Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
View Patent ↗A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads.
1. A method of making a semiconductor device, comprising:
forming a tape as a continuous body of conductive material with a plurality of recesses;
providing a semiconductor die with contact pads;
depositing a flux material over the contact pads of the semiconductor die;
providing a substrate with contact pads;
transferring a portion of the flux material from the contact pads on the semiconductor die to the contact pads on the substrate;
disposing the tape between the contact pads of the semiconductor die and the contact pads of the substrate; and
bringing the tape to a liquidus state to separate a portion of the tape outside a footprint of the contact pads of the semiconductor die and the contact pads of the substrate.
2. The method of claim 1 , further including forming the recesses in the tape with a laser cutting tool or stamping tool.
3. The method of claim 1 , further including:
forming an insulating layer over the tape;
removing a portion of the insulating layer to expose the tape;
forming conductive material over the exposed tape; and
removing the insulating layer to provide the recesses in the tape.
4. The method of claim 1 , further including depositing underfill material between the semiconductor die and substrate.
5. The method of claim 1 , further including:
forming the contact pads on the semiconductor die with an extension or recess to increase a surface area of the contact pads; and
forming the contact pads on the substrate with an extension or recess to increase the surface area of the contact pads.
6. The method of claim 1 , wherein the semiconductor die is a flipchip type semiconductor die.
7. A method of making a semiconductor device, comprising:
forming a continuous body of conductive material;
providing a semiconductor die with contact pads;
providing a substrate with contact pads;
depositing a flux material over the contact pads of the semiconductor die and the contact pads of the substrate;
disposing the continuous body of conductive material between the contact pads of the semiconductor die and the contact pads of the substrate; and
bringing the conductive material to a liquidus state to separate a portion of the continuous body outside a footprint of the contact pads of the semiconductor die and the contact pads of the substrate.
8. The method of claim 7 , further including forming a plurality of recesses in the continuous body of conductive material.
9. The method of claim 7 , further including forming a plurality of recesses in the continuous body of conductive material by:
forming an insulating layer over the continuous body;
removing a portion of the insulating layer to expose the continuous body;
forming conductive material over the exposed continuous body; and
removing the insulating layer.
10. The method of claim 7 , further including:
forming the contact pads on the semiconductor die with an extension or recess to increase surface area of the contact pads; and
forming the contact pads on the substrate with an extension or recess to increase surface area of the contact pads.
11. The method of claim 7 , wherein the depositing the flux material over the contact pads of the substrate includes transferring a portion of the flux material from the contact pads on the semiconductor die to the contact pads on the substrate.
12. The method of claim 7 , further including disposing a support member over the semiconductor die and substrate.
13. The method of claim 7 , wherein the semiconductor die is a flipchip type semiconductor die.
14. A method of making a semiconductor device, comprising:
forming a continuous body of an interconnect material;
providing a semiconductor die with contact pads;
providing a substrate with contact pads;
disposing the continuous body of interconnect material between the contact pads of the semiconductor die and the contact pads of the substrate; and
reflowing the interconnect material to separate a portion of the continuous body outside a footprint of the contact pads of the substrate.
15. The method of claim 14 , further including forming a plurality of recesses in the continuous body of interconnect material.
16. The method of claim 14 , further including forming recesses in the continuous body of interconnect material by:
forming an insulating layer over the continuous body;
removing a portion of the insulating layer to expose the continuous body;
forming interconnect material over the exposed continuous body; and
removing the insulating layer.
17. The method of claim 14 , further including:
forming the contact pads on the semiconductor die with an extension or recess to increase surface area of the contact pads; and
forming the contact pads on the substrate with an extension or recess to increase surface area of the contact pads.
18. The method of claim 14 , further including depositing flux material over the contact pads of the semiconductor die and the contact pads of the substrate.
19. The method of claim 18 , wherein depositing the flux material over the contact pads of the substrate includes transferring a portion of the flux material from the contact pads on the semiconductor die to the contact pads on the substrate.
20. The method of claim 14 , further including disposing a support member over the semiconductor die and substrate.
21. A method of making a semiconductor device, comprising:
forming a continuous body of conductive material;
providing a semiconductor die including first contact pads;
providing a substrate including second contact pads;
disposing the continuous body of conductive material between the semiconductor die and substrate; and
reflowing the continuous body into interconnects between the first contact pads and second contact pads of conductive material to separate portions of the continuous body.
22. The method of claim 21 , further including forming a plurality of recesses in the continuous body of conductive material.
23. The method of claim 21 , further including:
forming the first contact pads on the semiconductor die with an extension or recess to increase a surface area of the first contact pads; and
forming the second contact pads on the substrate with an extension or recess to increase a surface area of the second contact pads.
24. The method of claim 21 , further including depositing flux material over a surface of the semiconductor die and a surface of the substrate.
25. The method of claim 21 , further including disposing a support member over the semiconductor die and substrate.