High power multilayer module having low inductance and fast switching for paralleling power devices
The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
1. A power module, comprising:
at least one electrically conductive power substrate;
a housing arranged on the at least one electrically conductive power substrate;
a first terminal electrically connected to the at least one electrically conductive power substrate;
the first terminal comprising a contact surface located above the housing at a first elevation;
a second terminal comprising a contact surface located above the housing at a second elevation different from the first elevation;
a third terminal electrically connected to the at least one electrically conductive power substrate;
a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate; and
the third terminal being electrically connected to at least one of the plurality of power devices through the at least one electrically conductive power substrate.
2. The power module of claim 1 , further comprising:
an isolation structure configured to be electrically isolated from the at least one electrically conductive power substrate,
wherein the second terminal is connected to the isolation structure and electrically connected to at least one of the plurality of power devices;
wherein the isolation structure is arranged above and electrically isolated from the at least one electrically conductive power substrate; and
wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one electrically conductive power substrate, a film isolation component arranged on the at least one electrically conductive power substrate, and a suspension isolation construction located in the housing.
3. The power module of claim 1 ,
wherein current flows in a first direction from the first terminal across the at least one electrically conductive power substrate; and
wherein the current flows in a second direction, opposite to the first direction, from the at least one electrically conductive power substrate to the second terminal to reduce impedance.
4. The power module of claim 1 , wherein at least one of the plurality of power devices is further connected to the second terminal and further connected to the first terminal through the at least one electrically conductive power substrate; and
wherein the at least one electrically conductive power substrate comprises at least two electrically conductive power substrates.
5. The power module of claim 1 , further comprising:
a gate-source board mounted relative to the at least one electrically conductive power substrate, the gate-source board electrically connected to the plurality of power devices;
a sensor arranged within the housing and electrically connected to the gate-source board, wherein the sensor comprises at least one of the following: a temperature sensor and an overcurrent sensor; and
the first terminal being electrically connected to at least one of the plurality of power devices through the at least one electrically conductive power substrate.
6. A system comprising the power module of claim 1 , and further comprising:
a first buss bar electrically connected to the first terminal; and
a second buss bar electrically connected to the second terminal,
wherein the first buss bar and the second buss bar are arranged one above the other;
wherein current flows in a first direction through the first buss bar, to the first terminal across the at least one electrically conductive power substrate; and
wherein the current flows in a second direction, opposite to the first direction, from the at least one electrically conductive power substrate to the second terminal and then through the second buss bar to reduce impedance.
7. The system of claim 6 ,
wherein the first buss bar is positioned to connect to the first terminal at the first elevation;
wherein the second buss bar is positioned to connect to the second terminal at the second elevation; and
wherein the first buss bar and the second buss bar are laminated together.
8. A system comprising the power module of claim 1 , and further comprising:
a phase output buss bar configured to be connected to the third terminal; and
a current sensing component arranged with the phase output buss bar.
9. A system comprising the power module of claim 1 , and further comprising:
a gate driver module configured to be integrated with the power module; and
the gate driver module comprising at least one of the following: one or more of control signal connectors, an isolated power supply, a signal isolation and conditioning device, an amplifier stage, a bulk gate resistor and local current filter, sensor and protection components, a power module signal connector, and creepage extension slots.
10. A system comprising a plurality of the power modules of claim 1 ,
wherein the plurality of power modules are configured in a topology; and
wherein the topology forms at least one of the following: a half-bridge configuration, a full-bridge configuration, a common source configuration, a common drain configuration, a neutral point clamp configuration, and a three phase configuration.
11. A system that includes a power module, comprising:
at least one electrically conductive power substrate;
a housing arranged on the at least one electrically conductive power substrate;
a first terminal electrically connected to the at least one electrically conductive power substrate;
a second terminal;
a third terminal electrically connected to the at least one electrically conductive power substrate;
a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate;
the third terminal being electrically connected to at least one of the plurality of power devices through the at least one electrically conductive power substrate;
a first planar buss bar electrically connected to the first terminal; and
a second planar buss bar electrically connected to the second terminal,
wherein the first planar buss bar and the second planar buss bar are arranged one above the other.
12. The system comprising the power module of claim 11
wherein current flows in a first direction through the first planar buss bar, to the first terminal across the at least one electrically conductive power substrate; and
wherein the current flows in a second direction from the at least one electrically conductive power substrate to the second terminal and then through the second planar buss bar to reduce impedance.
13. The system of claim 11 ,
wherein the first planar buss bar is positioned to connect to the first terminal at a first elevation;
wherein the second planar buss bar is positioned to connect to the second terminal at a second elevation; and
wherein the first planar buss bar and the second planar buss bar are laminated together.
14. The system of claim 11 ,
wherein at least one of the plurality of power devices is further connected to the second terminal and further connected to the first terminal through the at least one electrically conductive power substrate; and
wherein the at least one electrically conductive power substrate comprises at least two power substrates.
15. The system of claim 11 , further comprising:
a gate-source board mounted relative to the at least one electrically conductive power substrate, the gate-source board electrically connected to the plurality of power devices; and
a sensor arranged within the housing and electrically connected to the gate-source board, wherein the sensor comprises at least one of the following: a temperature sensor and an overcurrent sensor.
16. The system of claim 11 , further comprising:
an isolation structure configured to be electrically isolated from the at least one electrically conductive power substrate,
wherein the second terminal is connected to the isolation structure and electrically connected to at least one of the plurality of power devices;
wherein the isolation structure is arranged above and electrically isolated from the at least one electrically conductive power substrate; and
wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one electrically conductive power substrate, a film isolation component arranged on the at least one electrically conductive power substrate, and a suspension isolation construction located in the housing.
17. A power module, comprising:
at least one electrically conductive power substrate;
a housing arranged on the at least one electrically conductive power substrate;
a first terminal electrically connected to the at least one electrically conductive power substrate;
a second terminal;
a third terminal electrically connected to the at least one electrically conductive power substrate;
a plurality of power devices arranged on and connected to the at least one electrically conductive power substrate; and
the third terminal being electrically connected to at least one of the plurality of power devices through the at least one electrically conductive power substrate,
wherein current flows in a first direction from the first terminal across the at least one electrically conductive power substrate; and
wherein the current flows in a second direction, opposite to the first direction, from the at least one electrically conductive power substrate to the second terminal to reduce impedance.
18. The power module of claim 17 , further comprising:
an isolation structure configured to be electrically isolated from the at least one electrically conductive power substrate,
wherein the second terminal is connected to the isolation structure and electrically connected to at least one of the plurality of power devices;
wherein the isolation structure is arranged above and electrically isolated from the at least one electrically conductive power substrate; and
wherein the isolation structure comprises at least one of the following: an embedded isolation component located in the housing, a secondary power substrate arranged on the at least one electrically conductive power substrate, a film isolation component arranged on the at least one electrically conductive power substrate, and a suspension isolation construction located in the housing.
19. A system comprising the power module of claim 17 , and further comprising:
a first buss bar electrically connected to the first terminal; and
a second buss bar electrically connected to the second terminal,
wherein the first buss bar and the second buss bar are arranged one above the other;
wherein the current flows in the first direction through the first buss bar, to the first terminal across the at least one electrically conductive power substrate; and
wherein the current flows in the second direction, opposite the first direction, from the at least one electrically conductive power substrate to the second terminal and then through the second buss bar to reduce impedance.
20. The system of claim 19 ,
wherein the first buss bar is positioned to connect to the first terminal at a first elevation;
wherein the second buss bar is positioned to connect to the second terminal at a second elevation, which is different from the first elevation; and
wherein the first buss bar and the second buss bar are laminated together.