Integrated circuit package system and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit package system includes forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.
1. A method of manufacture of an integrated circuit package system comprising:
forming a substrate with a device thereover;
forming an encapsulation having a planar top surface to cover the device;
forming a nonorthogonal lower segment having a nonorthogonal substrate sidewall with a straight surface bounded and beveled between a first surface of the substrate opposing a second surface of the substrate, a contact of the substrate exposed from the nonorthogonal lower segment and the substrate spans from an end at an extraction side to another end at an insertion side; and
forming a recess in the encapsulation from the planar top surface, the recess having a first planar surface connected to a second planar surface to form an acute angle therebetween.
2. The method as claimed in claim 1 wherein forming the recess includes molding a chamfered cut or a groove next to the extraction side with a mold cap.
3. The method as claimed in claim 1 wherein forming the recess includes cutting a chamfered cut or a groove next to the extraction side with an angled blade.
4. The method as claimed in claim 1 wherein forming the nonorthogonal lower segment includes exposing a portion of the substrate at the insertion side.
5. The method as claimed in claim 1 further comprising forming a nonorthogonal upper segment with the encapsulation at the insertion side.
6. A method of manufacture of an integrated circuit package system comprising:
forming a substrate having a first surface opposing a second surface;
mounting a first device over the first surface;
forming an encapsulation having a planar top surface to cover the first device;
forming a recess in the encapsulation from the planar top surface next to the extraction side, the recess having a first planar surface connected to a second planar surface to form an acute angle therebetween; and
forming a nonorthogonal lower segment having a nonorthogonal substrate sidewall with a straight surface bounded and beveled between the first surface of the substrate and the second surface of the substrate, a contact of the substrate exposed from the nonorthogonal lower segment and the substrate spans from an end at an extraction side to another end at an insertion side.
7. The method as claimed in claim 6 wherein mounting the first device includes mounting a passive component.
8. The method as claimed in claim 6 wherein mounting the first device includes mounting an integrated circuit die.
9. The method as claimed in claim 6 wherein forming the first device includes forming a communication access device, a storage device, or an identity verification device.
10. An integrated circuit package system comprising:
a substrate;
a device over the substrate;
an encapsulation, having a planar top surface and a recess from the planar top surface with the recess having a first planar surface connected to a second planar surface to form an acute angle therebetween, the encapsulation covering the device; and
a nonorthogonal lower segment having a nonorthogonal substrate sidewall with a straight surface bounded and beveled between a first surface of the substrate opposing a second surface of the substrate, a contact of the substrate exposed from the nonorthogonal lower segment and the substrate spans from an end at an extraction side to another end at an insertion side.
11. The system as claimed in claim 10 wherein the recess is a chamfered cut next to the extraction side.
12. The system as claimed in claim 10 wherein the recess is a groove next to the extraction side.
13. The system as claimed in claim 10 wherein the nonorthogonal lower segment includes a portion of the substrate exposed at the insertion side.
14. The system as claimed in claim 10 further comprising a nonorthogonal upper segment with the encapsulation at the insertion side.
15. The system as claimed in claim 10 wherein:
the device is over the substrate and attached to the first surface;
the encapsulation, having the planar top surface and the recess from the planar top surface, is comprised of a mold resin to cover the device and the substrate spanning to the extraction side of the encapsulation; and
the nonorthogonal lower segment includes a portion of the substrate exposed at the insertion side.
16. The system as claimed in claim 15 wherein the device is a passive component.
17. The system as claimed in claim 15 wherein the device is an integrated circuit die.
18. The system as claimed in claim 15 wherein the device is a communication access device, a storage device, or an identity verification device.