IP Library Granted Patent US 7,893,714
Granted Patent B2
US 7,893,714 · App. 12/367,310 · Granted Feb 22, 2011

High voltage analog multiplex switch integrated circuit architecture

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Quick Facts
Patent No.
US 7,893,714
App. No.
12/367,310
Granted
Feb 22, 2011
Kind
B2
Abstract

An integrated circuit high voltage analog switch has digital logic-level control interface circuit. A level translator is coupled to the digital logic-level control interface circuit. A plurality of output multi-channel high voltage switches is coupled to the level translator.

Claims (22)

1. An integrated circuit high voltage analog switch comprising:

a digital logic-level control interface circuit;

a level translator coupled to the digital logic-level control interface circuit;

a plurality of output multi-channel high voltage switches coupled to the level translator;

wherein each of the plurality of output multi-channel high voltage switches comprises a first and second MOSFET, a second MOSFET of each output multi-channel high voltage switch is coupled to a first MOSFET of a successive output multi-channel high voltage switch to form a common terminal between successive output multi-channel high voltage switches.

2. An integrated circuit high voltage analog switch in accordance with claim 1 wherein the plurality of output multi-channel high voltage switches is a plurality of multiplexors/demultiplexors.

3. An integrated circuit high voltage analog switch in accordance with claim 2 wherein the plurality of multiplexors/demultiplexors are configured as one of: 2 to 1, 3 to 1, or more to 1 multiplexers providing one of 15, 16, 24 or 32 switch channels.

4. An integrated circuit high voltage analog switch comprising:

a digital logic-level control interface circuit;

a level translator coupled to the digital logic-level control interface circuit;

a plurality of output multi-channel high voltage switches coupled to the level translator, wherein successive output multi-channel high voltage switches are connected together to form a common terminal between successive output multi-channel high voltage switches;

wherein each of the plurality of output multi-channel high voltage switches comprises a first and second MOSFET, a second MOSFET of each output multi-channel high voltage switch is coupled to a first MOSFET of a successive output multi-channel high voltage switch to form a common terminal.

5. An integrated circuit high voltage analog switch in accordance with claim 4 wherein the plurality of output multi-channel high voltage switches are a plurality of multiplexors/demultiplexors, the plurality of multiplexors/demultiplexors are configured as one of: 2 to 1, 3 to 1, or more to 1 multiplexers providing one of 15, 16, 24 or 32 switch channels.

6. An ultrasound imaging system having an integrated circuit high voltage analog switching circuit in accordance with claim 5 wherein the plurality of multiplexors/demultiplexors configured as one of: 2 to 1, 3 to 1, or more to 1 multiplexers.

7. An ultrasound imaging system having an integrated circuit high voltage analog switching circuit in accordance with claim 5 wherein the digital logic-level control interface circuit comprises:

a shift register having a data input pin, data output pin and a clock signal pin; and

a latch register coupled to an output of the shift register and an output coupled to the level translator.

8. An ultrasound imaging system having an integrated circuit high voltage analog switching circuit comprising:

a digital logic-level control interface circuit;

a level translator coupled to the digital logic-level control interface circuit;

a plurality of multiplexors/demultiplexors, wherein successive multiplexors/demultiplexors are connected together to form a common terminal;

wherein each of the plurality of multiplexors/demultiplexors comprises a first and second MOSFET, a second MOSFET of each of the multiplexors/demultiplexors is coupled a first MOSFET of a successive multiplexors/demultiplexors to form a common terminal.

Assignments (17)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0001 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 059666/0545 →
RELEASE OF SECURITY INTEREST Recorded Feb 25, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059333/0222 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
SECURITY INTEREST Recorded Sep 18, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 047103/0206 →
SECURITY INTEREST Recorded Jun 25, 2018
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 046426/0001 →
SECURITY INTEREST Recorded Feb 10, 2017
From: MICROCHIP TECHNOLOGY INCORPORATED
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 041675/0617 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2014
From: SUPERTEX LLC
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 034689/0257 →
CHANGE OF NAME Recorded Dec 19, 2014
From: SUPERTEX, INC.
To: SUPERTEX LLC
Reel/Frame 034682/0134 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 6, 2009
From: CHU, CHING
To: SUPERTEX, INC.
Reel/Frame 022221/0167 →