second portion of said area, said plurality of molded portions surrounding said piston,
wherein said thermal interposer conducts heat generated by said plurality of dies through said thermal interface material and said thermal pistons such that an auxiliary heat flux path for conducting heat generated in said plurality of dies is enabled.
16. The electronic package according to claim 15 , wherein said molded portions and said pistons are planar with a top surface of an uppermost die of said plurality of dies.
17. The electronic package according to claim 15 , wherein said molded portions comprise one of a polished and leveled surface such that said molded portions have a uniform surface for interface with a heat sink.
18. The electronic package according to claim 15 , further comprising:
a temperature-sensitive circuit placed at a periphery of said plurality of dies,
wherein said auxiliary heat flux path reduces a temperature at said periphery of said plurality of dies.
19. The electronic package according to claim 15 , further comprising:
a plurality of local thermal interposers provided underneath each of said plurality of dies, said plurality of local thermal interposers having areas extending beyond a footprint of said plurality of dies,
wherein said plurality of local thermal interposers conduct heat generated by said plurality of said dies through said thermal interface material and said thermal piston such that an auxiliary heat flux path for conducting heat generated in said plurality of said die is enabled.
20. A method of manufacturing an electronic package, comprising:
forming a die comprising thermal interface material through which a primary heat flux path is enabled for conducting heat from said die;
forming an organic substrate;
forming a thermal interposer between said organic substrate and said die, said thermal interposer having an area extending beyond a footprint of said die, said area comprising thermal interface material through which an auxiliary heat flux path is enabled for conducting heat from said die, said thermal interposer conducting heat generated by said die through said thermal interface material of said die and said area; and,
forming a device layer between said die and said thermal interposer, said auxiliary heat flux path reducing a temperature at a periphery of said device layer.
21. The method of manufacturing according to claim 20 , further comprising:
forming a temperature-sensitive circuit at a periphery of said die,
wherein said auxiliary heat flux path reduces a temperature at said periphery of said die.
22. The method of manufacturing according to claim 20 , further comprising:
forming an augmenting element on said thermal interface material of said area,
wherein said thermal interposer conducts heat generated by said die through said thermal interface material of said die and said area and said augmenting element.
23. The method of manufacturing according to claim 20 , further comprising:
forming a plurality of dies stacked three-dimensionally through which said primary heat flux path is enabled for conducting heat from said plurality of dies, said plurality of dies comprising said die;
forming a thermal piston on said thermal interface material of said area, said thermal interface material of said area provided on a first portion of said area, said piston comprising highly conductive material; and
forming a plurality of molded portions on a second portion of said area, said plurality of molded portions surrounding said piston,
wherein said thermal interposer conducts heat generated by said plurality of dies through said thermal interface material of said die and said area and said thermal piston.
24. The electronic package according to claim 1 , wherein a first portion of underfill surrounds a first surface of the thermal interposer, said first surface of the thermal interposer being connected to the organic substrate, and
a second portion of underfill surrounds a connection between a second surface of the thermal interposer and the device layer.
25. The method of manufacturing according to claim 22 , wherein forming said augmenting element comprises forming a micro-channel cooler on said thermal interface material of said area.