IP Library Granted Patent US 8,498,471
Granted Patent B2
US 8,498,471 · App. 12/757,044 · Granted Jul 30, 2013

Method for identifying a wafer serial number

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Quick Facts
Patent No.
US 8,498,471
App. No.
12/757,044
Granted
Jul 30, 2013
Kind
B2
Abstract

A method of identifying a wafer serial number is provided. First, a wafer having a wafer serial number is provided. Second, an identification procedure is carried out to identify the wafer serial number by means of multiple identification recipes thereby obtaining multiple digit results which correspond to the multiple identification recipes and a specific digit in the wafer serial number. The multiple digit results include at least two of a successful result and an unsuccessful result. Then, the wafer serial number is determined in accordance with the multiple digit results.

Claims (33)

1. A method of identifying a wafer serial number, comprising:

providing a wafer having a wafer serial number thereon;

performing an identification procedure on said wafer to identify said wafer serial number by means of multiple identification recipes, thereby obtaining multiple digit results which correspond to one specific digit in said wafer serial number under said multiple identification recipes, wherein said multiple digit results comprise at least two of a successful result and an unsuccessful result; and

determining said wafer serial number in accordance with said multiple digit results; further comprising:

providing a combination procedure to calculate all possible combinations of said digit results when said digit results of said multiple digits comprise more than one possible result;

providing a check procedure;

performing said combination procedure to obtain a combination result, wherein said combination procedure is initiated when said multiple digit results of multiple said digits are composed of said possible result and said unsuccessful result, and the rest of said digits have at least one said successful result after said identification procedure; and

performing said check procedure to repeatedly check said combination result.

2. The method of identifying a wafer serial number of claim 1 , wherein said wafer serial number comprises 7-12 digits.

3. The method of identifying a wafer serial number of claim 1 , wherein said wafer serial number comprises at least one of a character, a number and a symbol.

4. The method of identifying a wafer serial number of claim 1 , wherein said identification recipe comprises at least one of a light angle, a light intensity, a light direction and a light location.

5. The method of identifying a wafer serial number of claim 1 , wherein said identification procedure comprises 4-10 identification recipes.

6. The method of identifying a wafer serial number of claim 1 , wherein said wafer serial number is obtained after every one of said digits goes through said identification procedure and gets at least one said successful result.

7. A method of identifying a wafer serial number, comprising:

providing a wafer having a wafer serial number thereon;

performing an identification procedure on said wafer to identify said wafer serial number by means of multiple identification recipes, thereby obtaining multiple digit results which correspond to one specific digit in said wafer serial number under the multiple identification recipes, wherein said multiple digit results comprise at least two of a successful result, a possible result and an unsuccessful result; and

determining said wafer serial number in accordance with said multiple digit results; further comprising:

providing a combination procedure to calculate all possible combinations of said digit results when said digit results of said multiple digits comprise more than one possible result;

providing a check procedure;

performing said combination procedure to obtain a combination result, wherein said combination procedure is initiated when said multiple digit results of multiple said digits are composed of said possible result and said unsuccessful result, and the rest of said digits have at least one said successful result after said identification procedure; and

performing said check procedure to repeatedly check said combination result.

8. The method of identifying a wafer serial number of claim 7 , wherein said wafer serial number is obtained after every one of said digits goes through said identification procedure and gets at least one said successful result.

9. The method of identifying a wafer serial number of claim 7 , further comprising:

providing a check procedure; and

performing said check procedure to obtain said wafer serial number, wherein said check procedure is initiated when said multiple digit results of only one of said digit are composed of said possible result and said unsuccessful result, and the rest of said digits have at least one said successful result after said identification procedure.

10. The method of identifying a wafer serial number of claim 7 , wherein said wafer serial number is obtained when said combination result passes said check procedure.

11. The method of identifying a wafer serial number of claim 7 , wherein a first combination result is firstly obtained by means of choosing said possible result with the highest frequency.

12. The method of identifying a wafer serial number of claim 11 , wherein a combination result is secondly obtained by means of choosing said possible result with the second highest frequency after said check procedure of the first combination result fails.

13. The method of identifying a wafer serial number of claim 7 , wherein said combination procedure calculates all possible combination results of all said digits.

14. The method of identifying a wafer serial number of claim 7 , wherein said wafer serial number comprises 7-12 digits.

15. The method of identifying a wafer serial number of claim 7 , wherein said wafer serial number comprises at least one of a character, a number and a symbol.

16. The method of identifying a wafer serial number of claim 7 , wherein said identification recipe comprises at least one of a light angle, a light intensity, a light direction and a light location.

17. The method of identifying a wafer serial number of claim 7 , wherein said identification procedure comprises 4-10 identification recipes.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050695/0825 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 27, 2017
From: INOTERA MEMORIES, INC.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 041820/0815 →
SUPPLEMENT NO. 3 TO PATENT SECURITY AGREEMENT Recorded Feb 10, 2017
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041675/0105 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 9, 2010
From: CHEN, WEI-CHIN; LI, CHIEN-MING
To: INOTERA MEMORIES, INC.
Reel/Frame 024208/0368 →