Integrated circuit packaging system with package-on-package and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: applying a conductive material on a support structure; providing a bottom integrated circuit package having a bottom lead extended therefrom; attaching the bottom lead to the conductive material; stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead; attaching a conductive paste at an end portion of the top lead; and forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint below the top lead as well as below and above the bottom lead.
1. A method of manufacture of an integrated circuit packaging system comprising:
applying a conductive material on a support structure;
providing a bottom integrated circuit package having a bottom lead extended therefrom;
attaching the bottom lead to the conductive material;
stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead, the top lead having a top lead upper portion;
attaching a conductive paste at an end portion of the top lead; and
forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint directly on a bottom side of the top lead upper portion as well as below and above the bottom lead.
2. The method as claimed in claim 1 wherein forming the stacking joint includes upwardly flowing the conductive material from the support structure.
3. The method as claimed in claim 1 wherein applying the conductive material includes controlling the volume of the conductive material.
4. The method as claimed in claim 1 wherein applying the conductive material includes printing the conductive material on the support structure.
5. The method as claimed in claim 1 wherein stacking the top integrated circuit package includes mounting the top lead over the bottom lead, the top lead downwardly extending below a top surface of the bottom lead.
6. A method of manufacture of an integrated circuit packaging system comprising:
applying a conductive material on a support structure, the conductive material having a controlled volume;
providing a bottom integrated circuit package having a bottom lead extended therefrom;
attaching the bottom lead to the conductive material;
stacking a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead, the top lead having a top lead upper portion;
attaching a conductive paste at an end portion of the top lead; and
forming a stacking joint by flowing the conductive paste and the conductive material, the stacking joint directly on a bottom side of the top lead upper portion as well as below and above the bottom lead.
7. The method as claimed in claim 6 wherein attaching the conductive paste includes attaching the conductive paste between the bottom lead and the end portion of the top lead.
8. The method as claimed in claim 6 wherein stacking the top integrated circuit package over the bottom integrated circuit package includes attaching an attach layer between the bottom integrated circuit package and the top integrated circuit package.
9. The method as claimed in claim 6 wherein applying the conductive material includes applying a solder paste on the support structure.
10. The method as claimed in claim 6 wherein forming the stacking joint includes forming the stacking joint on the bottom lead.
11. An integrated circuit packaging system comprising:
a bottom integrated circuit package having a bottom lead extended therefrom;
a top integrated circuit package over the bottom integrated circuit package, the top integrated circuit package having a top lead extending therefrom and the top lead over the bottom lead, the top lead having a top lead upper portion and an end portion; and
a stacking joint directly on a bottom side of the top lead upper portion as well as below and above the bottom lead, the stacking joint attached to the bottom lead.
12. The system as claimed in claim 11 wherein the stacking joint covers the top lead and the bottom lead.
13. The system as claimed in claim 11 wherein the stacking joint is above the top lead.
14. The system as claimed in claim 11 wherein the stacking joint is around the bottom lead.
15. The system as claimed in claim 11 wherein the top integrated circuit package includes the top lead over the bottom lead, the top lead downwardly extending below a top surface of the bottom lead.
16. The system as claimed in claim 11 wherein:
the bottom integrated circuit package having the bottom lead includes the bottom lead having a bottom lead upper portion, a bottom lead non-horizontal portion downwardly extended from the bottom lead upper portion, and a bottom lead lower portion extended from the bottom lead non-horizontal portion; and
the top integrated circuit package having the top lead includes the top lead having a top lead upper portion and a top lead non-horizontal portion downwardly extended therefrom and over the bottom lead non-horizontal portion.
17. The system as claimed in claim 16 wherein the stacking joint is below the top lead upper portion.
18. The system as claimed in claim 16 wherein the top integrated circuit package over the bottom integrated circuit package includes an attach layer between the bottom integrated circuit package and the top integrated circuit package.
19. The system as claimed in claim 16 wherein the stacking joint is below the bottom lead upper portion.
20. The system as claimed in claim 16 wherein the stacking joint is on the bottom lead non-horizontal portion.