Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
A semiconductor wafer contains a plurality of semiconductor die with bumps formed over contact pads on an active surface of the semiconductor die. An ACF is deposited over the bumps and active surface of the wafer. An insulating layer can be formed between the ACF and semiconductor die. The semiconductor wafer is singulated to separate the die. The semiconductor die is mounted to a temporary carrier with the ACF oriented to the carrier. The semiconductor die is forced against the carrier to compress the ACF under the bumps and form a low resistance electrical interconnect to the bumps. An encapsulant is deposited over the semiconductor die and carrier. The carrier is removed. An interconnect structure is formed over the semiconductor die and encapsulant. The interconnect structure is electrically connected through the compressed ACF to the bumps. The ACF reduces shifting of the semiconductor die during encapsulation.
1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer including a plurality of semiconductor die comprising bumps formed over contact pads on an active surface of the semiconductor die;
depositing an anisotropic conductive film (ACF) over the bumps and active surface of the semiconductor wafer;
singulating the semiconductor wafer to separate the semiconductor die;
providing a temporary carrier;
disposing the semiconductor die with the ACF oriented to the temporary carrier;
compressing the ACF under the bumps to form a conductive portion of the ACF electrically connected to the bumps;
curing the ACF to form a cured ACF;
depositing an encapsulant over the semiconductor die and temporary carrier;
removing the temporary carrier to expose the conductive portion of the cured ACF under the bumps; and
forming an interconnect structure over the semiconductor die, cured ACF, and encapsulant with the interconnect structure being electrically connected through the conductive portion of the cured ACF to the bumps.
2. The method of claim 1 , further including planarizing a back surface of the semiconductor die, opposite the active surface.
3. The method of claim 1 , wherein the ACF reduces shifting of the semiconductor die during encapsulation.
4. The method of claim 1 , further including forming an insulating layer between the ACF and active surface of the semiconductor die.
5. The method of claim 1 , further including:
forming an opening in the interconnect structure;
disposing a semiconductor component within the opening; and
electrically connecting the semiconductor component to the semiconductor die.
6. The method of claim 1 , further including:
forming a plurality of conductive vias through the semiconductor die;
disposing a semiconductor component over a back surface of the semiconductor die opposite the active surface; and
electrically connecting the semiconductor component to the semiconductor die through the conductive vias.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die including bumps formed over contact pads on an active surface of the semiconductor die;
depositing an anisotropic conductive film (ACF) over the bumps;
providing a carrier;
disposing the semiconductor die with the ACF oriented to the carrier;
compressing the ACF under the bumps to form a conductive portion of the ACF;
depositing an encapsulant over the semiconductor die and carrier;
removing the carrier to expose the conductive portion of the ACF; and
forming an interconnect structure on the encapsulant and conductive portion of the ACF with the interconnect structure being electrically connected through the conductive portion of the ACF to the bumps.
8. The method of claim 7 , further including planarizing a back surface of the semiconductor die, opposite the active surface.
9. The method of claim 7 , wherein the ACF reduces shifting of the semiconductor die during encapsulation.
10. The method of claim 7 , further including forming an insulating layer between the ACF and active surface of the semiconductor die.
11. The method of claim 7 , further including:
forming an opening in the interconnect structure;
disposing a semiconductor component within the opening; and
electrically connecting the semiconductor component to the semiconductor die.
12. The method of claim 7 , further including:
forming a plurality of conductive vias through the semiconductor die;
disposing a semiconductor component over a back surface of the semiconductor die opposite the active surface; and
electrically connecting the semiconductor component to the semiconductor die through the conductive vias.
13. A method of making a semiconductor device, comprising:
providing a semiconductor die including contact pads;
disposing the semiconductor die over an anisotropic conductive film (ACF);
compressing the ACF under the contact pads to form a compressed ACF;
curing the ACF to form a cured ACF;
depositing an encapsulant over the semiconductor die to leave the cured ACF under the contact pads exposed; and
forming an interconnect structure over the semiconductor die and encapsulant with the interconnect structure being electrically connected through the compressed ACF to the contact pads of the semiconductor die.
14. The method of claim 13 , wherein forming the compressed ACF further includes:
forming a plurality of bumps over the contact pads;
disposing the semiconductor die over a carrier; and
forcing the semiconductor die against the carrier to compress the ACF under the bumps to form the compressed ACF.
15. The method of claim 13 , further including planarizing a back surface of the semiconductor die.
16. The method of claim 13 , wherein the ACF reduces shifting of the semiconductor die during encapsulation.
17. The method of claim 13 , further including forming an insulating layer between the ACF and semiconductor die.
18. The method of claim 13 , further including:
forming an opening in the interconnect structure;
disposing a semiconductor component within the opening; and
electrically connecting the semiconductor component to the semiconductor die.
19. The method of claim 13 , further including:
forming a plurality of conductive vias through the semiconductor die;
disposing a semiconductor component over a back surface of the semiconductor die; and
electrically connecting the semiconductor component to the semiconductor die through the conductive vias.
20. A method of making a semiconductor device, comprising:
providing a semiconductor die;
disposing the semiconductor die over an anisotropic conductive film (ACF);
compressing the ACF beneath the semiconductor die to leave a conductive portion of the ACF opposite the semiconductor die exposed; and
forming a conductive layer over the conductive portion of the ACF.
21. The method of claim 20 , further including planarizing a back surface of the semiconductor die.
22. The method of claim 20 , wherein the ACF reduces shifting of the semiconductor die during encapsulation.
23. The method of claim 20 , further including forming an interconnect structure over the conductive portion of the ACF.
24. The method of claim 23 , further including:
forming an opening in the interconnect structure;
disposing a semiconductor component within the opening; and
electrically connecting the semiconductor component to the semiconductor die.