IP Library › Granted Patent US 8,248,202
Granted Patent B2
US 8,248,202 · App. 12/536,792 · Granted Aug 21, 2012

Metal strip resistor for mitigating effects of thermal EMF

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,248,202
App. No.
12/536,792
Granted
Aug 21, 2012
Kind
B2
Abstract

A metal strip resistor includes a resistor body having a resistive element formed from a strip of an electrically resistive metal material and a first termination electrically connected to the resistive element to form a first junction and a second termination electrically connected to the resistive element to form a second junction, the first termination and the second termination formed from strips of electrically conductive metal material. The resistive element, the first termination, and the second termination being arranged mitigate thermally induced voltages between the first junction and the second junction.

Claims (42)

1. A resistor comprising:

a first termination and a second termination;

a body having at least one resistive element, the body having a first end coupled to the first termination to form a first junction and a second end coupled to the second termination to form a second junction;

wherein the body is folded onto itself defining a gap, the first termination and second termination being disposed on opposite sides of the gap; and

a thermally conductive material disposed in at least a portion of the gap.

2. The resistor of claim 1 wherein the thermally conductive material thermally connects the first and second junction.

3. The resistor of claim 1 wherein the body has a single resistive element.

4. The resistor of claim 3 wherein the body is folded through the resistive element wherein the resistive element has a first resistive element portion disposed on one side of the gap and a second resistive element portion disposed on an opposite side of the gap.

5. The resistor of claim 4 wherein the gap is disposed between the first resistive element portion and the second resistive element portion, wherein the thermally conductive material thermally connects the first resistive element portion and the second resistive element portion.

6. The resistor of claim 1 wherein the body has a plurality of resistive elements.

7. The resistor of claim 1 wherein the body has first and second resistive elements.

8. The resistor of claim 7 wherein the body is folded through a point located between the first and second resistive element wherein the first resistive element is disposed on one side of the gap and the second resistive element is disposed on an opposite side of the gap, wherein the thermally conductive material thermally connects the first resistive element and the second resistive element.

9. The resistor of claim 1 wherein the thermally conductive material further comprises an adhesive.

10. The resistor of claim 1 wherein the thermally conductive material is electrically non-conductive.

11. The resistor of claim 1 wherein the first termination and the second termination are comprised of strips of electrically conductive metal material.

12. The resistor of claim 1 wherein the first termination and the second termination are comprised of copper.

13. The resistor of claim 1 wherein the body is folded onto itself and bonded with a thermally conductive adhesive thereby mitigating thermally induced voltages between the first junction and the second junction.

14. The resistor of claim 1 wherein the body is folded at its midpoint.

15. A method of manufacturing a resistor, comprising:

joining a first end of a body to a first termination forming a first junction and joining a second end of the body to a second termination forming a second junction, wherein the body includes at least one resistive element;

folding the body onto itself, forming a gap, the first termination and second termination being disposed on opposite sides of the gap; and

applying a thermally conductive material in at least a portion of the gap.

16. The method of claim 15 wherein the thermally conductive material thermally connects the first and second junction.

17. The method of claim 15 wherein the body has a single resistive element.

18. The method of claim 15 wherein the body is folded through the resistive element wherein the resistive element has a first resistive element portion disposed on one side of the gap and a second resistive element portion disposed on an opposite side of the gap.

19. The method of claim 18 wherein the gap is disposed between the first resistive element portion and the second resistive element portion, wherein the thermally conductive material thermally connects the first resistive element portion and the second resistive element portion.

20. The method of claim 15 wherein the body has a plurality of resistive elements.

21. The method of claim 15 wherein the body has first and second resistive elements.

22. The method of claim 21 wherein the body is folded through a point located between the first and second resistive element wherein the first resistive element is disposed on one side of the gap and the second resistive element is disposed on an opposite side of the gap, wherein the thermally conductive material thermally connects the first resistive element and the second resistive element.

23. The method of claim 15 wherein the thermally conductive material further comprises an adhesive.

24. The method of claim 15 wherein the thermally conductive material is electrically non-conductive.

25. The method of claim 15 wherein the first termination and the second termination are comprised of strips of electrically conductive metal material.

