Integrated circuit package system including shield
View Patent ↗An integrated circuit package system includes: a substrate; a first device attached to the substrate; a shield attached to the substrate and surrounding the first device; apertures formed within the shield; the shield configured to block electromagnetic energy that passes through the apertures; and an encapsulation material deposited through the apertures.
1. An integrated circuit package system comprising:
a substrate;
a first device attached to the substrate;
a shield attached to the substrate and surrounding the first device, the shield having a projection over a lower side wall with an aperture between the projection and the lower side wall; and
an encapsulation material through the aperture.
2. The system as claimed in claim 1 wherein:
the apertures facilitate dispersion of an encapsulation material.
3. The system as claimed in claim 1 wherein:
the projection of the shield is folded outward.
4. The system as claimed in claim 1 wherein:
the shield includes flanges bent upwards to block electromagnetic energy.
5. The system as claimed in claim 1 wherein:
the shield includes a collar shield to block electromagnetic energy.
6. The system as claimed in claim 1 wherein:
the shield includes a top and sidewalls; and
the apertures are formed within the sidewalls.
7. The system as claimed in claim 1 wherein:
the shield blocks electromagnetic energy by overlapping parts of the shield.
8. The system as claimed in claim 1 further comprising:
a second device formed over the first device, the second device supported by the shield.
9. The system as claimed in claim 1 wherein:
the first device is selected from semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.
10. The system as claimed in claim 8 wherein:
the second device is selected from semiconductor chips and integrated circuit packages that transmit or receive electromagnetic energy.