Integrated circuit packaging system with cavity and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.
1. A method of manufacture of an integrated circuit packaging system comprising:
mounting a substrate-less integrated circuit package, having an internal adhesive layer and a terminal having characteristics of an intermetallic compound, over a substrate;
connecting the substrate and the substrate-less integrated circuit package; and
forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed, the base encapsulation having a cavity exposing the internal adhesive layer.
2. The method as claimed in claim 1 further comprising forming the substrate-less integrated circuit package having the terminal having characteristics of the intermetallic compound includes:
connecting a module interconnect and a conductive layer resulting in the intermetallic compound layer at the attachment site; and
forming the terminal by removing the conductive layer and exposing the intermetallic compound of the terminal.
3. The method as claimed in claim 1 further comprising forming the substrate-less integrated circuit package includes forming a module encapsulation substantially coplanar with the terminal.
4. The method as claimed in claim 1 further comprising forming the substrate-less integrated circuit package includes forming a module encapsulation having a taper edge.
5. The method as claimed in claim 1 wherein forming the base encapsulation includes forming the base encapsulation having the cavity exposing a portion of the substrate-less integrated circuit package.
6. A method of manufacture of an integrated circuit packaging system comprising:
mounting a base device over a substrate;
mounting a substrate-less integrated circuit package, with an internal adhesive layer and a terminal having characteristics of an intermetallic compound, over the base device;
connecting a package interconnect to the substrate and the substrate-less integrated circuit package; and
forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed, the base encapsulation having a cavity exposing the internal adhesive layer.
7. The method as claimed in claim 6 further comprising forming the substrate-less integrated circuit package includes forming the terminal in a multi-row configuration, the terminal exposed from the base encapsulation.
8. The method as claimed in claim 6 further comprising forming the substrate-less integrated circuit package includes forming a module encapsulation substantially coplanar with the internal adhesive layer and the terminal.
9. The method as claimed in claim 6 further comprising forming the substrate-less integrated circuit package includes forming a substrate-less Internal Stacking Module having a module encapsulation with a taper edge.
10. The method as claimed in claim 6 wherein forming the base encapsulation includes forming the base encapsulation having the cavity with a portion of the substrate-less integrated circuit package exposed therein.
11. An integrated circuit packaging system comprising:
a substrate;
a substrate-less integrated circuit package, having an internal adhesive layer and a terminal having characteristics of an intermetallic compound, over and connected to the substrate; and
a base encapsulation over the substrate-less integrated circuit package with the terminal exposed, the base encapsulation having a cavity exposing the internal adhesive layer.
12. The system as claimed in claim 11 wherein the substrate-less integrated circuit package includes the terminal in a multi-row configuration.
13. The system as claimed in claim 11 wherein the substrate-less integrated circuit package includes a module encapsulation substantially coplanar with the terminal.
14. The system as claimed in claim 11 wherein the substrate-less integrated circuit package includes a module encapsulation having a taper edge.
15. The system as claimed in claim 11 wherein the base encapsulation includes the base encapsulation having the cavity exposing a portion of the substrate-less integrated circuit package.
16. The system as claimed in claim 11 further comprising:
a base device over the substrate; and
a package interconnect connected to the substrate and the substrate-less integrated circuit package.
17. The system as claimed in claim 16 wherein the substrate-less integrated circuit package includes the terminal in a multi-row configuration, the terminal exposed from the base encapsulation.
18. The system as claimed in claim 16 wherein the substrate-less integrated circuit package includes a module encapsulation substantially coplanar with a portion of the internal adhesive layer and the terminal.
19. The system as claimed in claim 16 wherein the substrate-less integrated circuit package includes a substrate-less Internal Stacking Module having a module encapsulation with a taper edge.
20. The system as claimed in claim 16 wherein the base encapsulation includes the base encapsulation having the cavity with a portion of the substrate-less integrated circuit package exposed therein.