System-in-package having integrated passive devices and method therefor
View Patent ↗A semiconductor device has a substrate, first passivation layer formed over the substrate, and integrated passive device formed over the substrate. The integrated passive device can include an inductor, capacitor, and resistor. A second passivation layer is formed over the integrated passive device. System components are mounted to the second passivation layer and electrically connect to the second conductive layer. A mold compound is formed over the integrated passive device. A coefficient of thermal expansion of the mold compound is approximately equal to a coefficient of thermal expansion of the system component. The substrate is removed. An opening is etched into the first passivation layer and solder bumps are deposited over the opening in the first passivation layer to electrically connect to the integrated passive device. A metal layer can be formed over the molding compound or first passivation layer for shielding.
1. A semiconductor device, comprising:
a first insulating layer including first and second opposing surfaces;
a first conductive layer formed over the first surface of the first insulating layer;
a dielectric layer formed over the first conductive layer;
a second conductive layer formed over the dielectric layer and electrically isolated from the first conductive layer by the dielectric layer, wherein the first and second conductive layers and dielectric layer constitute a capacitor;
a second insulating layer formed over the first insulating layer and second conductive layer;
a plurality of first electrical components disposed over the second insulating layer;
a second electrical component disposed over the second surface of the first insulating layer; and
an encapsulant deposited in contact with the second insulating layer and the first electrical components, the encapsulant including a coefficient of thermal expansion (CTE) matching a CTE of the first electrical components.
2. The semiconductor device of claim 1 , wherein the first electrical components are selected from the group consisting of a discrete passive device, discrete semiconductor device, radio frequency integrated circuit, baseband integrated circuit, and semiconductor die.
3. The semiconductor device of claim 1 , further including a shielding layer formed over the encapsulant.
4. The semiconductor device of claim 1 , further including a heat sink formed over the encapsulant.
5. A semiconductor device, comprising:
a first insulating layer including first and second opposing surfaces;
an integrated passive device (IPD) formed and patterned over the first surface of the first insulating layer;
a second insulating layer formed over the IPD;
a first electrical component disposed over the second insulating layer; and
an encapsulant deposited in contact with the second insulating layer and the first electrical component, the encapsulant including a coefficient of thermal expansion (CTE) matching a CTE of the first electrical component.
6. The semiconductor device of claim 5 , wherein the IPD includes:
a first conductive layer formed over the first surface of the first insulating layer;
a third insulating layer formed over the first conductive layer; and
a second conductive layer formed over the third insulating layer and electrically isolated from the first conductive layer by the third insulating layer, wherein the first and second conductive layers and third insulating layer constitute a capacitor.
7. The semiconductor device of claim 5 , wherein the IPD includes an inductor, capacitor, or resistor.
8. The semiconductor device of claim 5 , wherein the first electrical component is selected from the group consisting of a discrete passive device, discrete semiconductor device, radio frequency integrated circuit, baseband integrated circuit, and semiconductor die.
9. The semiconductor device of claim 5 , further including a second electrical component disposed over the second surface of the first insulating layer opposite the first surface.
10. The semiconductor device of claim 5 , further including a metal layer formed over the encapsulant.
11. The semiconductor device of claim 5 , wherein the IPD includes a conductive layer formed over the first surface of the first insulating layer and wound to exhibit an inductive property.
12. A semiconductor device, comprising:
a first insulating layer;
an integrated passive device (IPD) formed and patterned over a first surface of the first insulating layer;
a second insulating layer formed over the IPD;
a first electrical component disposed over the second insulating layer; and
an encapsulant deposited over the second insulating layer and the first electrical component.
13. The semiconductor device of claim 12 , wherein the encapsulant includes a coefficient of thermal expansion (CTE) matching a CTE of the first electrical component.
14. The semiconductor device of claim 12 , wherein the first electrical component is selected from the group consisting of a discrete passive device, discrete semiconductor device, radio frequency integrated circuit, baseband integrated circuit, and semiconductor die.
15. The semiconductor device of claim 12 , wherein the IPD includes an inductor, capacitor, or resistor.
16. The semiconductor device of claim 12 , further including a second electrical component disposed over a second surface of the first insulating layer.
17. The semiconductor device of claim 12 , further including:
a printed circuit board including a contact pad, wherein the encapsulant is disposed over the printed circuit board; and
a bond wire electrically connected between the IPD and the contact pad of the printed circuit board.
18. A semiconductor device, comprising:
an integrated passive device (IPD);
a first insulating layer formed over a first surface of the IPD;
a first electrical component disposed over the first insulating layer;
a second electrical component disposed over a second surface of the IPD opposite the first surface; and
an encapsulant deposited in contact with the first insulating layer and the first electrical component.
19. The semiconductor device of claim 18 , wherein the encapsulant includes a coefficient of thermal expansion (CTE) matching a CTE of the first electrical component.
20. The semiconductor device of claim 18 , wherein the IPD includes an inductor, capacitor, or resistor.
21. The semiconductor device of claim 18 , further including a metal layer formed over the encapsulant.
22. The semiconductor device of claim 18 , further including an interconnect structure formed over a surface of the semiconductor device opposite the first electrical component, the interconnect structure being electrically connected to the IPD.
23. A semiconductor device, comprising:
a first insulating layer;
an integrated passive device (IPD) formed over a first surface of the first insulating layer;
a second insulating layer formed over the IPD;
a first electrical component disposed over the second insulating layer;
and
an encapsulant deposited in contact with the second insulating layer and the first electrical component.
24. The semiconductor device of claim 23 , wherein the IPD includes an inductor, capacitor, or resistor.
25. The semiconductor device of claim 23 , further including an interconnect structure formed through the first insulating layer.
26. The semiconductor device of claim 23 , wherein the encapsulant includes a coefficient of thermal expansion (CTE) matching a CTE of the first electrical component.
27. The semiconductor device of claim 23 , wherein the IPD is formed and patterned over the first surface of the first insulating layer.
28. The semiconductor device of claim 23 , further including a second electrical component disposed over a second surface of the first insulating layer.
29. The semiconductor device of claim 23 , wherein the IPD includes:
a first conductive layer formed over the first surface of the first insulating layer;
a third insulating layer formed over the first conductive layer; and
a second conductive layer formed over the third insulating layer and electrically isolated from the first conductive layer by the third insulating layer, wherein the first and second conductive layers and third insulating layer constitute a capacitor.
30. The semiconductor device of claim 23 , wherein the IPD includes a conductive layer wound to exhibit an inductive property.
31. The semiconductor device of claim 12 , wherein the IPD includes:
a first conductive layer formed over the first surface of the first insulating layer;
a third insulating layer formed over the first conductive layer; and
a second conductive layer formed over the third insulating layer and electrically isolated from the first conductive layer by the third insulating layer, wherein the first and second conductive layers and third insulating layer constitute a capacitor.
32. The semiconductor device of claim 12 , wherein the IPD includes a conductive layer wound to exhibit an inductive property.
33. The semiconductor device of claim 18 , wherein the IPD is formed and patterned over the first surface of the first insulating layer.
34. The semiconductor device of claim 18 , wherein the IPD includes:
a first conductive layer;
a second insulating layer formed over the first conductive layer; and
a second conductive layer formed over the third insulating layer and electrically isolated from the first conductive layer by the second insulating layer, wherein the first and second conductive layers and second insulating layer constitute a capacitor.
35. The semiconductor device of claim 18 , wherein the IPD includes a conductive layer wound to exhibit an inductive property.