Integrated circuit packaging system with a leaded package and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: providing a first device having a first exposed side and a first inward side; connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device; connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal; and applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant, the exposed foot on an end of the system connector opposite the first device.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a first device having a first exposed side, a first inward side, and a first through conductor connecting the first inward side to the first exposed side;
connecting a second device having a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device, wherein the first through conductor is outside a perimeter of the second inward side;
connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal and extended below a plane having the second exposed side; and
applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant and extending between tapered sides, the exposed foot on an end of the system connector opposite the first device.
2. The method as claimed in claim 1 wherein connecting the system connector includes forming the system connector having the exposed leg extend towards a plane having the second exposed side.
3. The method as claimed in claim 1 wherein connecting the system connector includes forming the system connector having the exposed leg extend towards a plane having the first exposed side.
4. The method as claimed in claim 1 further comprising:
forming a first exposed conductor on the first exposed side; and
connecting an external package to the first exposed conductor.
5. The method as claimed in claim 1 further comprising:
connecting a circuit board to the system connector;
forming a second exposed conductor on the second exposed side; and
connecting a package connector between the second exposed conductor and the circuit board.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a first device having a first exposed side, a first inward side, and a first through conductor connecting the first inward side to the first exposed side;
connecting a second device with a second exposed side and a second inward side facing the first inward side to the first device, the second device having planar dimensions less than planar dimensions of the first device, wherein the first through conductor is outside a perimeter of the second inward side;
attaching a device interconnect to the second inward side and the first inward side;
connecting a system connector to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal and extended below a plane having the second exposed side; and
applying an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant and extending between tapered sides, the exposed foot on an end of the system connector opposite the first device.
7. The method as claimed in claim 6 wherein connecting the system connector includes forming the system connector having the exposed leg and the exposed foot extended away from the first device.
8. The method as claimed in claim 6 wherein connecting the system connector includes forming the system connector having the exposed leg and the exposed foot extended away from the second device.
9. The method as claimed in claim 6 further comprising:
forming a second exposed conductor on the second exposed side; and
connecting a through conductor in the second device to the second exposed conductor and the second inward side.
10. The method as claimed in claim 6 further comprising applying an underfill around the device interconnect between the first inward side and the second inward side.
11. An integrated circuit packaging system comprising:
a first device having a first exposed side, a first inward side, and a first through conductor connecting the first inward side to the first exposed side;
a second device having a second exposed side and a second inward side facing the first inward side connected to the first device, the second device having planar dimensions less than planar dimensions of the first device, wherein the first through conductor is outside a perimeter of the second inward side;
a system connector connected to a perimeter of the first inward side, the system connector having an exposed leg partially vertical and an exposed foot partially horizontal and extended below a plane having the second exposed side; and
an encapsulant exposing the first exposed side, the second exposed side, the exposed leg, and the exposed foot, the exposed leg offset from the encapsulant and between tapered sides, the exposed foot on an end of the system connector opposite the first device.
12. The system as claimed in claim 11 wherein the system connector includes the exposed leg extended towards a plane having the second exposed side.
13. The system as claimed in claim 11 wherein the system connector includes the exposed leg extended towards a plane having the first exposed side.
14. The system as claimed in claim 11 further comprising:
a first exposed conductor on the first exposed side; and
an external package connected to the first exposed conductor.
15. The system as claimed in claim 11 further comprising:
a circuit board connected to the system connector;
a second exposed conductor on the second exposed side; and
a package connector between the second exposed conductor and the circuit board.
16. The system as claimed in claim 11 further comprising a device interconnect attached to the second inward side and the first inward side.
17. The system as claimed in claim 16 wherein the system connector includes the exposed leg and the exposed foot extended away from the first device.
18. The system as claimed in claim 16 wherein the system connector includes the exposed leg and the exposed foot extended away from the second device.
19. The system as claimed in claim 16 further comprising:
a second exposed conductor on the second exposed side; and
a through conductor in the second device connected to the second exposed conductor and the second inward side.
20. The system as claimed in claim 16 further comprising an underfill around the device interconnect between the first inward side and the second inward side.