Integrated circuit package system with anti-peel contact pads
View Patent ↗An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal; connecting an integrated circuit with the anti-peel pad; and forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall.
1. A method for manufacture of an integrated circuit package system comprising:
forming an anti-peel pad having both a concave ring and an external terminal with the concave ring surrounding the external terminal and having an inner wall integral with the external terminal and opposite a peripheral wall;
connecting an integrated circuit with the anti-peel pad; and
forming an encapsulation over the integrated circuit, the concave ring, and the external terminal, the concave ring spaced away from a bottom side of the encapsulation by an overhang height.
2. The method as claimed in claim 1 wherein:
forming the anti-peel pad includes forming an inner recess bounded by the inner wall of the concave ring and the external terminal; and
forming the encapsulation includes filling the inner recess.
3. The method as claimed in claim 1 wherein forming the anti-peel pad having both the concave ring and the external terminal includes forming the concave ring having an interior portion adjacent to the peripheral wall and the external terminal.
4. The method as claimed in claim 1 wherein connecting the integrated circuit and the anti-peel pad includes connecting the integrated circuit and the external terminal.
5. The method as claimed in claim 1 wherein forming the encapsulation includes exposing the external terminal.
6. A method for manufacture of an integrated circuit package system comprising:
forming a protrusion ring from a manufacturing carrier;
forming a mask over the manufacturing carrier with an interior of the protrusion ring exposed;
forming an anti-peel pad over the protrusion ring and over the mask with the anti-peel pad having both a concave ring and the external terminal, and the concave ring having a peripheral wall and surrounding the external terminal;
removing the mask with the peripheral wall overhanging the manufacturing carrier;
connecting an integrated circuit with the external terminal;
forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the external terminal exposed from the encapsulation, terminal, the concave ring spaced away from a bottom side of the encapsulation by an overhang height; and
removing the manufacturing carrier with the anti-peel pad and the encapsulation exposed.
7. The method as claimed in claim 6 wherein forming the encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall of the concave ring includes forming the peripheral wall having the overhang height above the bottom side of the encapsulation.
8. The method as claimed in claim 6 wherein:
forming the anti-peel pad having both the concave ring and the external terminal includes forming the concave ring having an interior portion adjacent to the peripheral wall and the external terminal; and
forming an outer recess bounded by the peripheral wall and the interior portion.
9. The method as claimed in claim 6 wherein forming the encapsulation includes forming the bottom side of the encapsulation coplanar with the external terminal of the anti-peel pad.
10. The method as claimed in claim 6 wherein forming the anti-peel pad having both the concave ring and the external terminal includes forming the concave ring having the peripheral wall with the overhang height above the external terminal.
11. An integrated circuit package system comprising:
an anti-peel pad having both a concave ring and an external terminal with the concave ring, surrounding the external terminal and having an inner wall integral with the external terminal and opposite a peripheral wall;
an integrated circuit connected to the anti-peel pad; and
an encapsulation over the integrated circuit, the concave ring, and the external terminal, the concave ring spaced away from the bottom side of the encapsulation by an overhang height.
12. The system as claimed in claim 11 wherein the anti-peel pad includes an inner recess, bounded by the inner wall of the concave ring and the external terminal, and filled with the encapsulation.
13. The system as claimed in claim 11 wherein the anti-peel pad having both the concave ring and the external terminal includes the concave ring having an interior portion adjacent to the peripheral wall and the external terminal.
14. The system as claimed in claim 11 wherein the integrated circuit connected to the anti-peel pad includes the integrated circuit connected to the external terminal.
15. The system as claimed in claim 11 wherein the external terminal exposed from the encapsulation.
16. The system as claimed in claim 11 wherein:
the integrated circuit connected to the external terminal; and
the external terminal exposed from the encapsulation.
17. The system as claimed in claim 16 wherein the peripheral wall includes the overhang height above the bottom side of the encapsulation.
18. The system as claimed in claim 16 wherein the concave ring includes an interior portion adjacent to the peripheral wall and the external terminal with an outer recess bounded by the peripheral wall and the interior portion.
19. The system as claimed in claim 16 wherein the encapsulation includes the bottom side coplanar with the external terminal of the anti-peel pad.
20. The system as claimed in claim 16 wherein the peripheral wall includes the overhang height above the external terminal.