Extremely thin semiconductor-on-insulator (ETSOI) integrated circuit with on-chip resistors and method of forming the same

1. A method of forming an electrical device comprising:

providing a substrate comprising at least a semiconductor layer atop a dielectric layer, wherein the semiconductor layer has a thickness of less than 10 nm;

forming isolation regions through the semiconductor layer into contact with the dielectric layer to define at least a first surface of the semiconductor layer and a second surface of the semiconductor layer;

forming a gate structure on a portion of the first surface of the semiconductor layer, wherein a remaining portion of the first surface is exposed;

epitaxially growing a single crystal semiconductor material on the remaining portion of the first surface and the second surface of the semiconductor layer, wherein the single crystal semiconductor material on the remaining portion of the first surface provides a raised source region and a raised drain region of a semiconductor device, and the single crystal semiconductor material on the second surface provides an upper surface of a resistor, wherein the single crystal semiconductor material that is formed on the remaining portion of the first surface and the single crystal semiconductor material that is formed on the second surface are formed simultaneously during a same epitaxial growth step;

forming a dielectric layer on a portion of the upper surface of the resistor, wherein end portions of the upper surface of the resistor are exposed; and

forming semiconductor metal alloy contacts on at least the end portions of the upper surface of the resistor and an upper surface of the raised source region and the raised drain region of the semiconductor device.

2. The method of claim 1 wherein the single crystal semiconductor material is in-situ doped during the epitaxial growing of the single crystal semiconductor material.

3. The method of claim 1 , further comprising doping the single crystal semiconductor material by ion implantation of a p-type or n-type dopant.

4. The method of claim 1 , wherein the forming of the gate structure comprises depositing at least one gate dielectric layer, depositing at least one gate conductor layer on the at least one gate dielectric layer, forming a photoresist mask overlying the at least one gate conductor layer, and etching the at least one gate conductor layer and the at least one gate conductor layer using an etch that is selective to the photoresist mask and the semiconductor layer.

5. The method of claim 1 further comprising forming an extension source region and an extension drain region in the semiconductor layer.

6. The method of claim 1 , wherein the metal semiconductor alloy is a silicide.

7. The method of claim 1 , wherein a dopant concentration of the single crystal semiconductor material of the resistor ranges from 1×10 17 cm −3 to 5×10 20 cm −3 .

8. The method of claim 1 , wherein the at least the first surface and the second surface of the semiconductor layer further comprises a third surface and a fourth surface, wherein the semiconductor device on the first surface is a first conductivity semiconductor device, the resistor on the second surface is a first conductivity resistor, the third surface comprises a second conductivity resistor, and the fourth surface comprises a second conductivity semiconductor device.

9. The method of claim 8 wherein the first conductivity comprises a p-type dopant, and the second conductivity comprises an n-type dopant.