Semiconductor device with protecting film and method of fabricating the semiconductor device with protecting film
View Patent ↗Provided are a semiconductor device and a method of fabricating the semiconductor device, the semiconductor device including: a source trace, a drain trace, and a gate trace placed on a substrate; a transistor which is placed on the drain trace and includes a source pad and a gate pad; insulating films placed between the drain and source traces and between the drain and gate traces on the substrate so as to cover sidewall surfaces of the transistor; a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace; and a gate spray electrode placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace.
1. A semiconductor device comprising:
a substrate;
a source trace, a drain trace, and a gate trace placed on the substrate;
a transistor which is placed on the drain trace and includes a source pad and a gate pad;
insulating films placed between the drain and source traces and between the drain and gate traces on the substrate to cover sidewall surfaces of the transistor;
a source spray electrode which is placed on the insulating film between the source and drain traces and connects the source pad of the transistor and the source trace;
a gate spray electrode which is placed on the insulating film between the gate and drain traces and connects the gate pad of the transistor and the gate trace; and
a protecting film placed on a surface of each insulating film, the protecting film being located any one of between the insulating film and the source spray electrode, and between the insulating film and the gate spray electrode.
2. The semiconductor device according to claim 1 , wherein
the insulating films are made of any one of silicone resin, polymer resin, polyimide resin, and epoxy resin.
3. The semiconductor device according to claim 1 , wherein
each of the insulating films is formed of a laminate film composed of ceramic layers formed by a spray technique.
4. The semiconductor device according to claim 3 , wherein
each of the ceramic layers is made of any one of alumina, aluminum nitride, and silicon nitride.
5. The semiconductor device according to claim 1 , wherein
each of the source and gate spray electrodes is made of any one of copper, silver, nickel, aluminum, platinum, palladium, nickel-chrome alloy, nickel aluminum alloy, nickel-chrome-silicon alloy, nickel-silicon alloy, and copper-nickel alloy.
6. The semiconductor device according to claim 1 , wherein
the protecting film is made of any one of silicone resin, polymer resin, polyimide resin, and epoxy resin.
7. The semiconductor device according to claim 1 , wherein
the transistor is composed of an SiC or GaN semiconductor.
8. A method of fabricating a semiconductor device comprising:
forming a substrate;
forming a source trace, a drain trace, and a gate trace on the substrate;
forming a transistor on the drain trace, the transistor including a source pad and a gate pad;
forming insulating films between the source and drain traces and between the gate and drain traces on the substrate, the insulating films covering sidewall surfaces of the transistor;
forming a source spray electrode on the insulating film between the source and drain traces, the source spray electrode connecting the source pad of the transistor and the source trace;
forming a gate spray electrode on the insulating film between the gate and drain traces, the gate spray electrode connecting the gate pad of the transistor and the gate trace, wherein
the forming the source spray electrode and the forming the gate spray electrode include:
attaching masking tapes to the source trace, the gate trace, and the transistor;
forming the source and gate spray electrodes simultaneously with a spray technique; and
removing the masking tapes.
9. The method of claim 8 , wherein
forming the insulating films includes forming a plurality of ceramic layers with a spray technique.
10. The method of claim 8 , further comprising:
after forming the transistor on the drain trace, individually forming wire bonds between the source trace and source pad, between the source trace and gate pad, between the gate trace and the source pad, and between the gate trace and the gate pad; and
cutting the wire bonds after the forming the source spray electrode and the forming the gate spray electrode.
11. The method of claim 8 further comprising:
forming a protecting film on a surface of each insulating film.
12. The method of claim 8 , wherein
the insulating films are made of any one of silicone resin, polymer resin, polyimide resin, and epoxy resin.
13. The method of claim 8 , wherein
the insulating film is made of a laminate film including ceramic layers formed with a spray technique.
14. The method of claim 13 , wherein
the ceramic layers are made of any one of alumina, aluminum nitride, and silicon nitride.
15. The method of claim 8 , wherein
each of the source and gate spray electrodes is made of any one of copper, silver, nickel, aluminum, platinum, palladium, nickel-chrome alloy, nickel-aluminum alloy, nickel-chrome-silicon alloy, nickel-silicon alloy, and copper-nickel alloy.
16. The method of claim 11 , wherein
the protecting film is made of any one of silicone resin, polymer resin, polyimide resin, and epoxy resin.