IP Library Granted Patent US 7,706,207
Granted Patent B2
US 7,706,207 · App. 12/209,477 · Granted Apr 27, 2010

Memory with level shifting word line driver and method thereof

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Quick Facts
Patent No.
US 7,706,207
App. No.
12/209,477
Granted
Apr 27, 2010
Kind
B2
Abstract

A memory includes a bit cell array including a plurality of word lines and address decode circuitry having an output to provide a predecode value. The address decode circuitry includes a first plurality of transistors having a first gate oxide thickness. The memory further includes word line driver circuitry having an input coupled to the output of the address decode circuitry and a plurality of outputs, each output coupled to a corresponding word line of the plurality of word lines. The word line driver includes a second plurality of transistors having a second gate oxide thickness greater than the first gate oxide thickness. A method of operating the memory also is provided.

Claims (34)

1. A circuit device comprising:

a word line driver having a first input to receive a first predecode value, a second input to receive a second predecode value, and an output coupled to a word line of a memory, the word line driver comprising:

a first transistor having a gate electrode coupled to the first input, a first current electrode coupled to the second input, and a second current electrode coupled to a first node;

a second transistor having a gate electrode coupled to a first voltage reference, a first current electrode coupled to a second voltage reference, and a second current electrode coupled to the first node;

a third transistor having a gate electrode coupled to the first node, a first current electrode coupled to a third voltage reference, and a second current electrode coupled to a second node;

a fourth transistor having a gate electrode coupled to the first node, a first current electrode coupled to the second node, and a second current electrode coupled to the first voltage reference; and

wherein the second node is coupled to the word line.

2. The circuit device of claim 1 , wherein the first transistor and fourth transistor comprise n-channel transistors.

3. The circuit device of claim 2 , wherein the second transistor and third transistor comprise p-channel transistors.

4. The circuit device of claim 1 , further comprising:

address decode circuitry having a first output coupled to the first input of the word line driver to provide the first predecode value and a second output coupled to the second input of the word line driver to provide the second predecode value.

5. The circuit device of claim 4 , wherein the address decode circuitry comprises transistors having a first gate oxide thickness and the first transistor, the second transistor, third transistor and fourth transistor have a second gate oxide thickness greater than the first gate oxide thickness.

6. The circuit device of claim 5 , wherein the address decode circuitry is operable at a first voltage and the word line driver is operable at a second voltage greater than the first voltage.

7. The circuit device of claim 6 , wherein the first voltage is approximately 0.9 volts and the second voltage is approximately 1.2 volts.

8. The circuit device of claim 1 , wherein the second voltage reference is substantially equal to the third voltage reference.

9. A memory comprising:

a plurality of global word lines;

global word line driver circuitry having a plurality of outputs, each output coupled to a corresponding global word line of the plurality of global word lines;

address decode circuitry having an output to provide a predecode value;

a local bit cell array comprising a plurality of local word lines;

local word line driver circuitry having an input coupled to the output of the address decode circuitry, an input coupled to a corresponding global word line of the plurality of global word lines, and a plurality of outputs, each output coupled to a corresponding local word line of the plurality of local word lines, wherein the local word line driver circuitry comprises a plurality of voltage level shifters, each voltage level shifter associated with a corresponding local word line of the local bit cell array;

wherein the global word line driver circuitry and address decode circuitry are operable in a first voltage domain; and

wherein the local bit cell array and local word line driver circuitry are operable in a second voltage domain different than the first voltage domain.

10. The memory of claim 9 , wherein each voltage level shifter of the local word line driver circuitry comprises:

a first transistor having a gate electrode coupled to receive one of a corresponding bit value of the predecode value or a value at the corresponding global word line, a first current electrode coupled to receive the other of the corresponding bit value of the predecode value or the value at the corresponding global word line, and a second current electrode coupled to a first node;

a second transistor having a gate electrode coupled to a first voltage reference, a first current electrode coupled to a second voltage reference, and a second current electrode coupled to the first node;

a third transistor having a gate electrode coupled to the first node, a first current electrode coupled to a third voltage reference, and a second current electrode coupled to a second node;

a fourth transistor having a gate electrode coupled to the first node, a first current electrode coupled to the second node, and a second current electrode coupled to the first voltage reference; and

wherein the second node is coupled to the corresponding local word line.

11. The memory of claim 10 , wherein the second voltage reference is substantially equal to the third voltage reference.

12. The memory of claim 10 , wherein:

the global word line driver circuitry and the address decode circuitry comprise transistors having a first gate oxide thickness; and

the local bit cell array and local word line driver circuitry comprise transistors having a second gate oxide thickness different than the first gate oxide thickness.

13. The memory of claim 12 , wherein the first gate oxide thickness is less than 14 angstroms and wherein the second gate oxide thickness is less than 19 angstroms.

Assignments (28)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
RELEASE OF SECURITY INTEREST Recorded May 29, 2017
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP USA, INC. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 042610/0451 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
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From: FREESCALE SEMICONDUCTOR, INC.
To: VLSI TECHNOLOGY LLC
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From: FREESCALE SEMICONDUCTOR, INC.
To: VLSI TECHNOLOGY LLC
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PATENT RELEASE Recorded Jul 22, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC., AS GLOBAL COLLATERAL AGENT; MORGAN STANLEY SENIOR FUNDING, INC., AS RCF ADMINISTRATIVE AGENT; MORGAN STANLEY SENIOR FUNDING, INC., AS THE NOTES COLLATERAL AGENT
To: NXP B.V.
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From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
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SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
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To: MORGAN STANLEY SENIOR FUNDING, INC.
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ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
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SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
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