Patent Assignment
Reel/Frame 057291/0406
Merger
Recorded: 2021-08-13
Pages: 6
Assignor
CREE FAYETTEVILLE, INC.
Executed: 2021-06-24
Assignee
CREE, INC.
4600 SILICON DRIVE, DURHAM, NORTH CAROLINA, 27703
Covered Properties
(50)
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
PCT:
PCT/US2018/013474 ↗
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
PCT:
PCT/US2020/012167 ↗
Methods and Systems for Matching Both Dynamic and Static Parameters in Dies, Discretes, and/or Modules and Methods and Systems Based on the Same
PCT:
PCT/US2020/060823 ↗
Wireless Telemetry for Instrumented Component
Wireless Telemetry Circuit Structure for Measuring Temperature in High Temperature Environments
Printed Circuit Board for Harsh Environments
Low-Loss Noise-Resistant High-Temperature Gate Driver Circuits
Patent:
7,965,522 →
Application:
12/586,729 →
Semiconductor Device with Protecting Film and Method of Fabricating the Semiconductor Device with Protecting Film
Normally-Off D-Mode Driven Direct Drive Cascode
Patent:
8,228,114 →
Application:
12/924,622 →
Instrumented Component for Wireless Telemetry
Coupled Inductor Output Filter
Patent:
8,427,120 →
Application:
13/068,229 →
Semiconductor Device and Fabrication Method for the Same
High Temperature Half Bridge Gate Driver
Voltage Regulator Circuitry Operable in a High Temperature Environment of a Turbine Engine
Hybrid Load Differential Amplifier Operable in a High Temperature Environment of a Turbine Engine
Chopper Circuitry Operable in a High Temperature Environment of a Turbine Engine
Electronic Circuitry for High-Temperature Environments
Autonomous Temperature Accelerometer Sensor
Patent:
9,435,819 →
Application:
13/872,505 →
Silver Filled Trench Substrate for High Power and/or High Temperature Electronics
Patent:
9,615,452 →
Application:
13/891,720 →
High Temperature Magnetic Amplifiers
Patent:
9,118,289 →
Application:
13/891,787 →
Low Profile High Temperature Double Sided Flip Chip Power Packaging
Patent:
9,275,938 →
Application:
14/016,728 →
High Temperature Equalized Electrical Parasitic Power Packaging Method for Many Paralleled Semiconductor Power Devices
Patent:
9,095,054 →
Application:
14/054,089 →
Method for Reworkable Packaging of High Speed, Low Electrical Parasitic Power Electronics Modules Through Gate Drive Integration
Patent:
9,407,251 →
Application:
14/100,288 →
Apparatus Having Self Healing Liquid Phase Power Connects and Method Thereof
Patent:
9,728,868 →
Application:
14/176,494 →
Step Etched Metal Electrical Contacts
Patent:
9,967,977 →
Application:
14/308,283 →
Multi-Module, Scalable, High Power Density, Radiation-Hardened Power Converter Interface System
Patent:
9,419,448 →
Application:
14/308,308 →
Non Linear Resonant Switch Cell
Patent:
9,559,684 →
Application:
14/309,155 →
Low Profile, Highly Configurable, Current Sharing Paralleled Wide Band Gap Power Device Power Module
Active Energy Recovery Clamping Circuit to Improve the Performance of Power Converters
Patent:
9,647,563 →
Application:
14/634,252 →
Method and Device for a High Temperature Vacuum-Safe Solder Stop Utilizing Laser Processing of Solderable Surfaces for an Electronic Module Assembly
Low Profile, Highly Configurable, Current Sharing Paralleled Wide Band Gap Power Device Power Module
Power Modules Having an Integrated Clamp Circuit and Process Thereof
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
Power Modules Having an Integrated Clamp Circuit and Process Thereof
Method and Device for a High Temperature Vacuum-Safe Solder Resist Utilizing Laser Ablation of Solderable Surfaces for an Electronic Module Assembly
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
