IP Library Granted Patent US 7,956,333
Granted Patent B2
US 7,956,333 · App. 12/457,929 · Granted Jun 7, 2011

Moving module of a wafer ion-implanting machine

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Quick Facts
Patent No.
US 7,956,333
App. No.
12/457,929
Granted
Jun 7, 2011
Kind
B2
Abstract

A moving module of a wafer ion-implanting machine includes a wafer carrier, a moving shaft, a base, a pair of first magnets, a fixture body, and a plurality of second magnets. One end of the wafer carrier is pivotally connected to a wafer tray; and the other end is fixed onto one end of the moving shaft. The base is fixed to the other end of the moving shaft. The moving shaft drives the wafer carrier and the base to move lengthwise. The pair of first magnets is fixed to the base. The fixture body is located between the pair of first magnets. The second magnets are fixed onto the fixture body and one of them forms compelling magnetic force between one of the first magnets. Thereby, the friction generated by contacting any of the first magnets with the fixture body can be prevented, thus increasing the production yield.

Claims (27)

1. A moving module of a wafer ion-implanting machine, comprising:

a wafer carrier, one end of which is pivotally connected to a wafer tray;

a moving shaft, one end of which is fixed to the other end of the wafer carrier so that the moving shaft drives the wafer carrier to move lengthwise;

a base, which is fixed to the other end of the moving shaft so that the moving shaft drives the base to move lengthwise;

a pair of first magnets, which are fixed to the base;

a fixture body, which is located between the pair of first magnets; and

a plurality of second magnets, which are fixed onto the fixture body and form a compelling magnetic force between themselves and the first magnets.

2. The moving module of claim 1 , wherein the first magnets are permanent magnets.

3. The moving module of claim 1 , wherein the first magnets are electrically induced magnets.

4. The moving module of claim 1 , wherein the second magnets are permanent magnets.

5. The moving module of claim 1 , wherein the second magnets are electrically induced magnets.

6. The moving module of claim 1 , wherein the amount of the second magnets on each side of the fixture body is equal.

7. The moving module of claim 1 , wherein there is a gap between each of the second magnets and each of the first magnets.

8. The moving module of claim 1 , wherein the first magnets and the second magnets are in the shape of rectangle with the same size.

9. A moving module of a wafer ion-implanting machine, comprising:

a wafer carrier, one end of which is pivotally connected to a wafer tray;

a moving shaft, one end of which is fixed to the other end of the wafer carrier so that the moving shaft drives the wafer carrier to move lengthwise;

a base, which is fixed to the other end of the moving shaft so that the moving shaft drives the base to move lengthwise;

a pair of magnets, which are fixed to the base; and

a fixture body, which is located between the pair of magnets, and is magnetic so that the pair of magnets maintain a compelling magnetic force between opposite sides of the fixture body.

10. The moving module of claim 9 , wherein the magnets are permanent magnets.

11. The moving module of claim 9 , wherein the magnets are electrically induced magnets.

12. The moving module of claim 9 , wherein the fixture body is permanent magnets.

13. The moving module of claim 9 , wherein the fixture body is electrically induced magnets.

14. The moving module of claim 9 , wherein the amount of second magnets on each side of the fixture body is equal.

15. The moving module of claim 9 , wherein there is a gap between the fixture body and the magnets.

16. The moving module of claim 9 , wherein at least one of the magnets has a length smaller than the fixture body.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →