Integrated circuit packaging system with rounded interconnect and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto; placing a mold chase having a protrusion over the rounded interconnect; forming an encapsulation over the package carrier, the encapsulation having a recess under the protrusion; removing the mold chase to expose the encapsulation; and removing the encapsulation under the recess for exposing the rounded interconnect.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a rounded interconnect on a package carrier having an integrated circuit attached thereto;
placing a mold chase having a protrusion over the rounded interconnect;
forming an encapsulation over the package carrier, the encapsulation having a recess under the protrusion;
removing the mold chase to expose the encapsulation; and
removing the encapsulation under the recess for exposing the rounded interconnect.
2. The method as claimed in claim 1 wherein removing the encapsulation includes ablating the encapsulation under the recess.
3. The method as claimed in claim 1 wherein removing the encapsulation includes removing the encapsulation under the recess leaving the encapsulation having an opening exposing the rounded interconnect.
4. The method as claimed in claim 1 wherein removing the encapsulation includes removing the encapsulation under the recess leaving the encapsulation having a top surface, an opening sidewall, and an opening bounded thereby, the opening sidewall at an obtuse angle relative to the top surface and the opening exposing the rounded interconnect.
5. The method as claimed in claim 1 wherein:
removing the encapsulation includes removing the encapsulation under the recess leaving the encapsulation having an opening sidewall; and
further comprising:
forming a stacking joint having a lower portion in contact with the opening sidewall.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a rounded interconnect on a package carrier having an integrated circuit attached thereto;
placing a mold chase having a protrusion over the rounded interconnect;
forming an encapsulation over the package carrier, the encapsulation having a recess under the protrusion, the encapsulation having a top surface above the rounded interconnect;
removing the mold chase to expose the encapsulation; and
removing the encapsulation under the recess for exposing the rounded interconnect.
7. The method as claimed in claim 6 wherein removing the encapsulation includes ablating the encapsulation under the recess, the encapsulation having a laser-ablated mark.
8. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation over the package carrier, the encapsulation having the top surface above the rounded interconnect, the top surface having a characteristic of being formed with the mold chase.
9. The method as claimed in claim 6 wherein forming the rounded interconnect includes forming a conductive bump on the package carrier.
10. The method as claimed in claim 6 wherein forming the rounded interconnect includes forming the rounded interconnect on a substrate having the integrated circuit attached thereto.