Methods and Systems for Matching Both Dynamic and Static Parameters in Dies, Discretes, and/or Modules, and Methods and Systems Based on the Same
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
Power Module Having an Elevated Power Plane with an Integrated Signal Board and Process of Implementing the Same
Methods and Systems for Component Analysis, Sorting, and Sequencing Based on Component Parameters and Devices Utilizing the Methods and Systems
High Power Multilayer Module Having Low Inductance and Fast Switching for Paralleling Power Devices
Power Component Configured for Improving Partial Discharge Performance and System and Process of Implementing the Same
Power Module Having Electrical Interconnections Using Mechanical Fittings and Process of Implementing the Same
Power Module
Patent:
954,667 →
Application:
29/663,171 →
Power Module
Patent:
903,590 →
Application:
29/663,172 →
Housing for a Power Module Assembly
Patent:
954,668 →
Application:
29/676,416 →
Power Module Having Pin Fins
Patent:
942,403 →
Application:
29/710,592 →
Power Module
Patent:
969,740 →
Application:
29/757,360 →
Related Assignments
(16)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 23, 2012
From: OTSUKA, TAKUKAZU; WESTERN, BRYON; PASSMORE, BRANDON; COLE, ZACH
To: ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.; ROHM CO., LTD.
Reel/Frame 028090/0248 →
Assignment of Assignor's Interest
May 23, 2012
From: CILIO, EDGAR
To: ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.
Reel/Frame 028253/0517 →
Assignment of Assignor's Interest
Aug 29, 2012
From: SUBRAMANIAN, RAMESH; KULKARNI, ANAND A.; MITCHELL, DAVID J.; WAITS, ROD
To: SIEMENS ENERGY, INC
Reel/Frame 028871/0101 →
Assignment of Assignor's Interest
Jun 3, 2014
From: SIEMENS INDUSTRIAL TURBOMACHINERY AB
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 033013/0945 →
Assignment of Assignor's Interest
Jun 3, 2014
From: SIEMENS ENERGY, INC.
To: SIEMENS INDUSTRIAL TURBOMACHINERY AB
Reel/Frame 033014/0091 →
Corrective Assignment to Correct the Docket # from 2011P01674US Previously Recorded on Reel 033013 Frame 0945. Assignor(S) Hereby Confirms the Assignment.
Jun 20, 2014
From: SIEMENS INDUSTRIAL TURBOMACHINERY AB
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 033204/0829 →
Merger and Change of Name
Jul 17, 2015
From: ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.; CREE FAYETTEVILLE, INC.
To: CREE FAYETTEVILLE, INC.
Reel/Frame 036118/0978 →
Merger and Change of Name
Sep 9, 2015
From: ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.; CREE FAYETTEVILLE, INC.
To: CREE FAYETTEVILLE, INC.
Reel/Frame 036522/0649 →
Merger
Mar 10, 2016
From: ARKANSA POWER ELECTRONICS INTERNATIONAL, INC.
To: CREE FAYETTEVILLE, INC.
Reel/Frame 037949/0210 →
Change of Name
Feb 14, 2022
From: CREE, INC.
To: WOLFSPEED, INC.
Reel/Frame 059085/0667 →
Security Interest
Jun 30, 2023
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
Reel/Frame 064185/0755 →
Release of Security Interest in Intellectual Property Collateral at Reel/Frame No. 64185/0755
Sep 30, 2025
From: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: WOLFSPEED, INC.
Reel/Frame 072989/0001 →
Notice of Grant of Security Interest in Intellectual Property
Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0588 →
Notice of Grant of Security Interest in Intellectual Property
Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0467 →
Notice of Grant of Security Interest in Intellectual Property
Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0381 →
Notice of Grant of Security Interest in Intellectual Property
Sep 30, 2025
From: WOLFSPEED, INC.
To: U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 072992/0113 →