IP Library › Granted Patent US 8,242,878
Granted Patent B2
US 8,242,878 · App. 12/205,197 · Granted Aug 14, 2012

Resistor and method for making same

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Quick Facts
Patent No.
US 8,242,878
App. No.
12/205,197
Granted
Aug 14, 2012
Kind
B2
Abstract

A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.

Claims (29)

1. A metal strip resistor, comprising:

a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate;

first and second photolithographically formed terminations overlaying the metal strip;

plating on each of the first and second terminations; and

an insulating material overlaying the metal strip between the first and second terminations.

2. The metal strip resistor of claim 1 wherein the metal strip is a metal alloy comprising at least one of nickel, chromium, aluminum, manganese, and copper.

3. The metal strip resistor of claim 1 further comprising an adhesion layer between the terminations and the metal strip.

4. The metal strip resistor of claim 3 wherein the adhesion layer comprises copper, titanium, and tungsten.

5. The metal strip resistor of claim 1 wherein the metal strip resistor is an 0402 size (1.0 mm by 0.5 mm) chip resistor.

6. The metal strip resistor of claim 1 wherein the insulating material comprises a polyimide.

7. The metal strip resistor of claim 1 wherein the insulating material being on both a top side of the metal strip and an opposite bottom side of the metal strip.

8. The metal strip resistor of claim 7 wherein the first and second terminations are on the top side of the metal strip and further comprise a pair of terminations on the bottom side of the metal strip.

9. The metal strip resistor of claim 8 further comprising plating on the pair of terminations on the bottom side of the metal strip.

10. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate, the method comprising:

coating a photolithographic film onto the metal strip;

applying a photolithographic process to form a conductive pattern in the photolithographic film defining first and second terminations;

electroplating the conductive pattern; and

adjusting resistance of the metal strip.

11. The method of claim 10 further comprising applying an adhesion layer to the metal strip before applying the photolithographic process.

12. The method of claim 11 wherein the adhesion layer comprises copper, titanium, and tungsten.

13. The method of claim 10 wherein coating the photolithographic film onto the metal strip comprises coating the photolithographic film to a first side of the metal strip and coating the photolithographic film to a second side of the metal strip and wherein the photolithographic process is applied to both the first side and the second side to form a four terminal resistor.

14. The method of claim 10 wherein the electroplating the conductive pattern includes electroplating the conductive pattern with gold.

15. The method of claim 10 wherein the adjusting resistance is performed using a punch tool.

16. The method of claim 10 further comprising applying an insulating material overlaying the metal strip between the first and second terminations, wherein the insulating material is comprised of a silicone polyester.

17. The method of claim 10 wherein the insulating material is applied using a blade.

18. The method of claim 10 wherein the conductive pattern comprises copper.

19. The method of claim 10 further comprising singulating the metal strip resistor.

20. The method of claim 10 further comprising packaging the metal strip resistor in an 0402 size (1.0 mm by 0.5 mm) chip resistor package.

21. The method of claim 10 wherein the adjusting resistance is performed using a laser.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
CHANGE OF NAME Recorded Nov 19, 2015
From: VISHAY DALE ELECTRONICS, INC.
To: VISHAY DALE ELECTRONICS, LLC
Reel/Frame 037147/0371 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 5, 2008
From: SMITH, CLARK L.; BERTSCH, THOMAS L.; WYATT, TODD L.; VEIK, THOMAS L.; BRUNE, RODNEY
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 021488/0303 →