Integrated circuit package system
An integrated circuit package system includes: connecting a carrier and an integrated circuit mounted thereover; mounting an interposer, having an opening, over the integrated circuit; connecting an interconnect between the interposer and the carrier through the opening; and forming an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.
1. An integrated circuit package system comprising:
a carrier;
an integrated circuit over the carrier;
an interposer, having an opening, over the integrated circuit;
an interconnect between the interposer having the opening and the carrier through the opening; and
an encapsulation planar with a carrier vertical side of the carrier and an interposer vertical side of the interposer.
2. The system as claimed in claim 1 wherein the interposer includes a contact pad exposed from the encapsulation.
3. The system as claimed in claim 1 wherein the encapsulation includes an encapsulation protrusion above the opening of the interposer.
4. The system as claimed in claim 1 further comprising a thermal structure over the interposer.
5. The system as claimed in claim 1 further comprising a device over the interposer.
6. The system as claimed in claim 1 further comprising a spacer between the integrated circuit and the interposer.
7. The system as claimed in claim 6 wherein the encapsulation includes an encapsulation protrusion through the opening and over the interconnect.
8. The system as claimed in claim 6 wherein the integrated circuit includes a stack of integrated circuits.
9. The system as claimed in claim 6 wherein the spacer includes a wire-in-film B-stage penetrable material.
10. The system as claimed in claim 6 wherein the spacer is over a portion of a first interconnect adjacent to a connection with the integrated circuit.