Multi-layer embedded capacitance and resistance substrate core
View Patent ↗A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
1. A method of making a multi-layer embedded capacitance and resistance substrate core, the steps comprising:
a) providing a Laser drillable dielectric having an upper surface and a lower surface;
b) disposing a first resistance layer on the upper surface of said Laser drillable dielectric;
c) disposing a first electrically conductive layer on said first resistance layer;
d) laminating said laser drillable dielectric, said first resistance layer and said first electrically conductive layer to form a first resistance structure;
e) applying and developing a first resist to said first electrically conductive layer;
f) selectively etching said first electrically conductive layer;
g) stripping said first resist from said first electrically conductive layer;
h) disposing a first copper-coated capacitance layer on said first electrically conductive layer;
i) laminating said first copper-coated capacitance layer and said first resistance structure;
j) applying and developing a second resist on said first resistance structure;
k) stripping said second resist; and
l) selectively etching said first copper-coated capacitance layer.
2. The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , wherein said electrically conductive layer comprises copper foil.
3. The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , the steps further comprising laser-forming thru-holes in said substrate.
4. The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 1 , the steps further comprising:
m) disposing a second resistance layer on the lower surface of said laser drillable dielectric;
n) disposing a second electrically conductive layer on said second resistance layer;
o) laminating said laser drillable dielectric, said second resistance layer and said second electrically conductive layer to form a second resistance structure;
p) applying and developing a third resist to said second electrically conductive layer;
q) selectively etching said second electrically conductive layer;
r) stripping said third resist from said second electrically conductive layer;
s) disposing a second copper-coated capacitance layer on said second electrically conductive layer;
t) laminating said second copper-coated capacitance layer and said second resistance structure;
u) applying and developing a fourth resist on said second resistance structure;
v) stripping said fourth resist; and
w) selectively etching said second copper-coated capacitance layer.
5. The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 4 , wherein said second electrically conductive layer comprises copper foil.
6. The method of making a multi-layer embedded capacitance and resistance substrate core in accordance with claim 4 , the steps further comprising laser-forming thru-holes in said substrate.