INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

1 . A method of manufacture of an integrated circuit packaging system comprising:

providing a bottom package including a first device over a first substrate and a second substrate over the first device;

forming an encapsulation material over the bottom package with an opening over the second substrate; and

forming a conductive post within the opening.

2 . The method as claimed in claim 1 wherein:

forming the conductive post within the opening includes plating.

3 . The method as claimed in claim 1 wherein:

forming the conductive post within the opening includes squeezing a conductive material into the opening.

4 . The method as claimed in claim 1 wherein:

forming the conductive post within the opening includes fixing or dropping in the conductive post.

5 . The method as claimed in claim 1 wherein:

forming the encapsulation material over the bottom package includes utilizing a top mold chase with a protrusion aligned over a bond pad.

6 . The method as claimed in claim 1 further comprising:

forming an interface between a bond pad and the conductive post.

7 . A method of manufacture of an integrated circuit packaging system comprising:

providing a bottom package including a leadframe interposer with a conductive post;

forming an encapsulation material over the bottom package; and

removing the encapsulation material from over the leadframe interposer to expose the conductive post.

8 . The method as claimed in claim 7 wherein:

removing the encapsulation material from over the leadframe interposer to expose the conductive post includes employing an implement to scrape away the encapsulation material.

9 . The method as claimed in claim 7 wherein:

providing the leadframe interposer includes forming the conductive post over each of a bond pad in a single step.

10 . The method as claimed in claim 7 wherein:

providing the leadframe interposer includes providing the leadframe interposer made from a conductive material and a non-conductive material.

11 . The method as claimed in claim 7 wherein:

providing the leadframe interposer includes providing the leadframe interposer with each of the conductive post interconnected by a spacer bar.

12 . The method as claimed in claim 7 further comprising:

forming an interface between a bond pad and the conductive post.

13 . An integrated circuit packaging system comprising:

a bottom package including a first device over a first substrate and a second substrate over the first device;

a leadframe interposer with a conductive post over the second substrate; and

an encapsulation material.

14 . The system as claimed in claim 13 wherein:

the leadframe interposer is made from a conductive material and a non-conductive material.

15 . The system as claimed in claim 13 wherein:

the leadframe interposer includes each of the conductive post interconnected by a spacer bar.

16 . The system as claimed in claim 13 wherein:

the leadframe interposer electrically interconnects a top package to a carrier substrate.

17 . The system as claimed in claim 13 wherein:

the first device and the second substrate are electrically connected to the first substrate.

18 . The system as claimed in claim 13 wherein:

the second substrate is electrically connected to a top package by the conductive post and electrically connected to the first substrate by an interconnection.

19 . The system as claimed in claim 13 wherein:

the bottom package includes a shield.

20 . The system as claimed in claim 13 wherein:

the bottom package includes a system-in-package device.

21 . The system as claimed in claim 13 wherein:

the bottom package includes an internal stacking module.

22 . The system as claimed in claim 13 wherein:

the bottom package includes lead-in-film technology.

23 . The system as claimed in claim 13 further comprising:

an interface between a bond pad and the conductive post.