IP Library Granted Patent US 8,083,463
Granted Patent B2
US 8,083,463 · App. 12/269,309 · Granted Dec 27, 2011

Mini clean room for preventing wafer pollution and using method thereof

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Quick Facts
Patent No.
US 8,083,463
App. No.
12/269,309
Granted
Dec 27, 2011
Kind
B2
Abstract

A mini clean room for preventing wafer pollution includes a robot arm, a clean room body slidably disposed on the robot arm and at least one lock unit which is rotatably connected with the clean room body. During operation, the robot arm extends out of the clean room body to carry a wafer waiting to be processed, and then moves back into the clean room body which can provide an isolated and protected space for the wafer to avoid that the wafer is polluted. The present invention also discloses a method of using a mini clean room for preventing wafer pollution.

Claims (19)

1. A method of using a mini clean room for preventing wafer pollution, wherein the mini clean room includes a robot arm, a clean room body slidably disposed on one end of the robot arm and at least one lock unit, the clean room body has an opening and the lock unit is pivotingly disposed on the clean room body, the method comprising the steps of:

transmitting a trigger signal from the robot arm to the lock unit;

in response to the trigger signal, the lock unit opening the clean room body and the robot arm extending out of the opening

wherein the clean room body simultaneously moves in a direction opposite to the direction in which the robot arm moves so that the robot arm extends out of the opening quickly for receiving the wafer; and

causing the robot arm moving back to an initial position and transmitting a trigger signal to the lock unit again to cause the lock unit to close the opening for sealing the clean room body,

thereby preventing the wafer carried by the robot arm from being polluted by particles during transportation.

2. The method of using a mini clean room for preventing wafer pollution as claimed in claim 1 , wherein the robot arm is located between two machining stations for carrying the wafer from one machining station to the other machining station.

3. The method of using a mini clean room for preventing wafer pollution as claimed in claim 1 , wherein the trigger signal controls the lock unit with respect to opening or closing.

4. The method of using a mini clean room for preventing wafer pollution as claimed in claim 1 , wherein, after receiving the wafer, the robot arm moves back to the initial position and transmits the trigger signal to the lock unit causing the lock unit to close the opening to seal the clean room body, wherein the clean room body simultaneously moves in a direction opposite to the direction in which the robot arm is moving, so that the robot arm moves back into the clean room body quickly.

5. A method of using a mini clean room for preventing wafer pollution, wherein the mini clean room includes a robot arm, a clean room body slidably disposed on one end of the robot arm and at least one lock unit, the clean room body has an opening and the lock unit is pivotingly disposed on the clean room body, the method comprising the steps of:

transmitting a trigger signal from the robot arm to the lock unit;

in response to the trigger signal, the lock unit opening the clean room body and the robot arm extending out of the opening to receive a wafer;

after receiving the wafer, causing the robot arm to move back to an initial position and transmit the trigger signal to the lock unit, causing the lock unit to close the opening to seal the clean room body,

wherein the clean room body simultaneously moves in a direction opposite to the direction in which the robot arm is moving, so that the robot arm moves back into the clean room body quickly; and

causing the lock unit to close the opening for sealing the clean room body,

thereby preventing the wafer carried by the robot arm from being polluted by particles during transportation.

6. The method of using a mini clean room for preventing wafer pollution as claimed in claim 5 , wherein the robot arm is located between two machining stations for carrying the wafer from one machining station to the other machining station.

7. The method of using a mini clean room for preventing wafer pollution as claimed in claim 5 , wherein the trigger signal controls the lock unit with respect to opening or closing.

8. The method of using a mini clean room for preventing wafer pollution as claimed in claim 5 , wherein as the lock unit opens the opening of the clean room body and the robot arm extends out of the opening to receive a wafer, the clean room body simultaneously moves in a direction opposite to the direction in which the robot arm moves so that the robot arm extends out of the opening quickly for receiving the wafer.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 13, 2008
From: JHONG, JHIN-SIANG; CHENG, JEN JUI; HUANG, CHEN LUNG
To: INOTERA MEMORIES, INC.
Reel/Frame 021833/0702 →