Reconfiguring through silicon vias in stacked multi-die packages
View Patent ↗Through silicon vias (TSVs) in a stacked multi-die integrated circuit package are controlled to assume different connection configurations as desired during field operation of the package in its normal mission mode. TSV connections may be reconfigured to connect an affected die in a manner different from, for example, a factory default connection of that die. TSV connections to the inputs and/or outputs of a die's native circuitry may be changed. A die may be disconnected altogether from an interface that interconnects dice in the stack, or a die that was originally disconnected from such an interface may be connected to the interface.
1. A stacked integrated circuit apparatus, comprising:
a plurality of integrated circuit dice connected in a ring topology, each die including:
a plurality of vias extending through the die for providing external access to signals on the die, said plurality of dice being arranged in a stack such that the vias of each die are connected to the vias of an adjacent die to form a serial connection between adjacent dice; and
a router coupled to the associated vias and configured to:
cause the associated vias to assume a signaling connection configuration in which native circuitry of the die is connected by selected ones of the associated vias for signaling with an adjacent die; and
cause the associated vias to assume a signaling disconnect configuration in which the native circuitry of the die is not connected for signaling with the adjacent die.
2. The stacked integrated circuit apparatus of claim 1 , including native circuitry coupled to said router and wherein, in respective ones of said signaling configurations, said router routes respective signals from respective portions of said native circuitry to a same one of said vias.
3. The stacked integrated circuit apparatus of claim 1 , including a packaging substrate coupled to one of the dice.
4. The stacked integrated circuit apparatus of claim 1 , each die further including a controller coupled to said router for providing thereto a control signal indicative of the assumed signaling configuration of the associated vias.
5. The stacked integrated circuit apparatus of claim 4 , wherein said controller includes a register for storing said control signal.
6. The stacked integrated circuit apparatus of claim 4 , wherein a first group of said plurality of vias is coupled to said controller to transfer, from said controller to a second controller of the adjacent integrated circuit die, information indicative of a selected one of a plurality of signal-carrying configurations assumable by a second plurality of vias that extend through the adjacent integrated circuit die and provide external access to signals on the adjacent die.
7. The stacked integrated circuit apparatus of claim 4 , wherein said controller is configured to receive information indicative of the assumed signaling configuration, and to provide said control signal in response to said information.
8. The stacked integrated circuit apparatus of claim 7 , wherein said controller is adapted to receive said information from an external controller that selects the assumed signaling configuration.
9. The stacked integrated circuit apparatus of claim 7 , wherein said controller is coupled to a first group of said plurality of vias to receive said information from a second group of vias of the adjacent die through said first group of vias.
10. The stacked integrated circuit apparatus of claim 9 , wherein said router is configured to route said information from said first group of vias to said controller.
11. A system, comprising:
a stacked integrated circuit apparatus according to claim 1 ; and
electronic circuitry provided externally of said stacked integrated circuit apparatus and coupled thereto for communication therewith.
12. The system of claim 11 , wherein said stacked integrated circuit apparatus implements one of data processing functionality and data storage functionality, and said electronic circuitry is cooperable with said one of data processing functionality and data storage functionality.