26. The method of claim 15 wherein the first termination and the second termination are comprised of copper.

27. The method of claim 15 wherein the body is folded onto itself and bonded with a thermally conductive adhesive thereby mitigating thermally induced voltages between the first junction and the second junction.

28. The method of claim 15 wherein the body is folded at its midpoint.

29. A resistor comprising:

a first termination and a second termination;

a body having at least one resistive element, the body having a first end coupled to the first termination to form a first junction having a length and a second end coupled to the second termination to form a second junction having the same length;

wherein the resistive element, the first termination, and the second termination are arranged to have a temperature gradient along the length of each junction, mitigating thermally induced voltages between the first junction and the second junction.

30. A method of manufacturing a resistor, comprising:

joining a first end of a body to a first termination forming a first junction having a length and joining a second end of the body to a second termination forming a second junction having the same length, wherein the body includes at least one resistive element;

wherein the resistive element, the first termination, and the second termination are arranged to have a temperature gradient along the length of each junction, mitigating thermally induced voltages between the first junction and the second junction.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE
Reel/Frame 049772/0898 →
RELEASE OF SECURITY INTEREST Recorded Jul 17, 2019
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.; VISHAY TECHNO COMPONENTS, LLC; VISHAY EFI, INC.; VISHAY VITRAMON, INC.; SPRAGUE ELECTRIC COMPANY
Reel/Frame 049826/0312 →
SECURITY INTEREST Recorded Jun 12, 2019
From: VISHAY DALE ELECTRONICS, INC.; DALE ELECTRONICS, INC.; VISHAY DALE ELECTRONICS, LLC; VISHAY-DALE, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY-SILICONIX, INC.; VISHAY-SILICONIX; VISHAY SPRAGUE, INC.; VISHAY EFI, INC.; SPRAGUE ELECTRIC COMPANY; VISHAY GENERAL SEMICONDUCTOR, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049440/0876 →
SECURITY AGREEMENT Recorded Dec 10, 2015
From: VISHAY DALE ELECTRONICS, LLC
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 037261/0616 →
SECURITY AGREEMENT Recorded Jan 21, 2011
From: VISHAY INTERTECHNOLOGY, INC.; VISHAY DALE ELECTRONICS, INC.; SILICONIX INCORPORATED; VISHAY SPRAGUE, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 025675/0001 →
RELEASE OF SECURITY INTEREST Recorded Dec 14, 2010
From: COMERICA BANK, AS AGENT, A TEXAS BANKING ASSOCIATION (FORMERLY A MICHIGAN BANKING CORPORATION)
To: VISHAY SPRAGUE, INC., SUCCESSOR-IN-INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC, A DELAWARE CORPORATION; VISHAY DALE ELECTRONICS, INC., A DELAWARE CORPORATION; VISHAY INTERTECHNOLOGY, INC., A DELAWARE CORPORATION; SILICONIX INCORPORATED, A DELAWARE CORPORATION; VISHAY MEASUREMENTS GROUP, INC., A DELAWARE CORPORATION; VISHAY GENERAL SEMICONDUCTOR, LLC, F/K/A GENERAL SEMICONDUCTOR, INC., A DELAWARE LIMITED LIABILITY COMPANY; VISHAY VITRAMON, INCORPORATED, A DELAWARE CORPORATION; YOSEMITE INVESTMENT, INC., AN INDIANA CORPORATION
Reel/Frame 025489/0184 →
SECURITY AGREEMENT Recorded Mar 2, 2010
From: VISHAY SPRAGUE, INC., SUCCESSOR IN INTEREST TO VISHAY EFI, INC. AND VISHAY THIN FILM, LLC; VISHAY DALE ELECTRONICS, INC.; VISHAY INTERTECHNOLOGY, INC.; SILICONIX INCORPORATED; VISHAY MEASUREMENTS GROUP, INC.
To: COMERICA BANK, AS AGENT
Reel/Frame 024006/0515 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 6, 2009
From: BRACKHAN, DOUG; SMITH, CLARK L.; VEIK, THOMAS L.
To: VISHAY DALE ELECTRONICS, INC.
Reel/Frame 023062/0949 →