Low profile, highly configurable, current sharing paralleled wide band gap power device power module
A method of making a power module includes providing a base plate defining a topology pattern, providing a power substrate above the base plate, providing at least two power contacts and arranging solder catches in the at least two power contacts, soldering the at least two power contacts to the power substrate utilizing the solder catches, and securing a housing to the power substrate.
1. A power module apparatus, comprising:
a base plate defining a topology pattern;
a power substrate positioned above the base plate;
at least two power contacts, each of the at least two power contacts electrically connected to the power substrate; and
a housing secured to the power substrate,
wherein the power module comprises a height that is less than 20 mm.
2. The power module according to claim 1 , wherein the height is at least three times thinner than prior art power modules.
3. The power module according to claim 1 wherein the height is 10 mm or less.
4. The power module according to claim 1 further comprising solder catches arranged on the at least two power contacts,
wherein the at least two power contacts are soldered to the power substrate through the solder catches.
5. The power module according to claim 1 further comprising:
a gate and source board provided above the power substrate;
gate drive connectors electrically connected to the gate and source board;
at least two parallel shared current path power devices electrically connected to the at least two power contacts; and
the gate drive connectors and the at least two power contacts are configured to extend through the housing.
6. The power module according to claim 5 wherein the gate and source board comprises a plurality of interconnection channels being configured in one of a plurality of positions to provide a plurality of power module configurations.
7. The power module according to claim 1 wherein the power module is configured to implement at least one of a plurality of power electronic topologies including at least one of the following: a half bridge, a common source, and a common drain.
8. The power module according to claim 1
wherein the power module is configured to receive one of a plurality of different gate and source board configurations; and
wherein each one of the plurality of different gate and source board configurations comprise a different configuration of a plurality of interconnection channels.
9. The power module according to claim 1 wherein the power module is configured to utilize up to 60% of a total footprint area for conduction of power.
10. The power module according to claim 1 further comprising a plurality of power devices,
wherein the plurality of power devices are evenly spaced across the power substrate.
11. A power module apparatus, comprising:
a base plate defining a topology pattern;
a power substrate positioned above the base plate;
at least two power contacts, each of the at least two power contacts electrically connected to the power substrate;
solder catches arranged on the at least two power contacts; and
a housing secured to the power substrate.
12. The power module according to claim 11 wherein the power module comprises a height that is at least two times thinner than prior art power modules.
13. The power module according to claim 11 wherein the at least two power contacts are soldered to the power substrate through the solder catches.
14. The power module according to claim 11 further comprising:
a gate and source board provided above the power substrate;
gate drive connectors electrically connected to the gate and source board;
at least two parallel shared current path power devices electrically connected to the at least two power contacts; and
the gate drive connectors and the at least two power contacts are configured to extend through the housing.
15. The power module according to claim 11 wherein the power module is configured to implement at least one of a plurality of power electronic topologies including at least one of the following: a half bridge, a common source, and a common drain.
16. The power module according to claim 11
wherein the power module is configured to receive one of a plurality of different gate and source board configurations; and
wherein each one of the plurality of different gate and source board configurations comprise a different configuration of a plurality of interconnection channels.
17. The power module according to claim 11 wherein the power module is configured to utilize up to 60% of a total footprint area for conduction of power.
18. The power module according to claim 11 further comprising a plurality of power devices,
wherein the plurality of power devices are evenly spaced across the power substrate.
19. A power module apparatus, comprising:
a base plate defining a topology pattern;
a power substrate positioned above the base plate;
at least two power contacts, each of the at least two power contacts electrically connected to the power substrate; and
a housing secured to the power substrate,
wherein each of the at least two power contacts comprise a bonding surface, a body portion connected to the bonding surface through a first bent portion, and a contact connected to the bonding surface through a second bent portion.
20. The power module according to claim 19 wherein the power module comprises a height that is at least two times thinner than prior art power modules.
21. The power module according to claim 19 wherein the power module comprises a height of 10 mm or less.
22. The power module according to claim 19 further comprising:
a gate and source board provided above the power substrate;
gate drive connectors electrically connected to the gate and source board;
at least two parallel shared current path power devices electrically connected to the at least two power contacts; and
the gate drive connectors and the at least two power contacts are configured to extend through the housing.
23. The power module according to claim 19
wherein the power module is configured to receive one of a plurality of different gate and source board configurations; and
wherein each one of the plurality of different gate and source board configurations comprise a different configuration of a plurality of interconnection channels.
24. The power module according to claim 19 wherein the power module is configured to utilize up to 60% of a total footprint area for conduction of power.
25. The power module according to claim 19 further comprising a plurality of power devices,
wherein the plurality of power devices are evenly spaced across the power substrate.
26. A power module apparatus, comprising:
a base plate defining a topology pattern;
a power substrate provided above the base plate;
at least two power contacts electrically connecting to the power substrate; and
a housing secured to the power substrate,
wherein the power module comprises a height of 10 mm or less.
27. The power module according to claim 26 wherein the height is at least two times thinner than prior art power modules.
28. The power module according to claim 26 further comprising:
a gate and source board provided above the power substrate;
gate drive connectors electrically connected to the gate and source board; and
at least two parallel shared current path power devices electrically connected to the at least two power contacts,
wherein the gate drive connectors and the at least two power contacts are configured to extend through the housing.