High power multilayer module having low inductance and fast switching for paralleling power devices
The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
1. A power module, comprising:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal;
a third terminal electrically connected to the at least one power substrate;
a plurality of power devices electrically connected to the at least one power substrate;
a gate-source board electrically connected to the plurality of power devices; and
a temperature sensor arranged within the housing and electrically connected to the gate-source board.
2. The power module of claim 1 ,
wherein the at least one power substrate comprises a metallic surface and/or a conductive surface supporting the plurality of power devices;
wherein the at least one power substrate comprises a portion that does not include the metallic surface and/or the conductive surface; and
wherein the temperature sensor is on the portion of the at least one power substrate that does not include the metallic surface and/or the conductive surface.
3. The power module of claim 1 ,
wherein the gate-source board further comprises a plurality of resistors, each one of the plurality of resistors being electrically connected to one of the plurality of power devices; and
wherein the gate-source board is configured to receive at least one electrical signal.
4. The power module of claim 3 , wherein each one of the plurality of resistors is electrically connected to a gate of one of the plurality of power devices.
5. The power module of claim 3 , wherein each one of the plurality of resistors is electrically connected to a source of one of the plurality of power devices.
6. The power module of claim 3 , wherein the at least one electrical signal comprises a gate driver signal.
7. The power module of claim 3 , wherein the at least one electrical signal comprises a source Kelvin signal.
8. The power module of claim 1 ,
wherein the first terminal comprises a contact surface located above the housing at a first elevation; and
wherein the second terminal comprises a contact surface located above the housing at a second elevation different from the first elevation.
9. A configuration comprising the power module of claim 1 , the configuration further comprising:
at least one component comprising at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor; and
a configuration housing configured to house and enclose the power module and the at least one component.
10. The configuration of claim 9 , further comprising an electrical interface configured to be connected to and exchange data with at least one of the following: the at least one buss bar, the driver, the controller, the at least one capacitor, the cold plate, and the at least one sensor.
11. The configuration of claim 9 , wherein the configuration is configured to test an implementation of the power module for a particular application.
12. The configuration of claim 9 , further comprising a cooling fan configured to move air through the configuration housing.
13. The power module of claim 1 , wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).
14. A power module, comprising:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal;
a third terminal electrically connected to the at least one power substrate;
a plurality of power devices electrically connected to the at least one power substrate;
a gate-source board configured to receive at least one electrical signal; and
the gate-source board further comprising a plurality of resistors, each one of the plurality of resistors being electrically connected to one of the plurality of power devices.
15. The power module of claim 14 , wherein each one of the plurality of resistors is electrically connected to a gate of one of the plurality of power devices.
16. The power module of claim 14 , wherein each one of the plurality of resistors is electrically connected to a source of one of the plurality of power devices.
17. The power module of claim 14 , wherein the at least one electrical signal comprises a gate driver signal.
18. The power module of claim 14 , wherein the at least one electrical signal comprises a source Kelvin signal.
19. The power module of claim 14 , further comprising a temperature sensor arranged within the housing and electrically connected to the gate-source board.
20. The power module of claim 19 ,
wherein the at least one power substrate comprises a metallic surface and/or a conductive surface supporting the plurality of power devices;
wherein the at least one power substrate comprises a portion that does not include the metallic surface and/or the conductive surface; and
wherein the temperature sensor is on the portion of the at least one power substrate that does not include the metallic surface and/or the conductive surface.
21. The power module of claim 14 ,
wherein the first terminal comprises a contact surface located above the housing at a first elevation; and
wherein the second terminal comprises a contact surface located above the housing at a second elevation different from the first elevation.
22. A configuration comprising the power module of claim 14 , the configuration further comprising:
at least one component comprising at least one of the following: at least one buss bar, a driver, a controller, at least one capacitor, a cold plate, and at least one sensor; and
a configuration housing configured to house and enclose the power module and the at least one component.
23. The configuration of claim 22 , further comprising an electrical interface configured to be connected to and exchange data with at least one of the following: the at least one buss bar, the driver, the controller, the at least one capacitor, the cold plate, and the at least one sensor.
24. The configuration of claim 22 , wherein the configuration is configured to test an implementation of the power module for a particular application.
25. The configuration of claim 22 , further comprising a cooling fan configured to move air through the configuration housing.
26. The power module of claim 14 , wherein a total stray inductance value of a critical power switching loop of the power module comprises a range of 12 (nH) to 2 (nH).
27. A power module, comprising:
at least one power substrate;
a housing arranged on the at least one power substrate;
a first terminal electrically connected to the at least one power substrate;
a second terminal;
a third terminal electrically connected to the at least one power substrate; and
a plurality of power devices electrically connected to the at least one power substrate,
wherein the power module is structured, arranged, and configured to reduce inductance, and
wherein the inductance comprises a total stray inductance value of a critical power switching loop of the power module that comprises a range of 12 (nH) to 2 (nH).