System and method to provide RF shielding for a MEMS microphone package

1. A semiconductor package comprising:

a substrate;

an opening formed through the substrate;

a first RF shield formed around a perimeter of the opening; and

a first die attached to a first surface of the substrate and positioned over the opening;

wherein the first RF shield comprises a plurality of first vias formed around a perimeter of the opening, each of the plurality of first vias formed around a perimeter of the opening electrically attached to ground planes formed on the first surface and a second surface of the substrate.

2. A semiconductor package in accordance with claim 1 , further comprising:

a plurality of second vias formed around a perimeter of the substrate, each of the plurality of second vias formed around the perimeter of the substrate electrically attached to ground planes formed on the first surface and a second surface of the substrate; and

a second RF shield attached to the perimeter of first surface of the substrate and to the plurality of second vias formed around the perimeter of the substrate.

3. A semiconductor package in accordance with claim 1 , further comprising a second die attached to the first surface of the substrate and electrically attached to the first die.

4. A semiconductor package in accordance with claim 1 , wherein the first die is a transducer.

5. A semiconductor package in accordance with claim 2 , wherein the second RF shield is a metal can.

6. A semiconductor package in accordance with claim 1 , further comprising a plating layer formed in an interior surface of each of the plurality of first vias formed around the perimeter of the opening.

7. A semiconductor package in accordance with claim 2 , further comprising a plating layer formed in an interior surface of each of the plurality of second vias formed around the perimeter of the substrate.

8. A semiconductor package in accordance with claim 1 , wherein the substrate comprises:

an insulative layer having a first surface and a second surface; and

at least one metal layer applied to the first and second surfaces of the insulative layer.

9. A semiconductor package in accordance with claim 8 , wherein the substrate further comprises a solder mask layer applied to the at least one metal layer applied to the first and second surfaces of the insulative layer.

10. A semiconductor package comprising:

a substrate;

an opening formed through the substrate;

means for RF shielding formed around a perimeter of the opening; and

a first die attached to the first surface of the substrate and positioned over the opening;

wherein the means for forming an RF shield around a perimeter of the opening are a plurality of first vias formed around a perimeter of the opening, each of the plurality of first vias formed around the perimeter of the opening electrically attached to ground planes formed on the first surface and a second surface of the substrate.

11. A semiconductor package in accordance with claim 10 , further comprising:

means formed around a perimeter of the substrate for electrically attaching ground planes formed on the first surface and a second surface of the substrate; and

an RF shield attached to the perimeter of first surface and to the means formed around a perimeter of the substrate.

12. A semiconductor package in accordance with claim 11 , wherein the means formed around a perimeter of the substrate comprises a plurality of second vias formed around a perimeter of the substrate, each of the plurality of second vias formed around the perimeter of the substrate electrically attached to ground planes formed on the first surface and the second surface of the substrate.

13. A method of forming a semiconductor package comprising:

providing a substrate having an opening formed through the substrate;

forming an RF shield around a perimeter of the opening, wherein forming the RF shield around the perimeter of the opening comprises forming a first plurality of vias around a perimeter of the opening, wherein each of the first plurality of vias formed around a perimeter of the opening is electrically attached to ground planes formed on the first surface and a second surface of the substrate; and

attaching a first die to the first surface of the substrate and positioned over the opening.

14. The method of claim 13 , further comprising:

forming a second plurality of vias around a perimeter of the substrate, each of the second plurality of vias formed around the perimeter of the substrate electrically attached to ground planes formed on the first surface and the second surface of the substrate; and

attaching a second RF shield to the perimeter of first surface of the substrate and to the second plurality of vias formed around a perimeter of the substrate.

15. A semiconductor package in accordance with claim 1 , further comprising a plurality of second vias formed around a perimeter of the substrate, each of the plurality of second vias formed around the perimeter of the substrate electrically attached to ground planes formed on the first surface and a second surface of the substrate for attaching a second RF shield around a perimeter of the substrate.

16. A semiconductor package in accordance with claim 10 , further comprising means formed around a perimeter of the substrate for electrically attaching ground planes formed on the first surface and a second surface of the substrate and for attaching an RF shield to the perimeter of first surface.

17. A semiconductor package in accordance with claim 10 , further comprising means formed around a perimeter of the substrate for grounding an RF shield to the perimeter of first surface.